The category is 'Memory'
Memory (167)
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- Supply Current-Max:
25 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Active Read Current - Max | Address Bus | Base Product Number | Block Organization | Brand | Cell Type | Clock Frequency-Max (fCLK) | Dimensions | ECC Support | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Mounting | Mounting Styles | Number of Words | Number of Words Code | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Package Type | Part Life Cycle Code | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Memory Size | Number of Ports | Speed | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Architecture | Data Bus Width | Organization | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Product Type | Density | Memory Density | Screening Level | Access Time (Max) | Parallel/Serial | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Boot Block | Access Mode | Self Refresh | Supply Current | Product Category | Temperature | Memory Organization | Length | Width |
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 | Mfr Part No IS25LP080D-JULE-TR | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | 14603 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | USON-8 | YES | 8-USON (2x3) | 8 | 25 mA | 133 MHz | 5000 | INTEGRATED SILICON SOLUTION INC | QPI, SPI | IS25LP080D-JULE-TR | 133 MHz | + 105 C | Non-Volatile | ISSI, Integrated Silicon Solution Inc | - 40 C | Yes | SMD/SMT | 1048576 words | 1000000 | 105 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | HVSON | HVSON, | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 1.73 | Details | Yes | 3.6 V | 2.3 V | 3 V | Synchronous | 0.017375 oz | -40 to 105 °C | MouseReel | IS25LP080D | FLASH - NOR (SLC) | 2.3V ~ 3.6V | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.3 V | 8 Mbit | 133 MHz | SYNCHRONOUS | 133 MHz | 25 mA | 7 ns | FLASH | SPI - Quad I/O, QPI, DTR | 8 bit | 1 M x 8 | 0.6 mm | 8 | 40µs, 800µs | 8388608 bit | SERIAL | FLASH | 3 V | 1M x 8 | 3 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q16JVSNIM TR | Winbond Electronics | Datasheet | 16 |
| Min: 1 Mult: 1 | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | 25 mA | W25Q16 | Winbond | 2500 | SPI | Winbond | 133 MHz | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Active | Details | 3.6 V | 2.7 V | Synchronous | SpiFlash | -40°C ~ 85°C (TA) | Reel | W25Q16JV | Memory & Data Storage | 2.7V ~ 3.6V | 16Mbit | 133 MHz | 25 mA | 6 ns | FLASH | SPI - Quad I/O, QPI, DTR | 8 bit | 2 M x 8 | 3ms | NOR Flash | NOR Flash | 2M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q32JVSNIQ TR | Winbond Electronics Corporation | Datasheet | 4000 |
| Min: 1 Mult: 1 | Surface Mount | SOIC-8 | 8-SOIC | 25 mA | W25Q32 | 2500 | SPI | 133 MHz | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Active | Details | 3.6 V | 2.7 V | Synchronous | SpiFlash | -40°C ~ 85°C (TA) | Cut Tape | W25Q32JV | FLASH - NOR | 2.7V ~ 3.6V | 32 Mbit | 133 MHz | 25 mA | 6 ns | FLASH | SPI - Quad I/O | 8 bit | 4 M x 8 | 3ms | 4M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS25LP032D-JTLA3-TR | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | 20000 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | USON-8 | YES | 8-USON (4x3) | 8 | 25 mA | 133 MHz | 5000 | INTEGRATED SILICON SOLUTION INC | QPI, SPI | IS25LP032D-JTLA3-TR | 133 MHz | + 125 C | Non-Volatile | ISSI, Integrated Silicon Solution Inc | - 40 C | SMD/SMT | 4194304 words | 4000000 | 125 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | HVSON | HVSON, | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 5.64 | Yes | 3.6 V | 2.3 V | 3 V | Synchronous | Automotive grade | -40°C ~ 125°C (TA) | Cut Tape | IS25LP032D | FLASH - NOR (SLC) | 2.3V ~ 3.6V | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.8 mm | compliant | R-PDSO-N8 | 3.6 V | AUTOMOTIVE | 2.3 V | 32 Mbit | 133 MHz | SYNCHRONOUS | 133 MHz | 25 mA | 7 ns | FLASH | SPI - Quad I/O, QPI, DTR | 8 bit | 4 M x 8 | 0.6 mm | 8 | 40µs, 800µs | 33554432 bit | AEC-Q100 | SERIAL | FLASH | 3 V | 4M x 8 | 4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS25LP032D-JNLA3-TR | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | 4000 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | SOIC-8 | YES | 8-SOIC | 8 | 25 mA | Symmetrical | NOR | 133 MHz | No | 3000 | INTEGRATED SILICON SOLUTION INC | QPI, SPI | IS25LP032D-JNLA3-TR | 133 MHz | 3.6 V | + 125 C | NOR | ISSI, Integrated Silicon Solution Inc | 2.3 V | - 40 C | Yes | Surface Mount | SMD/SMT | 32 MWords | 4000000 | 125 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Active | Active | NOT SPECIFIED | 1.65 | Details | Yes | NOR Flash 32M 2.3-3.6V 133Mhz Serial NOR Flash | 8542320070, 8542320070/8542320070/8542320070/8542320070/8542320070 | SOIC | 3.6 V | 2.3 V | 3 V | Synchronous | 2.5, 3.3 V | 0.043438 oz | Automotive grade | -40 to 125 °C | MouseReel | IS25LP032D | FLASH - NOR (SLC) | 2.3V ~ 3.6V | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 3.6 V | AUTOMOTIVE | 2.3 V | 32 Mbit | 133 MHz | SYNCHRONOUS | 133 MHz | 25 mA | 7 ns | FLASH | SPI - Quad I/O, QPI, DTR | Sectored | 8 bit | 4 M x 8 | 1.75 mm | 8 | 40µs, 800µs | 32 MB | 33554432 bit | Automotive | SERIAL | FLASH | 2.3, 3.6 V | No | 4M x 8 | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N01HZBINF TR | Winbond Electronics | Datasheet | 36 |
