The category is 'Memory'

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  • Access Time-Max
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  • Address Bus Width
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  • ECCN Code
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  • HTS Code
  • Ihs Manufacturer
  • Supply Current-Max
  • Supply Current-Max:

    1.06 mA

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Factory Lead Time

Package / Case

Surface Mount

Number of Terminals

Access Time-Max

Clock Frequency-Max (fCLK)

Data Rate Architecture

Ihs Manufacturer

Interface Type

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Clock Rate

Maximum Operating Supply Voltage

Maximum Operating Temperature

Minimum Operating Supply Voltage

Minimum Operating Temperature

Moisture Sensitivity Levels

Mounting

Mounting Styles

Number of I/O Lines

Number of Words

Number of Words Code

Operating Temperature-Max

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Reflow Temperature-Max (s)

Risk Rank

Rohs Code

Supplier Package

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom (Vsup)

Timing Type

Typical Operating Supply Voltage

Usage Level

Operating Temperature

Series

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Memory Size

Number of Ports

Operating Mode

Supply Current-Max

Architecture

Organization

Output Characteristics

Seated Height-Max

Memory Width

Address Bus Width

Density

Standby Current-Max

Memory Density

Screening Level

Parallel/Serial

I/O Type

Memory IC Type

Standby Voltage-Min

Length

Width

GS8662Q37BGD-300

Mfr Part No

GS8662Q37BGD-300

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

14 Weeks, 1 Day

BGA-165

YES

165

0.45 ns

300 MHz

QDR

GSI TECHNOLOGY

Parallel

GSI Technology

GS8662Q37BGD-300

300 MHz

300 MHz

1.9 V

+ 70 C

1.7 V

0 C

3

Surface Mount

SMD/SMT

36 Bit

2 MWords

2000000

70 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA165,11X15,40

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

1.93

Yes

FBGA

1.9 V

1.7 V

1.8 V

Synchronous

1.8000 V

Commercial grade

0 to 85 °C

GS8662Q37BGD

e1

Yes

3A991.B.2.B

Tin/Silver/Copper (Sn/Ag/Cu)

PIPELINED ARCHITECTURE

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

260

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

1.9 V

1.5/1.8,1.8 V

COMMERCIAL

1.7 V

72 Mbit

2

SYNCHRONOUS

1.06 mA

Pipelined

2MX36

3-STATE

1.4 mm

36

20 Bit

72 Mbit

0.255 A

75497472 bit

Commercial

PARALLEL

SEPARATE

DDR SRAM

1.7 V

15 mm

13 mm