The category is 'Memory'

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  • Factory Pack QuantityFactory Pack Quantity
  • Type
  • Supply Current-Max:

    210 mA

Image

Part Number

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Datasheet

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RoHS

Factory Lead Time

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Access Time-Max

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Data Rate Architecture

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

Interface Type

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Clock Rate

Maximum Operating Supply Voltage

Maximum Operating Temperature

Memory Types

Mfr

Minimum Operating Supply Voltage

Minimum Operating Temperature

Moisture Sensitive

Moisture Sensitivity Levels

Mounting

Mounting Styles

Number of I/O Lines

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package

Package Body Material

Package Code

Package Description

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Product Status

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Supplier Package

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom (Vsup)

Timing Type

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Typical Operating Supply Voltage

Unit Weight

Usage Level

Operating Temperature

Packaging

Series

JESD-609 Code

Pbfree Code

ECCN Code

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Terminal Finish

Max Operating Temperature

Min Operating Temperature

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HTS Code

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Temperature Grade

Supply Voltage-Min (Vsup)

Memory Size

Number of Ports

Speed

Operating Mode

Clock Frequency

Supply Current-Max

Access Time

Memory Format

Memory Interface

Architecture

Data Bus Width

Organization

Seated Height-Max

Memory Width

Write Cycle Time - Word, Page

Address Bus Width

Product Type

Density

Memory Density

Screening Level

Parallel/Serial

Memory IC Type

Access Mode

Self Refresh

Product Category

Temperature

Memory Organization

Length

Width

Radiation Hardening

W634GG8NB09I

Mfr Part No

W634GG8NB09I

Winbond Electronics Corporation Datasheet

-

-

Min: 1

Mult: 1

VFBGA-78

220

1.066 GHz

+ 95 C

- 40 C

SMD/SMT

1.575 V

1.425 V

1.5V±0.075V

W634GG8NB

SDRAM - DDR3

4 Gbit

667 / 800 / 933 / 1066 MHz

210 mA

8 bit

512 M x 8

4Gb

C-temp, I-temp/ Automotive

IS46TR16128DL-107MBLA1

Mfr Part No

IS46TR16128DL-107MBLA1

Integrated Silicon Solution, Inc. (ISSI) Datasheet

7680
In Stock

Min: 1

Mult: 1

8 Weeks

Surface Mount

BGA-96

YES

96-TWBGA (9x13)

96

190

INTEGRATED SILICON SOLUTION INC

IS46TR16128DL-107MBLA1

+ 95 C

Volatile

ISSI, Integrated Silicon Solution Inc

- 40 C

Yes

3

SMD/SMT

134217728 words

128000000

95 °C

-40 °C

Bulk

PLASTIC/EPOXY

TFBGA

TFBGA,

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

10

5.61

Details

Yes

1.575 V

1.425 V

1.35 V

-40°C ~ 95°C (TC)

IS46TR16128DL

e1

SDRAM - DDR3L

Tin/Silver/Copper (Sn/Ag/Cu)

AUTO/SELF REFRESH

SDRAM - DDR3L

1.283V ~ 1.45V

BOTTOM

BALL

260

1

0.8 mm

compliant

R-PBGA-B96

1.45 V

INDUSTRIAL

1.283 V

2 Gbit

1

SYNCHRONOUS

933 MHz

210 mA

20 ns

DRAM

Parallel

16 bit

128 M x 16

1.2 mm

16

15ns

2147483648 bit

DDR DRAM

MULTI BANK PAGE BURST

YES

128M x 16

13 mm

9 mm

IS46TR16128DL-107MBLA2-TR

Mfr Part No

IS46TR16128DL-107MBLA2-TR

Integrated Silicon Solution, Inc. (ISSI) Datasheet

24
In Stock

Min: 1

Mult: 1

Surface Mount

BGA-96

96-TWBGA (9x13)

1500

+ 105 C

Volatile

ISSI, Integrated Silicon Solution Inc

- 40 C

Yes

SMD/SMT

Tape & Reel (TR)

Active

Details

1.575 V

1.425 V

-40°C ~ 105°C (TC)

