The category is 'Memory'

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  • Access Time
  • Interface Type
  • Maximum Clock Frequency
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  • Supply Current-Max
  • Supply Voltage-Max
  • Supply Voltage-Min
  • Supply Current-Max:

    125 mA, 150 mA

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Part Number

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Datasheet

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RoHS

Factory Lead Time

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Surface Mount

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Access Time-Max

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Data Rate Architecture

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

Interface Type

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Clock Rate

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Maximum Operating Temperature

Memory Types

Minimum Operating Supply Voltage

Minimum Operating Temperature

Moisture Sensitive

Moisture Sensitivity Levels

Mounting

Mounting Styles

Number of I/O Lines

Number of Words

Number of Words Code

Operating Temperature-Max

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Package Description

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Part Life Cycle Code

Part Package Code

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

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Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom (Vsup)

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Tradename

Typical Operating Supply Voltage

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Packaging

Series

JESD-609 Code

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Max Operating Temperature

Min Operating Temperature

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HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Memory Size

Number of Ports

Operating Mode

Supply Current-Max

Access Time

Architecture

Organization

Output Characteristics

Seated Height-Max

Memory Width

Address Bus Width

Product Type

Density

Standby Current-Max

Memory Density

Screening Level

Parallel/Serial

I/O Type

Memory IC Type

Standby Voltage-Min

Product Category

Length

Width

Radiation Hardening

GS880E32CGT-200V

Mfr Part No

GS880E32CGT-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

TQFP-100

YES

100

6.5 ns

GSI Technology

66

GSI TECHNOLOGY

Parallel

GSI Technology

GS880E32CGT-200V

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

3

SMD/SMT

32 Bit

262144 words

256000

70 °C

PLASTIC/EPOXY

LQFP

LQFP, QFP100,.63X.87

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

Active

QFP

NOT SPECIFIED

5.38

Details

Yes

TQFP

2.7 V

1.7 V

1.8 V

Synchronous

SyncBurst

1.8, 2.5 V

0 to 70 °C

Tray

GS880E32CGT

e3

Yes

3A991.B.2.B

DCD

PURE MATTE TIN

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

QUAD

GULL WING

260

1

0.65 mm

compliant

100

R-PQFP-G100

Not Qualified

2 V

1.8/2.5 V

COMMERCIAL

1.7 V

9 Mbit

SYNCHRONOUS

125 mA, 150 mA

6.5@Flow-Through/3@P

256 k x 32

3-STATE

1.6 mm

32

SRAM

0.025 A

8

PARALLEL

COMMON

CACHE SRAM

1.7 V

SRAM

20 mm

14 mm

GS881E32CD-200V

Mfr Part No

GS881E32CD-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

GSI Technology

SDR

66

Parallel

GSI Technology

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

32 Bit

256 kWords

FBGA

2.7 V

1.7 V

Synchronous

SyncBurst

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS881E32CD

DCD Pipeline/Flow Through

Memory & Data Storage

165

9 Mbit

4

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 32

18 Bit

SRAM

8 Mbit

Commercial

SRAM

GS880E36CGT-200V

Mfr Part No

GS880E36CGT-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

TQFP-100

YES

100

6.5 ns

GSI Technology

SDR

66

GSI TECHNOLOGY

