The category is 'Memory'

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  • JESD-609 Code
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  • Memory IC Type
  • Supply Current-Max
  • Supply Current-Max:

    0.61 mA

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Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Factory Lead Time

Package / Case

Surface Mount

Number of Terminals

Access Time-Max

Clock Frequency-Max (fCLK)

Data Rate Architecture

Ihs Manufacturer

Interface Type

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Clock Rate

Maximum Operating Supply Voltage

Maximum Operating Temperature

Minimum Operating Supply Voltage

Minimum Operating Temperature

Moisture Sensitivity Levels

Mounting

Mounting Styles

Number of I/O Lines

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Supplier Package

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom (Vsup)

Timing Type

Typical Operating Supply Voltage

Usage Level

Operating Temperature

Series

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Pin Count

JESD-30 Code

Qualification Status

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Memory Size

Number of Ports

Operating Mode

Supply Current-Max

Architecture

Organization

Output Characteristics

Seated Height-Max

Memory Width

Address Bus Width

Density

Standby Current-Max

Memory Density

Screening Level

Parallel/Serial

I/O Type

Memory IC Type

Standby Voltage-Min

Length

Width

Radiation Hardening

CYD09S18V18-167BBI

Mfr Part No

CYD09S18V18-167BBI

Cypress Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

256

11 ns

167 MHz

CYPRESS SEMICONDUCTOR CORP

3

524288 words

512000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Obsolete

BGA

No

1.5 V

e0

No

3A991.B.2.A

Tin/Lead (Sn/Pb)

PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V

8542.32.00.41

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

NOT SPECIFIED

256

S-PBGA-B256

Not Qualified

1.58 V

INDUSTRIAL

1.42 V

2

SYNCHRONOUS

0.61 mA

512KX18

3-STATE

1.7 mm

18

0.22 A

9437184 bit

PARALLEL

COMMON

MULTI-PORT SRAM

1.4 V

17 mm

17 mm

GS8662Q18BD-200I

Mfr Part No

GS8662Q18BD-200I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-165

YES

165

0.45 ns

200 MHz

QDR

GSI TECHNOLOGY

Parallel

GSI Technology

GS8662Q18BD-200I

200 MHz

200 MHz

1.9 V

+ 85 C

1.7 V

- 40 C

Surface Mount

SMD/SMT

18 Bit

4 MWords

4000000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA165,11X15,40

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.34

Compliant

No

FBGA

1.9 V

1.7 V

1.8 V

Synchronous

1.8000 V

Industrial grade

-40 to 100 °C

GS8662Q18BD

e0

No

3A991.B.2.B

Tin/Lead (Sn/Pb)

100 °C

-40 °C

PIPELINED ARCHITECTURE

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

1.8 V

1.9 V

1.5/1.8,1.8 V

INDUSTRIAL

1.7 V

72 Mbit

2

SYNCHRONOUS

0.61 mA

Pipelined

4MX18

3-STATE

1.4 mm

18

21 Bit

72 Mbit

75497472 bit

Industrial

PARALLEL

SEPARATE

QDR SRAM

1.7 V

15 mm

13 mm

No