The category is 'Memory'
Memory (51)
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210 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Access Time-Max | Brand | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Speed | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Architecture | Data Bus Width | Organization | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Product Type | Density | Memory Density | Screening Level | Parallel/Serial | Memory IC Type | Access Mode | Self Refresh | Product Category | Temperature | Memory Organization | Length | Width | Radiation Hardening |
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![]() | Mfr Part No W634GG8NB09I | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | VFBGA-78 | 220 | 1.066 GHz | + 95 C | - 40 C | SMD/SMT | 1.575 V | 1.425 V | 1.5V±0.075V | W634GG8NB | SDRAM - DDR3 | 4 Gbit | 667 / 800 / 933 / 1066 MHz | 210 mA | 8 bit | 512 M x 8 | 4Gb | C-temp, I-temp/ Automotive | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS46TR16128DL-107MBLA1 | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | 7680 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | BGA-96 | YES | 96-TWBGA (9x13) | 96 | 190 | INTEGRATED SILICON SOLUTION INC | IS46TR16128DL-107MBLA1 | + 95 C | Volatile | ISSI, Integrated Silicon Solution Inc | - 40 C | Yes | 3 | SMD/SMT | 134217728 words | 128000000 | 95 °C | -40 °C | Bulk | PLASTIC/EPOXY | TFBGA | TFBGA, | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 10 | 5.61 | Details | Yes | 1.575 V | 1.425 V | 1.35 V | -40°C ~ 95°C (TC) | IS46TR16128DL | e1 | SDRAM - DDR3L | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | SDRAM - DDR3L | 1.283V ~ 1.45V | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | R-PBGA-B96 | 1.45 V | INDUSTRIAL | 1.283 V | 2 Gbit | 1 | SYNCHRONOUS | 933 MHz | 210 mA | 20 ns | DRAM | Parallel | 16 bit | 128 M x 16 | 1.2 mm | 16 | 15ns | 2147483648 bit | DDR DRAM | MULTI BANK PAGE BURST | YES | 128M x 16 | 13 mm | 9 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS46TR16128DL-107MBLA2-TR | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | 24 |
| Min: 1 Mult: 1 | Surface Mount | BGA-96 | 96-TWBGA (9x13) | 1500 | + 105 C | Volatile | ISSI, Integrated Silicon Solution Inc | - 40 C | Yes | SMD/SMT | Tape & Reel (TR) | Active | Details | 1.575 V | 1.425 V | -40°C ~ 105°C (TC) | Reel | IS46TR16128DL | SDRAM - DDR3L | SDRAM - DDR3L | 1.283V ~ 1.45V | 2 Gbit | 933 MHz | 210 mA | 20 ns | DRAM | Parallel | 16 bit | 128 M x 16 | 15ns | 128M x 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W634GU8NB-09 | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | VFBGA-78 | 220 | 1.066 GHz | + 95 C | 0 C | SMD/SMT | 1.45 V | 1.283 V | 1.283V to 1.45V | W634GU8NB | SDRAM - DDR3L | 4 Gbit | 667 / 800 / 933 / 1066 MHz | 210 mA | 8 bit | 512 M x 8 | 4Gb | C-temp, I-temp/ Automotive | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8162Z36DGD-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-165 | YES | 165 | 6.5 ns | GSI Technology | SDR | 36 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8162Z36DGD-200 | 200 MHz | 153.8@Flow-Through/200@Pipelined MHz | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | Surface Mount | SMD/SMT | 36 Bit | 512 kWords | 512000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.22 | Details | Yes | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | 0.413935 oz | Commercial grade | 0 to 85 °C | Tray | GS8162Z36DGD | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | 4 | SYNCHRONOUS | 210 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 36 | 1.4 mm | 36 | 19 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No GS8160E36DGT-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | TQFP-100 | YES | 100 | 6.5 ns | GSI Technology | 36 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8160E36DGT-200 | 200 MHz | + 85 C | SDR | 0 C | Yes | SMD/SMT | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | LQFP | LQFP, | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | NOT SPECIFIED | 1.78 | Compliant | Yes | 3.6 V | 2.3 V | 1.8 V | SyncBurst | Bulk | GS8160E36DGT | 3A991.B.2.B | Pipeline/Flow Through | 85 °C | 0 °C | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 2 V | COMMERCIAL | 1.7 V | 18 Mbit | 4 | SYNCHRONOUS | 210 mA | 6.5 ns | 512 k x 36 | 1.6 mm | 36 | 20 b | SRAM | 18 Mb | 18874368 bit | PARALLEL | CACHE SRAM | SRAM | 20 mm | 14 mm | No | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8160E32DGT-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-100 | GSI Technology | 36 | Parallel | GSI Technology | 200 MHz | + 85 C | SDR | 0 C | Yes | SMD/SMT | Compliant | 3.6 V | 2.3 V | SyncBurst | Bulk | GS8160E32DGT | Pipeline/Flow Through | 85 °C | 0 °C | Memory & Data Storage | 18 Mbit | 4 | 210 mA | 6.5 ns | 512 k x 32 | 20 b | SRAM | 18 Mb | SRAM | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816036DGT-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-100 | GSI Technology | 36 | Parallel | GSI Technology | 200 MHz | + 85 C | SDR | 0 C | Yes | SMD/SMT | Details | 3.6 V | 2.3 V | SyncBurst | Tray | GS816036DGT | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 210 mA | 6.5 ns | 512 k x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8161E36DD-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-165 | GSI Technology | 36 | Parallel | GSI Technology | 200 MHz | + 70 C | SDR | 0 C | Yes | SMD/SMT | 3.6 V | 2.3 V | SyncBurst | Tray | GS8161E36DD | DCD Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 210 mA | 6.5 ns | 512 k x 36 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8161Z32DD-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-165 | YES | 165 | 6.5 ns | GSI TECHNOLOGY | Parallel | GSI Technology | GS8161Z32DD-200 | 200 MHz | + 70 C | 0 C | SMD/SMT | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.3 | Compliant | No | 3.6 V | 2.3 V | 2.5 V | Bulk | GS8161Z32DD | 3A991.B.2.B | 70 °C | 0 °C | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | 4 | SYNCHRONOUS | 210 mA | 6.5 ns | 512 k x 32 | 1.4 mm | 32 | 19 b | 18 Mb | 16777216 bit | PARALLEL | ZBT SRAM | 15 mm | 13 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816236DB-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-119 | YES | 119 | 6.5 ns | GSI Technology | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816236DB-200 | 200 MHz | + 70 C | SDR | 0 C | Yes | SMD/SMT | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.25 | N | No | 3.6 V | 2.3 V | 2.5 V | SyncBurst | Tray | GS816236DB | 3A991.B.2.B | Pipeline/Flow Through | 85 °C | 0 °C | ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | 4 | SYNCHRONOUS | 210 mA | 6.5 ns | 512 k x 36 | 1.99 mm | 36 | 19 b | SRAM | 18 Mb | 18874368 bit | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | No | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS78132AB-10 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 25 Weeks, 5 Days | BGA-119 | YES | 119 | 10 ns | GSI TECHNOLOGY | Parallel | GSI Technology | GS78132AB-10 | + 70 C | 0 C | 3 | Surface Mount | SMD/SMT | 32 Bit | 256 kWords | 256000 | 70 °C | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 4.85 | No | FBGA | 3.6 V | 3 V | 3.3 V | Asynchronous | 3.3000 V | Commercial grade | 0 to 70 °C | e0 | No | 3A991.B.2.B | TIN LEAD | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | 8542.32.00.41 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | 8 Mbit | 4 | ASYNCHRONOUS | 210 mA | 10 ns | 256 k x 32 | 1.99 mm | 32 | 18 Bit | 8 Mbit | 8388608 bit | Commercial | PARALLEL | STANDARD SRAM | 22 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8161Z32DGD-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-165 | YES | 165 | 6.5 ns | GSI Technology | 36 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8161Z32DGD-200 | 200 MHz | + 70 C | SDR | 0 C | Yes | SMD/SMT | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.3 | Compliant | Yes | 3.6 V | 2.3 V | 2.5 V | NBT SRAM | Bulk | GS8161Z32DGD | 3A991.B.2.B | NBT | 70 °C | 0 °C | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | 4 | SYNCHRONOUS | 210 mA | 6.5 ns | 512 k x 32 | 1.4 mm | 32 | 19 b | SRAM | 18 Mb | 16777216 bit | PARALLEL | ZBT SRAM | SRAM | 15 mm | 13 mm | No | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS78132AGB-10 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-119 | GSI Technology | 21 | Parallel | GSI Technology | - | 3.6 V | + 70 C | SDR | 3 V | 0 C | Yes | Surface Mount | SMD/SMT | 32 Bit | 256 kWords | Details | FBGA | 3.6 V | 3 V | Asynchronous | 3.3000 V | 0.726956 oz | Commercial grade | 0 to 70 °C | GS78132AGB | Asynchronous | 70 °C | 0 °C | Memory & Data Storage | 119 | 3.3 V | 8 Mbit | 4 | 210 mA | 10 ns | 256 k x 32 | 18 Bit | SRAM | 8 Mbit | Commercial | SRAM | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816132DD-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-165 | YES | 165 | 6.5 ns | GSI Technology | 36 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816132DD-200 | 200 MHz | + 70 C | SDR | 0 C | Yes | SMD/SMT | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.31 | N | No | 3.6 V | 2.3 V | 2.5 V | SyncBurst | Tray | GS816132DD | 3A991.B.2.B | Pipeline/Flow Through | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | SYNCHRONOUS | 210 mA | 6.5 ns | 512 k x 32 | 1.4 mm | 32 | SRAM | 16777216 