Reel

IS46TR16128DL

SDRAM - DDR3L

SDRAM - DDR3L

1.283V ~ 1.45V

2 Gbit

933 MHz

210 mA

20 ns

DRAM

Parallel

16 bit

128 M x 16

15ns

128M x 16

W634GU8NB-09

Mfr Part No

W634GU8NB-09

Winbond Electronics Corporation Datasheet

-

-

Min: 1

Mult: 1

VFBGA-78

220

1.066 GHz

+ 95 C

0 C

SMD/SMT

1.45 V

1.283 V

1.283V to 1.45V

W634GU8NB

SDRAM - DDR3L

4 Gbit

667 / 800 / 933 / 1066 MHz

210 mA

8 bit

512 M x 8

4Gb

C-temp, I-temp/ Automotive

GS8162Z36DGD-200

Mfr Part No

GS8162Z36DGD-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

10 Weeks

BGA-165

YES

165

6.5 ns

GSI Technology

SDR

36

GSI TECHNOLOGY

Parallel

GSI Technology

GS8162Z36DGD-200

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2.7, 3.6 V

+ 70 C

SDR

2.3, 3 V

0 C

Yes

Surface Mount

SMD/SMT

36 Bit

512 kWords

512000

70 °C

PLASTIC/EPOXY

LBGA

LBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.22

Details

Yes

FBGA

3.6 V

2.3 V

2.5 V

Synchronous

NBT SRAM

2.5, 3.3 V

0.413935 oz

Commercial grade

0 to 85 °C

Tray

GS8162Z36DGD

3A991.B.2.B

NBT Pipeline/Flow Through

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

2.7 V

COMMERCIAL

2.3 V

18 Mbit

4

SYNCHRONOUS

210 mA

6.5 ns

Flow-Through/Pipelined

512 k x 36

1.4 mm

36

19 Bit

SRAM

18 Mbit

18874368 bit

Commercial

PARALLEL

ZBT SRAM

SRAM

15 mm

13 mm

GS8160E36DGT-200

Mfr Part No

GS8160E36DGT-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

10 Weeks

TQFP-100

YES

100

6.5 ns

GSI Technology

36

GSI TECHNOLOGY

Parallel

GSI Technology

GS8160E36DGT-200

200 MHz

+ 85 C

SDR

0 C

Yes

SMD/SMT

524288 words

512000

70 °C

PLASTIC/EPOXY

LQFP

LQFP,

RECTANGULAR

FLATPACK, LOW PROFILE

Active

QFP

NOT SPECIFIED

1.78

Compliant

Yes

3.6 V

2.3 V

1.8 V

SyncBurst

Bulk

GS8160E36DGT

3A991.B.2.B

Pipeline/Flow Through

85 °C

0 °C

ALSO OPERATES AT 2.5V

8542.32.00.41

Memory & Data Storage

CMOS

QUAD

GULL WING

NOT SPECIFIED

1

0.65 mm

compliant

100

R-PQFP-G100

2 V

COMMERCIAL

1.7 V

18 Mbit

4

SYNCHRONOUS

210 mA

6.5 ns

512 k x 36

1.6 mm

36

20 b

SRAM

18 Mb

18874368 bit

PARALLEL

CACHE SRAM

SRAM

20 mm

14 mm

No

GS8160E32DGT-200

Mfr Part No

GS8160E32DGT-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

TQFP-100

GSI Technology

36

Parallel

GSI Technology

200 MHz

+ 85 C

SDR

0 C

Yes

SMD/SMT

Compliant

3.6 V

2.3 V

SyncBurst

Bulk

GS8160E32DGT

Pipeline/Flow Through

85 °C

0 °C

Memory & Data Storage

18 Mbit

4

210 mA

6.5 ns

512 k x 32

20 b

SRAM

18 Mb

SRAM

No

GS816036DGT-200

Mfr Part No

