The category is 'Memory'

  • All Manufacturers
  • Organization
  • Supply Current-Max
  • Access Time
  • Base Product Number
  • Data Retention
  • Interface Type
  • Maximum Clock Frequency
  • Maximum Operating Temperature
  • Memory Format
  • Memory Interface
  • Memory Organization
  • Memory Size
  • Supply Current-Max:

    1.2 mA

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Mount

Mounting Type

Package / Case

Surface Mount

Supplier Device Package

Material

Number of Terminals

Access Time-Max

Base Product Number

Clock Frequency-Max (fCLK)

Data Retention

Ihs Manufacturer

Interface Type

Maximum Clock Frequency

Maximum Operating Temperature

Memory Types

Mfr

Minimum Operating Temperature

Mounting Styles

MSL

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Product Status

RoHS

Rohs Code

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom (Vsup)

Voltage, Rating

Operating Temperature

Series

Tolerance

Termination

ECCN Code

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Capacitance

Technology

Voltage - Supply

Terminal Position

Terminal Form

Number of Functions

Terminal Pitch

Depth

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Lead Pitch

Dielectric

Failure Rate

Supply Voltage-Max (Vsup)

Temperature Grade

Supply Voltage-Min (Vsup)

Memory Size

Operating Mode

Clock Frequency

Supply Current-Max

Access Time

Memory Format

Memory Interface

Organization

Output Characteristics

Seated Height-Max

Memory Width

Write Cycle Time - Word, Page

Standby Current-Max

Memory Density

Parallel/Serial

I/O Type

Memory IC Type

Standby Voltage-Min

Features

Memory Organization

Height

Height Seated (Max)

Length

Width

Length (mm)

Radiation Hardening

DS28E07 T

Mfr Part No

DS28E07 T

Analog Devices Datasheet

28800
In Stock

-

Min: 1

Mult: 1

Through Hole

TO-226-3, TO-92-3 (TO-226AA) Formed Leads

TO-92-3

DS28E07

10 Year

1-Wire

-

+ 85 C

Non-Volatile

Analog Devices Inc./Maxim Integrated

- 40 C

Through Hole

Tape & Reel (TR)

Active

5.25 V

3 V

-40°C ~ 85°C (TA)

-

EEPROM

3V ~ 5.25V

1Kbit

1.2 mA

2 µs

EEPROM

1-Wire®

256 x 4

-

256 x 4

DS28E07P T

Mfr Part No

DS28E07P T

Analog Devices Datasheet

12000
In Stock

Min: 1

Mult: 1

Surface Mount

6-SMD, J-Lead

6-TSOC

DS28E07

10 Year

1-Wire

-

+ 85 C

Non-Volatile

Analog Devices Inc./Maxim Integrated

- 40 C

SMD/SMT

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Active

5.25 V

3 V

-40°C ~ 85°C (TA)

-

EEPROM

3V ~ 5.25V

1Kbit

1.2 mA

2 µs

EEPROM

1-Wire®

256 x 4

-

256 x 4

DS28E07

Mfr Part No

DS28E07

Analog Devices Datasheet

800
In Stock

-

Min: 1

Mult: 1

Through Hole

TO-226-3, TO-92-3 (TO-226AA)

TO-92-3

Alloy Steel

DS28E07

10 Year

1-Wire

-

+ 85 C

Non-Volatile

Analog Devices Inc./Maxim Integrated

- 40 C

Through Hole

MSL 1 - Unlimited

Bulk

Active

5.25 V

3 V

-40°C ~ 85°C (TA)

-

EEPROM

3V ~ 5.25V

1Kbit

-

1.2 mA

2 µs

EEPROM

1-Wire®

256 x 4

-

256 x 4

380

DS28E07P

Mfr Part No

DS28E07P

Analog Devices Datasheet

5
In Stock

Min: 1

Mult: 1

Surface Mount

6-SMD, J-Lead

6-TSOC

DS28E07

10 Year

1-Wire

-

+ 85 C

Non-Volatile

Analog Devices Inc./Maxim Integrated

- 40 C

SMD/SMT

MSL 1 - Unlimited

Tube

Active

5.25 V

3 V

-40°C ~ 85°C (TA)

-

EEPROM

3V ~ 5.25V

1Kbit

-

1.2 mA

2 µs

EEPROM

1-Wire®

256 x 4

-

256 x 4

DS28E07Q T

Mfr Part No

DS28E07Q T

Analog Devices Datasheet

779
In Stock

-

Min: 1

Mult: 1

Through Hole

Surface Mount

6-WDFN Exposed Pad

6-TDFN (3x3)

DS28E07

10 Year

1-Wire

-

+ 85 C

Non-Volatile

Analog Devices Inc./Maxim Integrated

- 40 C

SMD/SMT

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Active

Compliant

5.25 V

3 V

200 V

-40°C ~ 85°C (TA)

-

10 %

Radial

125 °C

-55 °C

27 pF

EEPROM

3V ~ 5.25V

2.34 mm

8.255 mm

C0G

0.01 %

1Kbit

1.2 mA

2 µs

EEPROM

1-Wire®

256 x 4

-

Military

256 x 4

3.25 mm

4.445 mm

6.604 mm

2.3368 mm

No

IS61QDP2B22M36A-333B4I

Mfr Part No

IS61QDP2B22M36A-333B4I

Integrated Silicon Solution Inc Datasheet

-

-

Min: 1

Mult: 1

YES

165

0.45 ns

333 MHz

INTEGRATED SILICON SOLUTION INC

2097152 words

2000000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA165,11X15,40

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

No

1.8 V

3A991.B.2.A

PIPELINED ARCHITECTURE

8542.32.00.41

BOTTOM

BALL

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

1.89 V

INDUSTRIAL

1.71 V

SYNCHRONOUS

1.2 mA

2MX36

3-STATE

1.4 mm

36

0.29 A

75497472 bit

PARALLEL

SEPARATE

QDR SRAM

1.7 V

15 mm

13 mm

IS61QDP2B22M36A-333B4LI

Mfr Part No

IS61QDP2B22M36A-333B4LI

Integrated Silicon Solution Inc Datasheet

-

-

Min: 1

Mult: 1

YES

165

0.45 ns

333 MHz

INTEGRATED SILICON SOLUTION INC

2097152 words

2000000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA165,11X15,40

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

Yes

1.8 V

3A991.B.2.A

PIPELINED ARCHITECTURE

8542.32.00.41

BOTTOM

BALL

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

1.89 V

INDUSTRIAL

1.71 V

SYNCHRONOUS

1.2 mA

2MX36

3-STATE

1.4 mm

36

0.29 A

75497472 bit

PARALLEL

SEPARATE

QDR SRAM

1.7 V

15 mm

13 mm