bit | PARALLEL | CACHE SRAM | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8162Z36DGB-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-119 | YES | 119 | 6.5 ns | GSI Technology | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8162Z36DGB-200 | 200 MHz | + 70 C | SDR | 0 C | Yes | SMD/SMT | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.25 | Details | Yes | 3.6 V | 2.3 V | 2.5 V | NBT SRAM | Tray | GS8162Z36DGB | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | SYNCHRONOUS | 210 mA | 6.5 ns | 512 k x 36 | 1.99 mm | 36 | SRAM | 18874368 bit | PARALLEL | ZBT SRAM | SRAM | 22 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8162Z36DB-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-119 | YES | 119 | 6.5 ns | GSI Technology | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8162Z36DB-200 | 200 MHz | + 70 C | SDR | 0 C | Yes | SMD/SMT | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.25 | N | No | 3.6 V | 2.3 V | 2.5 V | NBT SRAM | Tray | GS8162Z36DB | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | SYNCHRONOUS | 210 mA | 6.5 ns | 512 k x 36 | 1.99 mm | 36 | SRAM | 18874368 bit | PARALLEL | ZBT SRAM | SRAM | 22 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816236DGB-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-119 | YES | 119 | 6.5 ns | GSI Technology | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816236DGB-200 | 200 MHz | + 70 C | SDR | 0 C | Yes | SMD/SMT | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.25 | Details | Yes | 3.6 V | 2.3 V | 2.5 V | SyncBurst | Tray | GS816236DGB | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | SYNCHRONOUS | 210 mA | 6.5 ns | 512 k x 36 | 1.99 mm | 36 | SRAM | 18874368 bit | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816136DD-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-165 | GSI Technology | 36 | Parallel | GSI Technology | 200 MHz | + 70 C | SDR | 0 C | Yes | SMD/SMT | Compliant | 3.6 V | 2.3 V | SyncBurst | Bulk | GS816136DD | Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 18 Mbit | 4 | 210 mA | 6.5 ns | 512 k x 36 | 19 b | SRAM | 18 Mb | SRAM | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816036DGT-200V | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-100 | GSI Technology | SDR | 18 | Parallel | GSI Technology | 200 MHz | 153.8@Flow-Through/200@Pipelined MHz | 2, 2.7 V | + 85 C | SDR | 1.7, 2.3 V | 0 C | Yes | Surface Mount | SMD/SMT | 36 Bit | 512 kWords | Details | TQFP | 3.6 V | 2.3 V | Synchronous | SyncBurst | 1.8, 2.5 V | Commercial grade | 0 to 85 °C | Tray | GS816036DGT | Pipeline/Flow Through | Memory & Data Storage | 100 | 18 Mbit | 4 | 210 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 36 | 20 Bit | SRAM | 18 Mbit | Commercial | SRAM |
W634GG8NB09I
Winbond Electronics Corporation
Package:Memory
Price: please inquire
IS46TR16128DL-107MBLA1
Integrated Silicon Solution, Inc. (ISSI)
Package:Memory
6.640686
IS46TR16128DL-107MBLA2-TR
Integrated Silicon Solution, Inc. (ISSI)
Package:Memory
8.334471
W634GU8NB-09
Winbond Electronics Corporation
Package:Memory
Price: please inquire
GS8162Z36DGD-200
GSI Technology
Package:Memory
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GS8160E36DGT-200
GSI Technology
Package:Memory
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GS8160E32DGT-200
GSI Technology
Package:Memory
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GS816036DGT-200
GSI Technology
Package:Memory
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GS8161E36DD-200
GSI Technology
Package:Memory
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GS8161Z32DD-200
GSI Technology
Package:Memory
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GS816236DB-200
GSI Technology
Package:Memory
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GS78132AB-10
GSI Technology
Package:Memory
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GS8161Z32DGD-200
GSI Technology
Package:Memory
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GS78132AGB-10
GSI Technology
Package:Memory
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GS816132DD-200
GSI Technology
Package:Memory
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GS8162Z36DGB-200
GSI Technology
Package:Memory
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GS8162Z36DB-200
GSI Technology
Package:Memory
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GS816236DGB-200
GSI Technology
Package:Memory
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GS816136DD-200
GSI Technology
Package:Memory
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GS816036DGT-200V
GSI Technology
Package:Memory
Price: please inquire