GS816036DGT-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

TQFP-100

GSI Technology

36

Parallel

GSI Technology

200 MHz

+ 85 C

SDR

0 C

Yes

SMD/SMT

Details

3.6 V

2.3 V

SyncBurst

Tray

GS816036DGT

Pipeline/Flow Through

Memory & Data Storage

18 Mbit

210 mA

6.5 ns

512 k x 36

SRAM

SRAM

GS8161E36DD-200

Mfr Part No

GS8161E36DD-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

GSI Technology

36

Parallel

GSI Technology

200 MHz

+ 70 C

SDR

0 C

Yes

SMD/SMT

3.6 V

2.3 V

SyncBurst

Tray

GS8161E36DD

DCD Pipeline/Flow Through

Memory & Data Storage

18 Mbit

210 mA

6.5 ns

512 k x 36

SRAM

SRAM

GS8161Z32DD-200

Mfr Part No

GS8161Z32DD-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

10 Weeks

BGA-165

YES

165

6.5 ns

GSI TECHNOLOGY

Parallel

GSI Technology

GS8161Z32DD-200

200 MHz

+ 70 C

0 C

SMD/SMT

524288 words

512000

70 °C

PLASTIC/EPOXY

LBGA

LBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.3

Compliant

No

3.6 V

2.3 V

2.5 V

Bulk

GS8161Z32DD

3A991.B.2.B

70 °C

0 °C

FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V

8542.32.00.41

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

2.7 V

COMMERCIAL

2.3 V

18 Mbit

4

SYNCHRONOUS

210 mA

6.5 ns

512 k x 32

1.4 mm

32

19 b

18 Mb

16777216 bit

PARALLEL

ZBT SRAM

15 mm

13 mm

No

GS816236DB-200

Mfr Part No

GS816236DB-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

10 Weeks

BGA-119

YES

119

6.5 ns

GSI Technology

21

GSI TECHNOLOGY

Parallel

GSI Technology

GS816236DB-200

200 MHz

+ 70 C

SDR

0 C

Yes

SMD/SMT

524288 words

512000

70 °C

PLASTIC/EPOXY

BGA

BGA,

RECTANGULAR

GRID ARRAY

Active

BGA

NOT SPECIFIED

5.25

N

No

3.6 V

2.3 V

2.5 V

SyncBurst

Tray

GS816236DB

3A991.B.2.B

Pipeline/Flow Through

85 °C

0 °C

ALSO OPERATES AT 3.3V

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1.27 mm

compliant

119

R-PBGA-B119

2.7 V

COMMERCIAL

2.3 V

18 Mbit

4

SYNCHRONOUS

210 mA

6.5 ns

512 k x 36

1.99 mm

36

19 b

SRAM

18 Mb

18874368 bit

PARALLEL

CACHE SRAM

SRAM

22 mm

14 mm

No

GS78132AB-10

Mfr Part No

GS78132AB-10

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

25 Weeks, 5 Days

BGA-119

YES

119

10 ns

GSI TECHNOLOGY

Parallel

GSI Technology

GS78132AB-10

+ 70 C

0 C

3

Surface Mount

SMD/SMT

32 Bit

256 kWords

256000

70 °C

PLASTIC/EPOXY

BGA

BGA,

RECTANGULAR

GRID ARRAY

Active

BGA

NOT SPECIFIED

4.85

No

FBGA

3.6 V

3 V

3.3 V

Asynchronous

3.3000 V

Commercial grade

0 to 70 °C

e0

No

3A991.B.2.B

TIN LEAD

THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT.

