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The category is 'Memory'

Memory (6)

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Supply Current-Max
Clock Frequency
Data Retention
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Maximum Clock Frequency
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Supply Current-Max:
1.7 mA

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Mounting Type	Package / Case	Surface Mount	Supplier Device Package	Material	Number of Terminals	Access Time-Max	Base Product Number	Clock Frequency-Max (fCLK)	Data Retention	Diameter after shrinkage	Diameter before shrinkage	Diameter of protected wire (cable)	Gross weight	Ihs Manufacturer	Interface Type	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Temperature	Mounting Styles	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Transport packaging size/quantity	Voltage Rated	Wall thickness after shrinkage	Wall thickness before shrinkage	Operating Temperature	Packaging	Series	Size / Dimension	Tolerance	ECCN Code	Temperature Coefficient	Type	Color	Applications	HTS Code	Capacitance	Technology	Voltage - Supply	Terminal Position	Terminal Form	Terminal Pitch	Reach Compliance Code	JESD-30 Code	Qualification Status	Working voltage	Failure Rate	Lead Spacing	Temperature Grade	Memory Size	Lead Style	Clock Frequency	Supply Current-Max	Access Time	Memory Format	Memory Interface	Organization	Output Characteristics	Memory Width	Write Cycle Time - Word, Page	Operating temperature range	Standby Current-Max	Memory Density	I/O Type	Memory IC Type	Shrink temperature	Refresh Cycles	Features	Memory Organization	Shrink ratio	Height Seated (Max)	Thickness (Max)	Ratings
	Mfr Part No BR25H640F-5ACE2	ROHM Semiconductor	Datasheet	80 In Stock	-	Min: 1 Mult: 1		Surface Mount	8-SOIC (0.173, 4.40mm Width)		8-SOP						100 Year						SPI	20 MHz	+ 125 C	Non-Volatile	Rohm Semiconductor	- 40 C	SMD/SMT					Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;								Active	5.5 V	1.7 V						-40°C ~ 125°C (TA)		Automotive, AEC-Q100										EEPROM	1.7V ~ 5.5V											64Kbit		20 MHz	1.7 mA		EEPROM	SPI	8192 x 8			3.5ms									8K x 8
	Mfr Part No BR25H128F-5ACE2	ROHM Semiconductor	Datasheet	80 In Stock	-	Min: 1 Mult: 1		Surface Mount	8-SOIC (0.173, 4.40mm Width)		8-SOP						100 Year						I2C	20 MHz	+ 125 C	Non-Volatile	Rohm Semiconductor	- 40 C	SMD/SMT					Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;								Active	5.5 V	1.7 V						-40°C ~ 125°C (TA)		Automotive, AEC-Q100										EEPROM	1.7V ~ 5.5V											128Kbit		20 MHz	1.7 mA		EEPROM	SPI	16384 x 8			3.5ms									16K x 8
	Mfr Part No BR24H128FVT-5ACE2	ROHM Semiconductor	Datasheet	40 In Stock	-	Min: 1 Mult: 1		Surface Mount, MLCC	0805 (2012 Metric)		8-TSSOP-B						100 Year						I2C	1 MHz	+ 125 C	Non-Volatile	Vishay Vitramon	- 40 C	SMD/SMT					Tape & Reel (TR)								Active	5.5 V	1.7 V			100V			-55°C ~ 150°C		GA	0.079 L x 0.049 W (2.00mm x 1.25mm)	±2%		C0G, NP0			Automotive		150 pF	EEPROM	1.7V ~ 5.5V								-	-		128Kbit	-	1 MHz	1.7 mA	120 ns	EEPROM	I²C	16 k x 8			3.5ms								-	16K x 8		-	0.057 (1.45mm)	AEC-Q200
	Mfr Part No BR24H08FVT-5ACE2	ROHM Semiconductor	Datasheet	80 In Stock	-	Min: 1 Mult: 1		Surface Mount	8-TSSOP (0.173, 4.40mm Width)		8-TSSOP-B				120031		100 Year						I2C	1 MHz	+ 125 C	Non-Volatile	Molex	- 40 C	SMD/SMT					Bulk								Active	5.5 V	1.7 V						-40°C ~ 125°C (TA)		*										EEPROM	1.7V ~ 5.5V											8Kbit		1 MHz	1.7 mA		EEPROM	I²C	1 k x 8			3.5ms									1K x 8
	Mfr Part No BR24H64FJ-5ACE2	ROHM Semiconductor	Datasheet	2000 In Stock	-	Min: 1 Mult: 1		Surface Mount	8-SOIC (0.154, 3.90mm Width)		8-SOP-J						100 Year						I2C	1 MHz	+ 125 C	Non-Volatile	Rohm Semiconductor	- 40 C	SMD/SMT					Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;								Active	5.5 V	1.7 V						-40°C ~ 125°C (TA)		Automotive, AEC-Q100										EEPROM	1.7V ~ 5.5V											64Kbit		1 MHz	1.7 mA	120 ns	EEPROM	I²C	8 k x 8			3.5ms									8K x 8
	Mfr Part No W3H32M72E-400SBM	Microsemi Corporation	Datasheet	-	-	Min: 1 Mult: 1				YES		synthetic polyolefin	208	0.6 ns		200 MHz		5.0 mm	10.5 mm	5.2…9.0 mm	1245.00	MICROSEMI CORP								33554432 words	32000000	125 °C	-55 °C		PLASTIC/EPOXY	BGA	BGA, BGA208,11X19,40	BGA208,11X19,40	RECTANGULAR	GRID ARRAY	Transferred				1.8 V	464650/10		0.6 mm	0.3 mm		spool 100 m				EAR99		Heat shrink tubing without adhesive	black		8542.32.00.36				BOTTOM	BALL	1 mm	compliant	R-PBGA-B208	Not Qualified	600 V			MILITARY				1.7 mA				32MX72	3-STATE	72		-55…+125 °C	0.035 A	2415919104 bit	COMMON	DDR DRAM MODULE	+70…+120 °C	8192			2 : 1