Parallel

GSI Technology

GS880E36CGT-200V

200 MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

3

Surface Mount

SMD/SMT

36 Bit

256 kWords

256000

70 °C

PLASTIC/EPOXY

LQFP

LQFP, QFP100,.63X.87

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

Active

QFP

NOT SPECIFIED

5.38

Details

Yes

TQFP

2.7 V

1.7 V

1.8 V

Synchronous

SyncBurst

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS880E36CGT

e3

Yes

3A991.B.2.B

DCD

PURE MATTE TIN

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

QUAD

GULL WING

260

1

0.65 mm

compliant

100

R-PQFP-G100

Not Qualified

2 V

1.8/2.5 V

COMMERCIAL

1.7 V

9 Mbit

2

SYNCHRONOUS

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 36

3-STATE

1.6 mm

36

SRAM

9 Mbit

0.025 A

9437184 bit

Commercial

PARALLEL

COMMON

CACHE SRAM

1.7 V

SRAM

20 mm

14 mm

GS88236CD-200V

Mfr Part No

GS88236CD-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

GSI Technology

SDR

66

Parallel

GSI Technology

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

36 Bit

256 kWords

N

FBGA

2.7 V

1.7 V

Synchronous

SyncBurst

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS88236CD

SCD/DCD Pipeline/Flow Through

Memory & Data Storage

165

9 Mbit

4

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 36

18 Bit

SRAM

9 Mbit

Commercial

SRAM

GS881E32CGD-200V

Mfr Part No

GS881E32CGD-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

GSI Technology

SDR

66

Parallel

GSI Technology

200 MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

32 Bit

256 kWords

Details

FBGA

2.7 V

1.7 V

Synchronous

SyncBurst

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS881E32CGD

DCD Pipeline/Flow Through

Memory & Data Storage

165

9 Mbit

4

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 32

SRAM

8 Mbit

Commercial

SRAM

GS88132CGT-200V

Mfr Part No

GS88132CGT-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

TQFP-100

GSI Technology

SDR

66

Parallel

GSI Technology

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

32 Bit

256 kWords

Details

TQFP

2.7 V

1.7 V

Synchronous

SyncBurst

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS88132CGT

Synchronous Burst

Memory & Data Storage

100

9 Mbit

1

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 32

18 Bit

SRAM

9 Mbit

Commercial

SRAM

GS881Z36CGD-200V

Mfr Part No

GS881Z36CGD-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-165

YES

165

6.5 ns

GSI Technology

66

GSI TECHNOLOGY

Parallel

GSI Technology

GS881Z36CGD-200V

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

3

SMD/SMT

36 Bit

262144 words

256000

70 °C

PLASTIC/EPOXY

LBGA

LBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.14

Details

Yes

FBGA

2.7 V

1.7 V

1.8 V

NBT SRAM

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS881Z36CGD

e1

Yes

3A991.B.2.B

NBT

Tin/Silver/Copper (Sn/Ag/Cu)

IT ALSO OPERATE WITH 2.5 V, FLOW THROUGH AND PIPELINED ARCHITECTURE

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

260

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

2 V

COMMERCIAL

1.7 V

9 Mbit

SYNCHRONOUS

125 mA, 150 mA

6.5@Flow-Through/3@P

256 k x 36

1.4 mm

36

SRAM

9

Commercial

PARALLEL

ZBT SRAM

SRAM

15 mm

13 mm

GS88036CGT-200V

Mfr Part No

GS88036CGT-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

TQFP-100

YES

100

6.5 ns

GSI Technology

SDR

66

GSI TECHNOLOGY

Parallel

GSI Technology

GS88036CGT-200V

200 MHz

200 MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

3

Surface Mount

SMD/SMT

36 Bit

256 kWords

256000

70 °C

PLASTIC/EPOXY

LQFP

LQFP,

RECTANGULAR

FLATPACK, LOW PROFILE

Active

QFP

NOT SPECIFIED

5.28

Details

Yes

TQFP

2.7 V

1.7 V

1.8 V

Synchronous

SyncBurst

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS88036CGT

e3

Yes

3A991.B.2.B

Synchronous Burst

Matte Tin (Sn)

