The category is 'Memory'
Memory (3)
- All Manufacturers
- Access Time-Max
- Clock Frequency-Max (fCLK)
- ECCN Code
- HTS Code
- I/O Type
- Ihs Manufacturer
- JESD-30 Code
- Length
- Manufacturer
- Manufacturer Part Number
- Memory IC Type
- Supply Current-Max
- Supply Current-Max:
0.69 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Clock Frequency-Max (fCLK) | Data Rate Architecture | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Clock Rate | Maximum Operating Supply Voltage | Memory Types | Mfr | Minimum Operating Supply Voltage | Mounting | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Nom (Vsup) | Timing Type | Typical Operating Supply Voltage | Operating Temperature | Series | Pbfree Code | ECCN Code | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Clock Frequency | Supply Current-Max | Memory Format | Memory Interface | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Memory Organization | Length | Width | Radiation Hardening |
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 | Mfr Part No UPD44325182BF5-E33-FQ1-A | Renesas Electronics America | Datasheet | - | - | Min: 1 Mult: 1 | YES | 165 | 0.45 ns | 300 MHz | RENESAS ELECTRONICS CORP | Renesas Electronics Corporation | UPD44325182BF5-E33-FQ1-A | 2097152 words | 2000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | 5.77 | Yes | 1.8 V | 3A991 | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 1 | 1 mm | unknown | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | SYNCHRONOUS | 0.69 mA | 2MX18 | 3-STATE | 1.46 mm | 18 | 0.32 A | 37748736 bit | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 17 mm | 15 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No UPD44165362BF5-E40-EQ3-A | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | YES | 165 | 0.45 ns | 250 MHz | RENESAS ELECTRONICS CORP | Renesas Electronics Corporation | UPD44165362BF5-E40-EQ3-A | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | NOT SPECIFIED | 5.84 | Non-Compliant | Yes | 1.8 V | Yes | 3A991.B.2.A | 70 °C | 0 °C | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.8 V | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 2 | SYNCHRONOUS | 0.69 mA | 512KX36 | 3-STATE | 1.46 mm | 36 | 18 b | 18 Mb | 0.33 A | 18874368 bit | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 15 mm | 13 mm | No | ||||||||||||||||||||||||||||
| Mfr Part No UPD44325362BF5-E40-FQ1-A | Renesas | Datasheet | 21 |
| Min: 1 Mult: 1 | 1 Week | Surface Mount | 165-FBGA | YES | 165-FBGA (15x17) | 165 | 0.45 ns | UPD44325362 | 250 MHz | QDR | RENESAS ELECTRONICS CORP | Renesas Electronics Corporation | UPD44325362BF5-E40-FQ1-A | 250 MHz | 1.9 V | Volatile | Renesas Electronics America Inc | 1.7 V | Surface Mount | 36 Bit | 1 MWords | 1000000 | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | Obsolete | 5.73 | Yes | BGA | 1.8 V | Synchronous | 1.8000 V | 0 to 70 °C | - | 3A991 | 8542.32.00.41 | SRAMs | SRAM - Synchronous, QDR II | 1.7V ~ 1.9V | BOTTOM | BALL | 1 | 1 mm | unknown | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 36Mbit | 2 | SYNCHRONOUS | 250 MHz | 0.69 mA | SRAM | Parallel | 1MX36 | 3-STATE | 1.46 mm | 36 | 4ns | 19 Bit | 36 Mbit | 0.33 A | 37748736 bit | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1M x 36 | 17 mm | 15 mm |