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The category is 'Memory'

Memory (18)

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Access Time
Interface Type
Maximum Clock Frequency
Maximum Operating Supply Voltage
Maximum Operating Temperature
Memory Size
Minimum Operating Supply Voltage
Minimum Operating Temperature
Mounting Styles
Number of I/O Lines
Organization
Supply Current-Max

Supply Current-Max:
170 mA, 225 mA

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Factory Lead Time	Package / Case	Surface Mount	Number of Terminals	Access Time-Max	Brand	Clock Frequency-Max (fCLK)	Data Rate Architecture	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Clock Rate	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of I/O Lines	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Timing Type	Tradename	Typical Operating Supply Voltage	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Memory Size	Number of Ports	Operating Mode	Supply Current-Max	Access Time	Architecture	Organization	Output Characteristics	Seated Height-Max	Memory Width	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Standby Voltage-Min	Product Category	Length	Width	Radiation Hardening
	Mfr Part No GS88018CGT-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	TQFP-100	YES	100	5 ns	GSI Technology	300 MHz	SDR	36	GSI TECHNOLOGY	Parallel	GSI Technology	GS88018CGT-300I	300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	18 Bit	512 kWords	512000	85 °C	-40 °C	PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Active	QFP	NOT SPECIFIED	5.3	Details	Yes	TQFP	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS88018CGT	e3	Yes	3A991.B.2.B	Pipeline/Flow Through	PURE MATTE TIN			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	QUAD	GULL WING	260	1	0.65 mm	compliant	100	R-PQFP-G100	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V	9 Mbit	2	SYNCHRONOUS	170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18	3-STATE	1.6 mm	18	19 Bit	SRAM	9 Mbit	0.045 A	9437184 bit	Industrial	PARALLEL	COMMON	CACHE SRAM	2.3 V	SRAM	20 mm	14 mm
	Mfr Part No GS881E18CGD-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165				GSI Technology		SDR	36		Parallel	GSI Technology		300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	512 kWords														Details		FBGA	3.6 V	2.3 V		Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS881E18CGD				DCD Pipeline/Flow Through						Memory & Data Storage								165							9 Mbit	2		170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18				18 Bit	SRAM	9 Mbit			Industrial					SRAM
	Mfr Part No GS880E18CGT-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	TQFP-100	YES	100	5 ns	GSI Technology	300 MHz	SDR	36	GSI TECHNOLOGY	Parallel	GSI Technology	GS880E18CGT-300I	300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	18 Bit	512 kWords	512000	85 °C	-40 °C	PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Active	QFP	NOT SPECIFIED	5.6	Compliant	Yes	TQFP	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS880E18CGT	e3	Yes	3A991.B.2.B	DCD	PURE MATTE TIN	85 °C	-40 °C	PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	QUAD	GULL WING	260	1	0.65 mm	compliant	100	R-PQFP-G100	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V	9 Mbit	2	SYNCHRONOUS	170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18	3-STATE	1.6 mm	18	18 Bit	SRAM	9 Mbit	0.045 A	9437184 bit	Industrial	PARALLEL	COMMON	CACHE SRAM	2.3 V	SRAM	20 mm	14 mm	No
	Mfr Part No GS881Z18CGT-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	TQFP-100	YES	100	5 ns	GSI Technology		SDR	36	GSI TECHNOLOGY	Parallel	GSI Technology	GS881Z18CGT-300I	300 MHz		2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	18 Bit	512 kWords	512000	85 °C	-40 °C	PLASTIC/EPOXY	LQFP	LQFP,		RECTANGULAR	FLATPACK, LOW PROFILE	Active	QFP	NOT SPECIFIED	5.51	Details	Yes	TQFP	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS881Z18CGT	e3	Yes	3A991.B.2.B	NBT Pipeline/Flow Through	Matte Tin (Sn)	85 °C	-40 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	QUAD	GULL WING	260	1	0.65 mm	compliant	100	R-PQFP-G100	Not Qualified	2.7 V		INDUSTRIAL	2.3 V	9 Mbit	1	SYNCHRONOUS	170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18		1.6 mm	18	18 b	SRAM	9 Mbit		9437184 bit	Industrial	PARALLEL		ZBT SRAM		SRAM	20 mm	14 mm	No
	Mfr Part No GS880Z18CGT-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			TQFP-100				GSI Technology			36		Parallel	GSI Technology		300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes			SMD/SMT	18 Bit															Details			3.6 V	2.3 V		Synchronous	NBT SRAM	2.5, 3.3 V		-40 to 85 °C	Tray	GS880Z18CGT				NBT						Memory & Data Storage								100							9 Mbit			170 mA, 225 mA	5@Flow-Through/2.5@P		512 k x 18					SRAM			9						SRAM
	Mfr Part No GS881E18CGT-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			TQFP-100				GSI Technology			36		Parallel	GSI Technology		300 MHz		2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes			SMD/SMT	18 Bit															Details			3.6 V	2.3 V		Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS881E18CGT				DCD Pipeline/Flow Through		85 °C	-40 °C			Memory & Data Storage								100							9 Mbit	2		170 mA, 225 mA	5@Flow-Through/2.5@P		512 k x 18				18 b	SRAM	9 Mb		9	Industrial					SRAM			No
	Mfr Part No GS88118CGD-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165				GSI Technology		SDR	36		Parallel	GSI Technology		300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	512 kWords														Compliant		FBGA	3.6 V	2.3 V		Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS88118CGD				Pipeline/Flow Through		85 °C	-40 °C			Memory & Data Storage								165							9 Mbit	1		170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18				19 Bit	SRAM	9 Mbit			Industrial					SRAM			No