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

QUAD

GULL WING

260

1

0.65 mm

compliant

100

R-PQFP-G100

Not Qualified

2 V

COMMERCIAL

1.7 V

9 Mbit

4

SYNCHRONOUS

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 36

1.6 mm

36

18 Bit

SRAM

9 Mbit

9437184 bit

Commercial

PARALLEL

CACHE SRAM

SRAM

20 mm

14 mm

GS88136CGD-200V

Mfr Part No

GS88136CGD-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-165

YES

165

6.5 ns

GSI Technology

SDR

66

GSI TECHNOLOGY

Parallel

GSI Technology

GS88136CGD-200V

200 MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

36 Bit

256 kWords

256000

70 °C

PLASTIC/EPOXY

LQFP

LQFP,

RECTANGULAR

GRID ARRAY

Active

BGA

NOT SPECIFIED

5.14

Details

Yes

FBGA

2.7 V

1.7 V

1.8 V

Synchronous

SyncBurst

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS88136CGD

3A991.B.2.B

Synchronous Burst

ALSO OPERATES AT 2.5V

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

2 V

COMMERCIAL

1.7 V

9 Mbit

1

SYNCHRONOUS

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 36

1.4 mm

36

SRAM

9 Mbit

9437184 bit

Commercial

PARALLEL

CACHE SRAM

SRAM

15 mm

13 mm

GS880Z32CGT-200V

Mfr Part No

GS880Z32CGT-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

TQFP-100

66

Parallel

200 MHz

+ 70 C

SDR

0 C

Yes

SMD/SMT

Details

2.7 V

1.7 V

NBT SRAM

GS880Z32CGT

NBT

9 Mbit

125 mA, 150 mA

6.5 ns

256 k x 32

GS84018CGT-166

Mfr Part No

GS84018CGT-166

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

TQFP-100

YES

100

7 ns

72

GSI TECHNOLOGY

Parallel

GS84018CGT-166

166 MHz

+ 70 C

SDR

0 C

Yes

3

SMD/SMT

262144 words

256000

70 °C

PLASTIC/EPOXY

LQFP

LQFP,

RECTANGULAR

FLATPACK, LOW PROFILE

Active

NOT SPECIFIED

5.66

Details

Yes

3.6 V

2.3 V

3.3 V

SyncBurst

Tray

GS84018CGT

3A991.B.2.B

Pipeline/Flow Through

Pure Matte Tin (Sn)

