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The category is 'Memory'

Memory (6)

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Access Time
Access Time-Max
Additional Feature
Address Bus Width
Architecture
Data Rate Architecture
Density
ECCN Code
Factory Lead Time
HTS Code
Interface Type
Supply Current-Max

Supply Current-Max:
220 mA, 240 mA

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Factory Lead Time	Package / Case	Surface Mount	Number of Terminals	Access Time-Max	Brand	Data Rate Architecture	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Clock Rate	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of I/O Lines	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Timing Type	Tradename	Typical Operating Supply Voltage	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Memory Size	Number of Ports	Operating Mode	Supply Current-Max	Access Time	Architecture	Organization	Seated Height-Max	Memory Width	Address Bus Width	Product Type	Density	Memory Density	Screening Level	Parallel/Serial	Memory IC Type	Product Category	Length	Width	Radiation Hardening
	Mfr Part No GS8162Z72CGC-150I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	7.5 ns	GSI Technology	SDR	21	GSI TECHNOLOGY	Parallel	GSI Technology	GS8162Z72CGC-150I	150 MHz		2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	256 kWords	256000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA,	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.17	Compliant	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS8162Z72CGC	e1	Yes	3A991.B.2.B	NBT Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	-40 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	260	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2.7 V	INDUSTRIAL	2.3 V	18 Mbit	8	SYNCHRONOUS	220 mA, 240 mA	7.5 ns	Flow-Through/Pipelined	256 k x 72	1.7 mm	72	18 Bit	SRAM	18 Mbit	18874368 bit	Industrial	PARALLEL	ZBT SRAM	SRAM	22 mm	14 mm	No
	Mfr Part No GS816272CC-150IV	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	7.5 ns	GSI Technology	SDR	21	GSI TECHNOLOGY	Parallel	GSI Technology	GS816272CC-150IV	150 MHz	133.3@Flow-Through/150@Pipelined MHz	2, 2.7 V	+ 85 C	SDR	1.7, 2.3 V	- 40 C	Yes		Surface Mount	SMD/SMT	72 Bit	256 kWords	256000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA,	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.16	Compliant	No	BGA	2.7 V	1.7 V	1.8 V	Synchronous	SyncBurst	1.8, 2.5 V	Industrial grade	-40 to 85 °C	Tray	GS816272CC		No	3A991.B.2.B	SCD/DCD		85 °C	-40 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2 V	INDUSTRIAL	1.7 V	18 Mbit	8	SYNCHRONOUS	220 mA, 240 mA	7.5 ns	Flow-Through/Pipelined	256 k x 72	1.7 mm	72	18 Bit	SRAM	18 Mbit	18874368 bit	Industrial	PARALLEL	CACHE SRAM	SRAM	22 mm	14 mm	No
	Mfr Part No GS8162Z72CGC-150IV	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	7.5 ns	GSI Technology	SDR	21	GSI TECHNOLOGY	Parallel	GSI Technology	GS8162Z72CGC-150IV	150 MHz	133.3@Flow-Through/150@Pipelined MHz	2, 2.7 V	+ 85 C	SDR	1.7, 2.3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	256 kWords	256000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA,	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.17	Details	Yes	BGA	2.7 V	1.7 V	1.8 V	Synchronous	NBT SRAM	1.8, 2.5 V	Industrial grade	-40 to 85 °C	Tray	GS8162Z72CGC	e1	Yes	3A991.B.2.B	NBT	Tin/Silver/Copper (Sn/Ag/Cu)			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	260	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2 V	INDUSTRIAL	1.7 V	18 Mbit	8	SYNCHRONOUS	220 mA, 240 mA	7.5 ns	Flow-Through/Pipelined	256 k x 72	1.7 mm	72	18 Bit	SRAM	18 Mbit	18874368 bit	Industrial	PARALLEL	ZBT SRAM	SRAM	22 mm	14 mm
	Mfr Part No GS816272CGC-150IV	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	7.5 ns	GSI Technology	SDR	21	GSI TECHNOLOGY	Parallel	GSI Technology	GS816272CGC-150IV	150 MHz	133.3@Flow-Through/150@Pipelined MHz	2, 2.7 V	+ 85 C	SDR	1.7, 2.3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	256 kWords	256000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA,	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.16	Details	Yes	BGA	2.7 V	1.7 V	1.8 V	Synchronous	SyncBurst	1.8, 2.5 V	Industrial grade	-40 to 85 °C	Tray	GS816272CGC	e1	Yes	3A991.B.2.B	SCD/DCD	Tin/Silver/Copper (Sn/Ag/Cu)			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	260	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2 V	INDUSTRIAL	1.7 V	18 Mbit	8	SYNCHRONOUS	220 mA, 240 mA	7.5 ns	Flow-Through/Pipelined	256 k x 72	1.7 mm	72	18 Bit	SRAM	18 Mbit	18874368 bit	Industrial	PARALLEL	CACHE SRAM	SRAM	22 mm	14 mm
	Mfr Part No GS8162Z72CC-150IV	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	7.5 ns		SDR		GSI TECHNOLOGY	Parallel	GSI Technology	GS8162Z72CC-150IV	150 MHz	133.3@Flow-Through/150@Pipelined MHz	2, 2.7 V	+ 85 C		1.7, 2.3 V	- 40 C			Surface Mount	SMD/SMT	72 Bit	256 kWords	256000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA,	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.17		No	BGA	2.7 V	1.7 V	1.8 V	Synchronous		1.8, 2.5 V	Industrial grade	-40 to 85 °C				No	3A991.B.2.B					FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V SUPPLY	8542.32.00.41		CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2 V	INDUSTRIAL	1.7 V	18 Mbit	8	SYNCHRONOUS	220 mA, 240 mA	7.5 ns	Flow-Through/Pipelined	256 k x 72	1.7 mm	72	18 Bit		18 Mbit	18874368 bit	Industrial	PARALLEL	ZBT SRAM		22 mm	14 mm
	Mfr Part No GS8162Z72CC-150I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	7.5 ns	GSI Technology	SDR	21	GSI TECHNOLOGY	Parallel	GSI Technology	GS8162Z72CC-150I	150 MHz	133.3@Flow-Through/150@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	256 kWords	256000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA,	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.17		No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS8162Z72CC		No	3A991.B.2.B	NBT Pipeline/Flow Through				FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2.7 V	INDUSTRIAL	2.3 V	18 Mbit	8	SYNCHRONOUS	220 mA, 240 mA	7.5 ns	Flow-Through/Pipelined	256 k x 72	1.7 mm	72	18 Bit	SRAM	18 Mbit	18874368 bit	Industrial	PARALLEL	ZBT SRAM	SRAM	22 mm	14 mm