The category is 'Memory'

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  • Supply Current-Max:

    220 mA, 220 mA

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Radiation Hardening

GS816272CC-150I

Mfr Part No

GS816272CC-150I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-209

YES

209

7.5 ns

GSI Technology

21

GSI TECHNOLOGY

Parallel

GSI Technology

GS816272CC-150I

150 MHz

133.3@Flow-Through/150@Pipelined MHz

2.7, 3.6 V

+ 85 C

SDR

2.3, 3 V

- 40 C

Yes

3

SMD/SMT

72 Bit

262144 words

256000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

LBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.16

Compliant

No

FBGA

3.6 V

2.3 V

2.5 V

Synchronous

SyncBurst

2.5, 3.3 V

-40 to 85 °C

Tray

GS816272CC

No

3A991.B.2.B

Pipeline/Flow Through

85 °C

-40 °C

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

209

R-PBGA-B209

Not Qualified

2.7 V

INDUSTRIAL

2.3 V

18 Mbit

8

SYNCHRONOUS

220 mA, 220 mA

7.5@Flow-Through/3.8

256 k x 72

1.7 mm

72

18 b

SRAM

18 Mb

18

PARALLEL

CACHE SRAM

SRAM

22 mm

14 mm

No

GS816272CGC-150I

Mfr Part No

GS816272CGC-150I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-209

YES

209

7.5 ns

GSI Technology

21

GSI TECHNOLOGY

Parallel

GSI Technology

GS816272CGC-150I

150 MHz

+ 85 C

SDR

- 40 C

Yes

3

SMD/SMT

262144 words

256000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

LBGA,

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.16

Details

Yes

3.6 V

2.3 V

2.5 V

SyncBurst

Tray

GS816272CGC

e1

Yes

3A991.B.2.B

Pipeline/Flow Through

Tin/Silver/Copper (Sn/Ag/Cu)

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

260

1

1 mm

compliant

209

R-PBGA-B209

Not Qualified

2.7 V

INDUSTRIAL

2.3 V

18 Mbit

SYNCHRONOUS

220 mA, 220 mA

7.5 ns

256 k x 72

1.7 mm

72

SRAM

18874368 bit

PARALLEL

CACHE SRAM

SRAM

22 mm

14 mm