FLOW-THROUGH OR PIPELINED ARCHITECTURE

CMOS

QUAD

GULL WING

260

1

0.65 mm

compliant

R-PQFP-G100

3.6 V

COMMERCIAL

3 V

4 Mbit

SYNCHRONOUS

125 mA, 150 mA

7 ns

256 k x 18

1.6 mm

18

4718592 bit

PARALLEL

CACHE SRAM

20 mm

14 mm

GS881E36CGD-200V

Mfr Part No

GS881E36CGD-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

GSI Technology

SDR

66

Parallel

GSI Technology

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

36 Bit

256 kWords

Compliant

FBGA

2.7 V

1.7 V

Synchronous

SyncBurst

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS881E36CGD

DCD Pipeline/Flow Through

70 °C

0 °C

Memory & Data Storage

165

9 Mbit

4

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 36

18 Bit

SRAM

9 Mbit

Commercial

SRAM

No

GS88132CD-200V

Mfr Part No

GS88132CD-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-165

YES

165

6.5 ns

GSI TECHNOLOGY

Parallel

GSI Technology

GS88132CD-200V

200 MHz

+ 70 C

0 C

SMD/SMT

262144 words

256000

70 °C

PLASTIC/EPOXY

LQFP

LQFP,

RECTANGULAR

GRID ARRAY

Active

BGA

NOT SPECIFIED

5.16

No

2.7 V

1.7 V

1.8 V

GS88132CD

3A991.B.2.B

ALSO OPERATES AT 2.5V

8542.32.00.41

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

2 V

COMMERCIAL

1.7 V

9 Mbit

SYNCHRONOUS

125 mA, 150 mA

6.5 ns

256 k x 32

1.4 mm

32

9

PARALLEL

CACHE SRAM

15 mm

13 mm

GS881Z32CGT-200V

Mfr Part No

GS881Z32CGT-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

TQFP-100

GSI Technology

SDR

66

Parallel

GSI Technology

200 MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

32 Bit

256 kWords

Details

TQFP

2.7 V

1.7 V

Synchronous

NBT SRAM

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS881Z32CGT

NBT

Memory & Data Storage

100

9 Mbit

1

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 32

SRAM

8 Mbit

Commercial

SRAM

GS882Z36CD-200V

Mfr Part No

GS882Z36CD-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

GSI Technology

SDR

66

Parallel

GSI Technology

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

36 Bit

256 kWords

N

FBGA

2.7 V

1.7 V

Synchronous

NBT SRAM

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS882Z36CD

NBT

Memory & Data Storage

165

9 Mbit

4

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 36

18 Bit

SRAM

9 Mbit

Commercial

SRAM

GS880Z36CGT-200V

Mfr Part No

GS880Z36CGT-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

TQFP-100

GSI Technology

SDR

66

Parallel

GSI Technology

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

36 Bit

256 kWords

Details

TQFP

2.7 V

1.7 V

Synchronous

NBT SRAM

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS880Z36CGT

NBT

Memory & Data Storage

100

9 Mbit

1

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 36

18 Bit

SRAM

9 Mbit

Commercial

SRAM

GS88236CGD-200V

Mfr Part No

GS88236CGD-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

GSI Technology

SDR

66

Parallel

GSI Technology

200 MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

36 Bit

256 kWords

Details

FBGA

2.7 V

1.7 V

Synchronous

SyncBurst

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS88236CGD

SCD/DCD Pipeline/Flow Through

Memory & Data Storage

165

9 Mbit

4

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 36

SRAM

9 Mbit

Commercial

SRAM

GS881Z36CGT-200V

Mfr Part No

GS881Z36CGT-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

TQFP-100

YES

100

6.5 ns

SDR

GSI TECHNOLOGY

Parallel

GSI Technology

GS881Z36CGT-200V

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 70 C

1.7, 2.3 V

0 C

3

Surface Mount

SMD/SMT

36 Bit

256 kWords

256000

70 °C

PLASTIC/EPOXY

LQFP

LQFP,

RECTANGULAR

FLATPACK, LOW PROFILE

Active

QFP

NOT SPECIFIED

5.28

Compliant

Yes

TQFP

2.7 V

1.7 V

1.8 V

Synchronous

1.8, 2.5 V

Commercial grade

0 to 70 °C

e3

Yes

3A991.B.2.B

Matte Tin (Sn)

70 °C

0 °C

IT ALSO OPERATE WITH 2.5 V, FLOW THROUGH AND PIPELINED ARCHITECTURE

8542.32.00.41

CMOS

QUAD

GULL WING

260

1

0.65 mm

compliant

100

R-PQFP-G100

Not Qualified

2 V

COMMERCIAL

1.7 V

9 Mbit

1

SYNCHRONOUS

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 36

1.6 mm

36

18 Bit

9 Mbit

9437184 bit

Commercial

PARALLEL

ZBT SRAM

20 mm

14 mm

No

GS882Z36CB-200V

Mfr Part No

GS882Z36CB-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-119

YES

119

6.5 ns

GSI Technology

SDR

42

GSI TECHNOLOGY

Parallel

GSI Technology

GS882Z36CB-200V

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

36 Bit

256 kWords

256000

70 °C

PLASTIC/EPOXY

BGA

BGA,

RECTANGULAR

GRID ARRAY

Active

BGA

NOT SPECIFIED

5.14

N

No

FBGA

2.7 V

1.7 V

1.8 V

Synchronous

NBT SRAM

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS882Z36CB

e0

No

3A991.B.2.B

NBT

Tin/Lead (Sn/Pb)

70 °C

0 °C

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1.27 mm

compliant

119

R-PBGA-B119

Not Qualified

2 V

COMMERCIAL

1.7 V

9 Mbit

4

SYNCHRONOUS

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 36

1.77 mm

36

18 Bit

SRAM

9 Mbit

9437184 bit

Commercial

PARALLEL

ZBT SRAM

SRAM

22 mm

14 mm

No

GS881E36CD-200V

Mfr Part No

GS881E36CD-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-165

YES

165

6.5 ns

GSI Technology

SDR

66

GSI TECHNOLOGY

Parallel

GSI Technology

GS881E36CD-200V

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 70 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

36 Bit

256 kWords

256000

70 °C

PLASTIC/EPOXY

LBGA

LBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.15

No

FBGA

2.7 V

1.7 V

1.8 V

Synchronous

SyncBurst

1.8, 2.5 V

Commercial grade

0 to 70 °C

Tray

GS881E36CD

e0

No

3A991.B.2.B

DCD Pipeline/Flow Through

TIN LEAD

PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

2 V

COMMERCIAL

1.7 V

9 Mbit

4

SYNCHRONOUS

125 mA, 150 mA

6.5 ns

Flow-Through/Pipelined

256 k x 36

1.4 mm

36

18 Bit

SRAM

9 Mbit

9437184 bit

Commercial

PARALLEL

CACHE SRAM

SRAM

15 mm

13 mm