The category is 'Memory'

  • All Manufacturers
  • Access Time
  • Interface Type
  • Maximum Clock Frequency
  • Maximum Operating Temperature
  • Memory Size
  • Minimum Operating Temperature
  • Mounting Styles
  • Organization
  • Package / Case
  • Supply Current-Max
  • Supply Voltage-Max
  • Supply Voltage-Min
  • Supply Current-Max:

    150 mA, 175 mA

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Factory Lead Time

Package / Case

Surface Mount

Number of Terminals

Access Time-Max

Brand

Data Rate Architecture

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

Interface Type

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Clock Rate

Maximum Operating Supply Voltage

Maximum Operating Temperature

Memory Types

Minimum Operating Supply Voltage

Minimum Operating Temperature

Moisture Sensitive

Moisture Sensitivity Levels

Mounting

Mounting Styles

Number of I/O Lines

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Supplier Package

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom (Vsup)

Timing Type

Tradename

Typical Operating Supply Voltage

Usage Level

Operating Temperature

Packaging

Series

JESD-609 Code

Pbfree Code

ECCN Code

Type

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Temperature Grade

Supply Voltage-Min (Vsup)

Memory Size

Number of Ports

Operating Mode

Supply Current-Max

Access Time

Architecture

Organization

Seated Height-Max

Memory Width

Address Bus Width

Product Type

Density

Memory Density

Screening Level

Parallel/Serial

Memory IC Type

Product Category

Length

Width

Radiation Hardening

GS881Z18CGD-200I

Mfr Part No

GS881Z18CGD-200I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

GSI Technology

72

Parallel

GSI Technology

200 MHz

+ 85 C

SDR

- 40 C

Yes

SMD/SMT

Details

3.6 V

2.3 V

NBT SRAM

Tray

GS881Z18CGD

NBT Pipeline/Flow Through

Memory & Data Storage

9 Mbit

150 mA, 175 mA

6.5 ns

512 k x 18

SRAM

SRAM

GS88218CD-200I

Mfr Part No

GS88218CD-200I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

Parallel

200 MHz

+ 85 C

- 40 C

SMD/SMT

3.6 V

2.3 V

9 Mbit

150 mA, 175 mA

6.5 ns

512 k x 18

GS881E18CD-200I

Mfr Part No

GS881E18CD-200I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

GSI Technology

72

Parallel

GSI Technology

200 MHz

+ 85 C

SDR

- 40 C

Yes

SMD/SMT

3.6 V

2.3 V

SyncBurst

Tray

GS881E18CD

DCD Pipeline/Flow Through

Memory & Data Storage

9 Mbit

150 mA, 175 mA

6.5 ns

512 k x 18

SRAM

SRAM

GS88218CGD-200I

Mfr Part No

GS88218CGD-200I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-165

YES

165

6.5 ns

GSI Technology

72

GSI TECHNOLOGY

Parallel

GSI Technology

GS88218CGD-200I

200 MHz

+ 85 C

SDR

- 40 C

Yes

3

SMD/SMT

524288 words

512000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

LBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.13

Details

Yes

3.6 V

2.3 V

2.5 V

SyncBurst

Tray

GS88218CGD

e1

Yes

3A991.B.2.B

Pipeline/Flow Through

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

260

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

2.7 V

INDUSTRIAL

2.3 V

9 Mbit

2

SYNCHRONOUS

150 mA, 175 mA

6.5 ns

512 k x 18

1.4 mm

18

19 b

SRAM

9 Mb

9437184 bit

PARALLEL

CACHE SRAM

SRAM

15 mm

13 mm

No

GS88118CD-200I

Mfr Part No

GS88118CD-200I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

GSI Technology

SDR

72

Parallel

GSI Technology

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2.7, 3.6 V

+ 85 C

SDR

2.3, 3 V

- 40 C

Yes

Surface Mount

SMD/SMT

18 Bit

512 kWords

FBGA

3.6 V

2.3 V

Synchronous

SyncBurst

2.5, 3.3 V

Industrial grade

-40 to 85 °C

Tray

GS88118CD

Pipeline/Flow Through

Memory & Data Storage

165

9 Mbit

1

150 mA, 175 mA

6.5 ns

Flow-Through/Pipelined

512 k x 18

19 Bit

SRAM

9 Mbit

Industrial

SRAM

GS88118CGD-200I

Mfr Part No

GS88118CGD-200I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-165

YES

165

GSI Technology

SDR

72

GSI TECHNOLOGY

Parallel

GSI Technology

GS88118CGD-200I

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2.7, 3.6 V

+ 85 C

SDR

2.3, 3 V

- 40 C

Yes

Surface Mount

SMD/SMT

18 Bit

512 kWords

512000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

LBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

4.81

Details

Yes

FBGA

3.6 V

2.3 V

3.3 V

Synchronous

SyncBurst

2.5, 3.3 V

Industrial grade

-40 to 85 °C

Tray

GS88118CGD

3A991.B.2.B

Pipeline/Flow Through

ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

3.6 V

INDUSTRIAL

3 V

9 Mbit

1

SYNCHRONOUS

150 mA, 175 mA

6.5 ns

Flow-Through/Pipelined

512 k x 18

1.4 mm

18

19 Bit

SRAM

9 Mbit

9437184 bit

Industrial

SERIAL

CACHE SRAM

SRAM

15 mm

13 mm