The category is 'Memory'
Memory (1)
- All Manufacturers
- Absolute Pull Range (APR)
- Access Time-Max
- Additional Feature
- Base Resonator
- Clock Frequency-Max (fCLK)
- Current - Supply (Disable) (Max)
- Current - Supply (Max)
- ECCN Code
- Factory Lead Time
- Frequency
- Function
- Supply Current-Max
- Supply Current-Max:
0.835 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Risk Rank | Rohs Code | Supply Voltage-Nom (Vsup) | Operating Temperature | Packaging | Series | Size / Dimension | Part Status | ECCN Code | Type | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Output | Pin Count | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Current - Supply (Disable) (Max) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Absolute Pull Range (APR) | Standby Voltage-Min | Height Seated (Max) | Length | Width | Ratings |
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![]() | Mfr Part No GS8342Q36BD-250IT | GSI | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 4-SMD, No Lead | YES | 165 | 0.45 ns | 250 MHz | GSI TECHNOLOGY | GSI Technology | GS8342Q36BD-250IT | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | 5.36 | No | 1.8 V | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | 3A991.B.2.B | XO (Standard) | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | 2.5V | BOTTOM | BALL | 1 | 1 mm | compliant | 20MHz | ±10ppm | LVCMOS, LVTTL | 165 | R-PBGA-B165 | Standby (Power Down) | MEMS | 33mA | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 70µA | SYNCHRONOUS | 0.835 mA | 1MX36 | 3-STATE | 1.4 mm | 36 | 0.215 A | 37748736 bit | PARALLEL | SEPARATE | QDR SRAM | -- | 1.7 V | 0.039 (1.00mm) | 15 mm | 13 mm | -- |

