The category is 'Memory'
Memory (28)
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- Maximum Operating Temperature
- Memory Size
- Minimum Operating Temperature
- Mounting Styles
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- Supply Voltage-Min
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- Series
- Factory Pack QuantityFactory Pack Quantity
- Supply Current-Max:
170 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Brand | Clock Frequency-Max (fCLK) | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Speed | Operating Mode | Supply Current-Max | Architecture | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Product Category | Temperature | Length | Width | Radiation Hardening |
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![]() | Mfr Part No W634GU6NB-15 | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | VFBGA-96 | 190 | 667 MHz | + 95 C | 0 C | SMD/SMT | 1.45 V | 1.283 V | 1.283V to 1.45V | W634GU6NB | SDRAM - DDR3L | 4 Gbit | 667 / 800 / 933 / 1066 MHz | 170 mA | 16 bit | 256 M x 16 | 4Gb | C-temp, I-temp/ Automotive | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W634GU6NB15I | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | VFBGA-96 | 190 | 667 MHz | + 95 C | - 40 C | SMD/SMT | 1.45 V | 1.283 V | 1.283V to 1.45V | W634GU6NB | SDRAM - DDR3L | 4 Gbit | 667 / 800 / 933 / 1066 MHz | 170 mA | 16 bit | 256 M x 16 | 4Gb | C-temp, I-temp/ Automotive | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS88037CGT-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-100 | GSI Technology | 36 | Parallel | GSI Technology | 200 MHz | + 70 C | SDR | 0 C | Yes | SMD/SMT | Details | 3.6 V | 2.3 V | SyncBurst | Tray | GS88037CGT | Pipeline | Memory & Data Storage | 9 Mbit | 170 mA | 256 k x 36 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS88237CGB-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-119 | YES | 119 | 2.7 ns | GSI Technology | 42 | GSI TECHNOLOGY | Parallel | GSI Technology | GS88237CGB-200 | 200 MHz | + 70 C | SDR | 0 C | Yes | 3 | SMD/SMT | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.19 | Details | Yes | 3.6 V | 2.3 V | 2.5 V | SyncBurst | Tray | GS88237CGB | e1 | Yes | 3A991.B.2.B | SCD/DCD Pipeline | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 9 Mbit | SYNCHRONOUS | 170 mA | 256 k x 36 | 1.77 mm | 36 | SRAM | 9437184 bit | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No GS88237CB-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-119 | YES | 119 | 2.7 ns | GSI Technology | 42 | GSI TECHNOLOGY | Parallel | GSI Technology | GS88237CB-200 | 200 MHz | + 70 C | SDR | 0 C | Yes | SMD/SMT | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.19 | N | No | 3.6 V | 2.3 V | 2.5 V | SyncBurst | Tray | GS88237CB | e0 | No | 3A991.B.2.B | SCD/DCD Pipeline | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 9 Mbit | SYNCHRONOUS | 170 mA | 256 k x 36 | 1.77 mm | 36 | SRAM | 9437184 bit | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No GS88037CGT-200V | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-100 | SDR | Parallel | 200 MHz | 200 MHz | 2, 2.7 V | + 70 C | 1.7, 2.3 V | 0 C | Surface Mount | SMD/SMT | 36 Bit | 256 kWords | Compliant | TQFP | 2.7 V | 1.7 V | Synchronous | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | GS88037CGT | 70 °C | 0 °C | 100 | 9 Mbit | 1 | 170 mA | Pipelined | 256 k x 36 | 18 Bit | 9 Mbit | Commercial | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS88237CGB-200V | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-119 | GSI Technology | SDR | 42 | Parallel | GSI Technology | 200 MHz | 200 MHz | 2, 2.7 V | + 70 C | SDR | 1.7, 2.3 V | 0 C | Yes | Surface Mount | SMD/SMT | 36 Bit | 256 kWords | Details | FBGA | 2.7 V | 1.7 V | Synchronous | SyncBurst | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | Tray | GS88237CGB | SCD/DCD Pipeline | Memory & Data Storage | 119 | 9 Mbit | 2 | 170 mA | Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS88237CB-200V | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-119 | YES | 119 | 2.5 ns | GSI Technology | 200 MHz | SDR | 42 | GSI TECHNOLOGY | Parallel | GSI Technology | GS88237CB-200V | 200 MHz | 200 MHz | 2, 2.7 V | + 70 C | SDR | 1.7, 2.3 V | 0 C | Yes | Surface Mount | SMD/SMT | 36 Bit | 256 kWords | 256000 | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA119,7X17,50 | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.19 | N | No | FBGA | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | Tray | GS88237CB | e0 | No | 3A991.B.2.B | SCD/DCD Pipeline | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | PIPELINED ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | 2 V | 1.8/2.5 V | COMMERCIAL | 1.7 V | 9 Mbit | 2 | SYNCHRONOUS | 170 mA | Pipelined | 256 k x 36 | 3-STATE | 1.77 mm | 36 | 18 Bit | SRAM | 9 Mbit | 0.025 A | 9437184 bit | Commercial | PARALLEL | COMMON | CACHE SRAM | 1.7 V | SRAM | 22 mm | 14 mm | No |
W634GU6NB-15
Winbond Electronics Corporation
Package:Memory
Price: please inquire
W634GU6NB15I
Winbond Electronics Corporation
Package:Memory
Price: please inquire
GS88037CGT-200
GSI Technology
Package:Memory
Price: please inquire
GS88237CGB-200
GSI Technology
Package:Memory
Price: please inquire
GS88237CB-200
GSI Technology
Package:Memory
Price: please inquire
GS88037CGT-200V
GSI Technology
Package:Memory
Price: please inquire
GS88237CGB-200V
GSI Technology
Package:Memory
Price: please inquire
GS88237CB-200V
GSI Technology
Package:Memory
Price: please inquire