8542.32.00.41

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1.27 mm

compliant

119

R-PBGA-B119

Not Qualified

3.6 V

COMMERCIAL

3 V

8 Mbit

4

ASYNCHRONOUS

210 mA

10 ns

256 k x 32

1.99 mm

32

18 Bit

8 Mbit

8388608 bit

Commercial

PARALLEL

STANDARD SRAM

22 mm

14 mm

GS8161Z32DGD-200

Mfr Part No

GS8161Z32DGD-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

10 Weeks

BGA-165

YES

165

6.5 ns

GSI Technology

36

GSI TECHNOLOGY

Parallel

GSI Technology

GS8161Z32DGD-200

200 MHz

+ 70 C

SDR

0 C

Yes

SMD/SMT

524288 words

512000

70 °C

PLASTIC/EPOXY

LBGA

LBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.3

Compliant

Yes

3.6 V

2.3 V

2.5 V

NBT SRAM

Bulk

GS8161Z32DGD

3A991.B.2.B

NBT

70 °C

0 °C

FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

2.7 V

COMMERCIAL

2.3 V

18 Mbit

4

SYNCHRONOUS

210 mA

6.5 ns

512 k x 32

1.4 mm

32

19 b

SRAM

18 Mb

16777216 bit

PARALLEL

ZBT SRAM

SRAM

15 mm

13 mm

No

GS78132AGB-10

Mfr Part No

GS78132AGB-10

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-119

GSI Technology

21

Parallel

GSI Technology

-

3.6 V

+ 70 C

SDR

3 V

0 C

Yes

Surface Mount

SMD/SMT

32 Bit

256 kWords

Details

FBGA

3.6 V

3 V

Asynchronous

3.3000 V

0.726956 oz

Commercial grade

0 to 70 °C

GS78132AGB

Asynchronous

70 °C

0 °C

Memory & Data Storage

119

3.3 V

8 Mbit

4

210 mA

10 ns

256 k x 32

18 Bit

SRAM

8 Mbit

Commercial

SRAM

No

GS816132DD-200

Mfr Part No

GS816132DD-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

10 Weeks

BGA-165

YES

165

6.5 ns

GSI Technology

36

GSI TECHNOLOGY

Parallel

GSI Technology

GS816132DD-200

200 MHz

+ 70 C

SDR

0 C

Yes

SMD/SMT

524288 words

512000

70 °C

PLASTIC/EPOXY

LBGA

LBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.31

N

No

3.6 V

2.3 V

2.5 V

SyncBurst

Tray

GS816132DD

3A991.B.2.B

Pipeline/Flow Through

FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

2.7 V

COMMERCIAL

2.3 V

18 Mbit

SYNCHRONOUS

210 mA

6.5 ns

512 k x 32

1.4 mm

32

SRAM

16777216 bit

PARALLEL

CACHE SRAM

SRAM

15 mm

13 mm

GS8162Z36DGB-200

Mfr Part No

GS8162Z36DGB-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

10 Weeks

BGA-119

YES

119

6.5 ns

GSI Technology

21

GSI TECHNOLOGY

Parallel

GSI Technology

GS8162Z36DGB-200

200 MHz

+ 70 C

SDR

0 C

Yes

SMD/SMT

524288 words

512000

70 °C

PLASTIC/EPOXY

BGA

BGA,

RECTANGULAR

GRID ARRAY

Active

BGA

NOT SPECIFIED

5.25

Details

Yes

3.6 V

2.3 V

2.5 V

NBT SRAM

Tray

GS8162Z36DGB

3A991.B.2.B

NBT Pipeline/Flow Through

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1.27 mm

compliant

119

R-PBGA-B119

Not Qualified

2.7 V

COMMERCIAL

2.3 V

18 Mbit

SYNCHRONOUS

210 mA

6.5 ns

512 k x 36

1.99 mm

36

SRAM

18874368 bit

PARALLEL

ZBT SRAM

SRAM

22 mm

14 mm

GS8162Z36DB-200

Mfr Part No

GS8162Z36DB-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

10 Weeks

BGA-119

YES

119

6.5 ns

GSI Technology

21

GSI TECHNOLOGY

Parallel

GSI Technology

GS8162Z36DB-200

200 MHz

+ 70 C

SDR

0 C

Yes

SMD/SMT

524288 words

512000

70 °C

PLASTIC/EPOXY

BGA

BGA,

RECTANGULAR

GRID ARRAY

Active

BGA

NOT SPECIFIED

5.25

N

No

3.6 V

2.3 V

2.5 V

NBT SRAM

Tray

GS8162Z36DB

3A991.B.2.B

NBT Pipeline/Flow Through

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1.27 mm

compliant

119

R-PBGA-B119

Not Qualified

2.7 V

COMMERCIAL

2.3 V

18 Mbit

SYNCHRONOUS

210 mA

6.5 ns

512 k x 36

1.99 mm

36

SRAM

18874368 bit

PARALLEL

ZBT SRAM

SRAM

22 mm

14 mm

GS816236DGB-200

Mfr Part No

GS816236DGB-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

10 Weeks

BGA-119

YES

119

6.5 ns

GSI Technology

21

GSI TECHNOLOGY

Parallel

GSI Technology

GS816236DGB-200

200 MHz

+ 70 C

SDR

0 C

Yes

SMD/SMT

524288 words

512000

70 °C

PLASTIC/EPOXY

BGA

BGA,

RECTANGULAR

GRID ARRAY

Active

BGA

NOT SPECIFIED

5.25

Details

Yes

3.6 V

2.3 V

2.5 V

SyncBurst

Tray

GS816236DGB

3A991.B.2.B

Pipeline/Flow Through

ALSO OPERATES AT 3.3V

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1.27 mm

compliant

119

R-PBGA-B119

2.7 V

COMMERCIAL

2.3 V

18 Mbit

SYNCHRONOUS

210 mA

6.5 ns

512 k x 36

1.99 mm

36

SRAM

18874368 bit

PARALLEL

CACHE SRAM

SRAM

22 mm

14 mm

GS816136DD-200

Mfr Part No

GS816136DD-200

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-165

GSI Technology

36

Parallel

GSI Technology

200 MHz

+ 70 C

SDR

0 C

Yes

SMD/SMT

Compliant

3.6 V

2.3 V

SyncBurst

Bulk

GS816136DD

Pipeline/Flow Through

70 °C

0 °C

Memory & Data Storage

18 Mbit

4

210 mA

6.5 ns

512 k x 36

19 b

SRAM

18 Mb

SRAM

No

GS816036DGT-200V

Mfr Part No

GS816036DGT-200V

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

TQFP-100

GSI Technology

SDR

18

Parallel

GSI Technology

200 MHz

153.8@Flow-Through/200@Pipelined MHz

2, 2.7 V

+ 85 C

SDR

1.7, 2.3 V

0 C

Yes

Surface Mount

SMD/SMT

36 Bit

512 kWords

Details

TQFP

3.6 V

2.3 V

Synchronous

SyncBurst

1.8, 2.5 V

Commercial grade

0 to 85 °C

Tray

GS816036DGT

Pipeline/Flow Through

Memory & Data Storage

100

18 Mbit

4

210 mA

6.5 ns

Flow-Through/Pipelined

512 k x 36

20 Bit

SRAM

18 Mbit

Commercial

SRAM