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The category is 'Memory'

Memory (5)

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Access Time
Interface Type
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Maximum Clock Frequency
Maximum Operating Temperature
Memory Size
Minimum Operating Temperature
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Supply Current-Max

Supply Current-Max:
210 mA, 210 mA

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Factory Lead Time	Package / Case	Surface Mount	Number of Terminals	Access Time-Max	Brand	Data Rate Architecture	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Clock Rate	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of I/O Lines	Number of Words	Number of Words Code	Operating Temperature-Max	Package Body Material	Package Code	Package Description	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Timing Type	Tradename	Typical Operating Supply Voltage	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Memory Size	Number of Ports	Operating Mode	Supply Current-Max	Access Time	Architecture	Organization	Seated Height-Max	Memory Width	Address Bus Width	Product Type	Density	Memory Density	Screening Level	Parallel/Serial	Memory IC Type	Product Category	Length	Width
	Mfr Part No GS8161Z36DGT-200	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		10 Weeks	TQFP-100	YES	100	6.5 ns	GSI Technology		36	GSI TECHNOLOGY	Parallel	GSI Technology	GS8161Z36DGT-200	200 MHz			+ 70 C	SDR		0 C	Yes			SMD/SMT		524288 words	512000	70 °C	PLASTIC/EPOXY	LQFP	LQFP,	RECTANGULAR	FLATPACK, LOW PROFILE	Active	QFP	NOT SPECIFIED	4.78	Details	Yes		3.6 V	2.3 V	2.5 V		NBT SRAM				Tray	GS8161Z36DGT			3A991.B.2.B	NBT		ALSO OPERATES AT 3.3V	8542.32.00.41	Memory & Data Storage	CMOS	QUAD	GULL WING	NOT SPECIFIED	1	0.65 mm	compliant	100	R-PQFP-G100		2.7 V	COMMERCIAL	2.3 V	18 Mbit		SYNCHRONOUS	210 mA, 210 mA	6.5 ns		512 k x 36	1.6 mm	36		SRAM		18874368 bit		PARALLEL	ZBT SRAM	SRAM	20 mm	14 mm
	Mfr Part No GS8161E32DGD-200	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165				GSI Technology		36		Parallel	GSI Technology		200 MHz			+ 70 C	SDR		0 C	Yes			SMD/SMT														Details			3.6 V	2.3 V			SyncBurst				Tray	GS8161E32DGD				DCD Pipeline/Flow Through				Memory & Data Storage														18 Mbit			210 mA, 210 mA	6.5 ns		512 k x 32				SRAM						SRAM
	Mfr Part No GS8161E32DGT-200	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			TQFP-100				GSI Technology		36		Parallel	GSI Technology		200 MHz			+ 70 C	SDR		0 C	Yes			SMD/SMT														Details			3.6 V	2.3 V			NBT SRAM				Tray	GS8161E32DGT				DCD Pipeline/Flow Through				Memory & Data Storage														18 Mbit			210 mA, 210 mA	6.5 ns		512 k x 32				SRAM						SRAM
	Mfr Part No GS816272CGC-150	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	7.5 ns	GSI Technology	SDR	21	GSI TECHNOLOGY	Parallel	GSI Technology	GS816272CGC-150	150 MHz	133.3@Flow-Through/150@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR	2.3, 3 V	0 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	256 kWords	256000	70 °C	PLASTIC/EPOXY	LBGA	LBGA,	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.16	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Commercial grade	0 to 70 °C	Tray	GS816272CGC	e1	Yes	3A991.B.2.B	Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	260	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2.7 V	COMMERCIAL	2.3 V	18 Mbit	8	SYNCHRONOUS	210 mA, 210 mA	7.5 ns	Flow-Through/Pipelined	256 k x 72	1.7 mm	72	18 Bit	SRAM	18 Mbit	18874368 bit	Commercial	PARALLEL	CACHE SRAM	SRAM	22 mm	14 mm
	Mfr Part No GS816272CC-150	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	7.5 ns		SDR		GSI TECHNOLOGY	Parallel	GSI Technology	GS816272CC-150	150 MHz	133.3@Flow-Through/150@Pipelined MHz	2.7, 3.6 V	+ 70 C		2.3, 3 V	0 C		3	Surface Mount	SMD/SMT	72 Bit	256 kWords	256000	70 °C	PLASTIC/EPOXY	LBGA	LBGA,	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.16		No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous		2.5, 3.3 V	Commercial grade	0 to 70 °C		GS816272CC		No	3A991.B.2.B			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41		CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2.7 V	COMMERCIAL	2.3 V	18 Mbit	8	SYNCHRONOUS	210 mA, 210 mA	7.5 ns	Flow-Through/Pipelined	256KX72	1.7 mm	72	18 Bit		18 Mbit	18874368 bit	Commercial	PARALLEL	CACHE SRAM		22 mm	14 mm