The category is 'Memory'

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  • Supply Current-Max
  • Supply Current-Max:

    0.73 mA

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Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Factory Lead Time

Package / Case

Surface Mount

Number of Terminals

Access Time-Max

Clock Frequency-Max (fCLK)

Data Rate Architecture

Ihs Manufacturer

Interface Type

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Clock Rate

Maximum Operating Supply Voltage

Maximum Operating Temperature

Minimum Operating Supply Voltage

Minimum Operating Temperature

Mounting

Mounting Styles

Number of I/O Lines

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

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Package Code

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Package Equivalence Code

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Package Style

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Part Package Code

Reflow Temperature-Max (s)

Risk Rank

Rohs Code

Supplier Package

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom (Vsup)

Timing Type

Typical Operating Supply Voltage

Usage Level

Operating Temperature

Series

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

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HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Memory Size

Number of Ports

Operating Mode

Supply Current-Max

Architecture

Organization

Output Characteristics

Seated Height-Max

Memory Width

Address Bus Width

Density

Standby Current-Max

Memory Density

Screening Level

Parallel/Serial

I/O Type

Memory IC Type

Standby Voltage-Min

Length

Width

GS8662Q18BD-250I

Mfr Part No

GS8662Q18BD-250I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-165

YES

165

0.45 ns

250 MHz

QDR

GSI TECHNOLOGY

Parallel

GSI Technology

GS8662Q18BD-250I

250 MHz

250 MHz

1.9 V

+ 85 C

1.7 V

- 40 C

Surface Mount

SMD/SMT

18 Bit

4 MWords

4000000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA165,11X15,40

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.19

No

FBGA

1.9 V

1.7 V

1.8 V

Synchronous

1.8000 V

Industrial grade

-40 to 100 °C

GS8662Q18BD

e0

No

3A991.B.2.B

Tin/Lead (Sn/Pb)

PIPELINED ARCHITECTURE

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

1.9 V

1.5/1.8,1.8 V

INDUSTRIAL

1.7 V

72 Mbit

2

SYNCHRONOUS

0.73 mA

Pipelined

4MX18

3-STATE

1.4 mm

18

21 Bit

72 Mbit

75497472 bit

Industrial

PARALLEL

SEPARATE

QDR SRAM

1.7 V

15 mm

13 mm

GS8342T06BD-500

Mfr Part No

GS8342T06BD-500

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

10 Weeks

BGA-165

YES

165

0.45 ns

500 MHz

DDR

GSI TECHNOLOGY

Parallel

GSI Technology

GS8342T06BD-500

500 MHz

500 MHz

1.9 V

+ 70 C

1.7 V

0 C

Surface Mount

SMD/SMT

8 Bit

4 MWords

4000000

70 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA165,11X15,40

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.36

No

FBGA

1.9 V

1.7 V

1.8 V

Synchronous

1.8000 V

Commercial grade

0 to 85 °C

GS8342T06BD

e0

3A991.B.2.B

Tin/Lead (Sn/Pb)

PIPELINED ARCHITECTURE

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

1.9 V

1.5/1.8,1.8 V

COMMERCIAL

1.7 V

36 Mbit

1

SYNCHRONOUS

0.73 mA

Pipelined

4MX8

3-STATE

1.4 mm

8

21 Bit

36 Mbit

0.24 A

33554432 bit

Commercial

PARALLEL

COMMON

DDR SRAM

1.7 V

15 mm

13 mm