	Mfr Part No GS881Z18CGD-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165						SDR			Parallel			300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C		2.3, 3 V	- 40 C			Surface Mount	SMD/SMT	18 Bit	512 kWords																FBGA	3.6 V	2.3 V		Synchronous		2.5, 3.3 V	Industrial grade	-40 to 85 °C		GS881Z18CGD																		165							9 Mbit	1		170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18				18 Bit		9 Mbit			Industrial
	Mfr Part No GS88218CGB-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-119						SDR			Parallel			300 MHz	300 MHz	2.7, 3.6 V	+ 85 C		2.3, 3 V	- 40 C			Surface Mount	SMD/SMT	18 Bit	512 kWords														Non-Compliant		FBGA	3.6 V	2.3 V		Synchronous		2.5, 3.3 V	Industrial grade	-40 to 85 °C		GS88218CGB																		119							9 Mbit	2		170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18				18 Bit		9 Mbit			Industrial
	Mfr Part No GS88218CB-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-119						SDR			Parallel			300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C		2.3, 3 V	- 40 C			Surface Mount	SMD/SMT	18 Bit	512 kWords														Compliant		FBGA	3.6 V	2.3 V		Synchronous		2.5, 3.3 V	Industrial grade	-40 to 85 °C		GS88218CB						85 °C	-40 °C											119							9 Mbit	2		170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18				18 Bit		9 Mbit			Industrial								No
	Mfr Part No GS882Z18CD-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165				GSI Technology		SDR	36		Parallel	GSI Technology		300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	512 kWords																FBGA	3.6 V	2.3 V		Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS882Z18CD				NBT Pipeline/Flow Through						Memory & Data Storage								165							9 Mbit	2		170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18				18 Bit	SRAM	9 Mbit			Industrial					SRAM
	Mfr Part No GS88218CGD-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165				GSI Technology		SDR	36		Parallel	GSI Technology		300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	512 kWords														Details		FBGA	3.6 V	2.3 V		Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS88218CGD				Pipeline/Flow Through						Memory & Data Storage								165							9 Mbit	2		170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18				18 Bit	SRAM	9 Mbit			Industrial					SRAM
	Mfr Part No GS881Z18CD-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165				GSI Technology		SDR	36		Parallel	GSI Technology		300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	512 kWords																FBGA	3.6 V	2.3 V		Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS881Z18CD				NBT Pipeline/Flow Through						Memory & Data Storage								165							9 Mbit	1		170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18				18 Bit	SRAM	9 Mbit			Industrial					SRAM
	Mfr Part No GS882Z18CGD-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-165	YES	165	5 ns	GSI Technology		SDR	36	GSI TECHNOLOGY	Parallel	GSI Technology	GS882Z18CGD-300I	300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	18 Bit	512 kWords	512000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	4.57	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS882Z18CGD	e1	Yes	3A991.B.2.B	NBT Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	260	1	1 mm	compliant	165	R-PBGA-B165	Not Qualified	2.7 V		INDUSTRIAL	2.3 V	9 Mbit	2	SYNCHRONOUS	170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18		1.4 mm	18	18 Bit	SRAM	9 Mbit		9437184 bit	Industrial	PARALLEL		ZBT SRAM		SRAM	15 mm	13 mm
	Mfr Part No GS88218CD-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165						SDR			Parallel			300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C		2.3, 3 V	- 40 C			Surface Mount	SMD/SMT	18 Bit	512 kWords																FBGA	3.6 V	2.3 V		Synchronous		2.5, 3.3 V	Industrial grade	-40 to 85 °C																				165							9 Mbit	2		170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18				19 Bit		9 Mbit			Industrial
	Mfr Part No GS882Z18CGB-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	5 ns	GSI Technology		SDR	42	GSI TECHNOLOGY	Parallel	GSI Technology	GS882Z18CGB-300I	300 MHz		2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	18 Bit	512 kWords	512000	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA,		RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.13	Compliant	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS882Z18CGB	e1	Yes	3A991.B.2.B	NBT Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	-40 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	260	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified	2.7 V		INDUSTRIAL	2.3 V	9 Mbit	2	SYNCHRONOUS	170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18		1.77 mm	18	18 b	SRAM	9 Mbit		9437184 bit	Industrial	PARALLEL		ZBT SRAM		SRAM	22 mm	14 mm	No
	Mfr Part No GS882Z18CB-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-119				GSI Technology		SDR	42		Parallel	GSI Technology		300 MHz	200@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	512 kWords																FBGA	3.6 V	2.3 V		Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS882Z18CB				NBT Pipeline/Flow Through						Memory & Data Storage								119							9 Mbit	2		170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18				18 Bit	SRAM	9 Mbit			Industrial					SRAM
	Mfr Part No GS88118CD-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165				GSI Technology		SDR	36		Parallel	GSI Technology		300 MHz		2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	512 kWords														Compliant		FBGA	3.6 V	2.3 V		Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS88118CD				Pipeline/Flow Through		85 °C	-40 °C			Memory & Data Storage								165							9 Mbit	1		170 mA, 225 mA	5 ns	Flow-Through/Pipelined	512 k x 18				19 b	SRAM	9 Mbit			Industrial					SRAM			No