| Min: 1 Mult: 1 | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) | 25 mA | W29N01 | Winbond | 2500 | Parallel | Winbond | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tape & Reel (TR) | Active | Details | 1.95 V | 1.7 V | 1.7V - 1.95V | -40°C ~ 85°C (TA) | Reel | - | SLC NAND Flash | Memory & Data Storage | 1.7V ~ 1.95V | 1Gbit | 40MHz | 25 mA | 22 ns | FLASH | ONFI | 8 bit | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 25ns | NAND Flash | 1Gb | NAND Flash | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 128M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N01HZSINF TR | Winbond Electronics | Datasheet | 30 |
| Min: 1 Mult: 1 | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP | 25 mA | W29N01 | Winbond | 1500 | Parallel | Winbond | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tape & Reel (TR) | Active | Details | 1.95 V | 1.7 V | 1.7V - 1.95V | -40°C ~ 85°C (TA) | Reel | - | SLC NAND Flash | Memory & Data Storage | 1.7V ~ 1.95V | 1Gbit | 40MHz | 25 mA | 22 ns | FLASH | ONFI | 8 bit | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 25ns | NAND Flash | 1Gb | NAND Flash | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 128M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS43LD32160A-18BLI | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | FBGA-134 | YES | 134 | 171 | INTEGRATED SILICON SOLUTION INC | IS43LD32160A-18BLI | 533 MHz | + 85 C | - 40 C | Yes | SMD/SMT | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | NOT SPECIFIED | 5.69 | Details | Yes | 1.95 V | 1.14 V | 1.2 V | IS43LD32160A | e1 | EAR99 | SDRAM Mobile - LPDDR2 | Tin/Silver/Copper (Sn/Ag/Cu) | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.65 mm | compliant | R-PBGA-B134 | 1.3 V | INDUSTRIAL | 1.14 V | 512 Mbit | 1 | SYNCHRONOUS | 25 mA | 18 ns | 16 bit | 16 M x 32 | 1.1 mm | 32 | 536870912 bit | DDR DRAM | FOUR BANK PAGE BURST | YES | 11.5 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N01HZBINA TR | Winbond Electronics | Datasheet | 16 |
| Min: 1 Mult: 1 | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) | 25 mA | W29N01 | Winbond | 2500 | Parallel | Winbond | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Active | Details | 1.95 V | 1.7 V | 1.7V - 1.95V | -40°C ~ 85°C (TA) | Reel | W29N01HZ | SLC NAND Flash | Memory & Data Storage | 1.7V ~ 1.95V | 1Gbit | 40MHz | 25 mA | 22 ns | FLASH | ONFI | 8 bit | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 25ns | NAND Flash | 1Gb | NAND Flash | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 128M x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N01HZDINF TR | Winbond Electronics | Datasheet | 16 |
| Min: 1 Mult: 1 | Surface Mount | 48-VFBGA | 48-VFBGA (8x6.5) | 25 mA | W29N01 | Winbond | 3500 | Parallel | Winbond | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Active | Details | 1.95 V | 1.7 V | 1.7V - 1.95V | -40°C ~ 85°C (TA) | Reel | W29N01HZ | SLC NAND Flash | Memory & Data Storage | 1.7V ~ 1.95V | 1Gbit | 40MHz | 25 mA | 22 ns | FLASH | ONFI | 8 bit | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 25ns | NAND Flash | 1Gb | NAND Flash | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 128M x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q80DLSNIG TR | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | SOIC-8 | 8-SOIC | 25 mA | W25Q80 | 2500 | SPI | 80 MHz | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tape & Reel (TR) | Active | Yes | Details | 3.6 V | 2.3 V | Synchronous | SpiFlash | 0.008544 oz | -40°C ~ 85°C (TA) | MouseReel | W25Q80DL | FLASH - NOR | 2.3V ~ 3.6V | 8 Mbit | 80 MHz | 25 mA | 6 ns | FLASH | SPI - Quad I/O | 8 bit | 1 M x 8 | 30µs, 3ms | 1M x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W25Q16JVSSIM | Winbond | Datasheet | 936 |
| Min: 1 Mult: 1 | Surface Mount | SOIC-8 | YES | 8-SOIC | 8 | 25 mA | W25Q16 | Winbond | 133 MHz | 208mil | 1260 | WINBOND ELECTRONICS CORP | SPI | Winbond | W25Q16JVSSIM | 133 MHz | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | 2097152 words | 2000000 | 85 °C | -40 °C | Tube | PLASTIC/EPOXY | SOP | SOIC-8 | SQUARE | SMALL OUTLINE | Active | Active | Yes | NOT SPECIFIED | 2.23 | Details | Yes | 3.6 V | 2.7 V | 3 V | Synchronous | SpiFlash | 0.024119 oz | -40°C ~ 85°C (TA) | W25Q16JV | Memory & Data Storage | FLASH - NOR | 2.7V ~ 3.6V | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | 133MHz | S-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | 2.7 ~ 3.6V | 16 Mbit | SYNCHRONOUS | 133 MHz | 25 mA | FLASH | SPI - Quad I/O | 8 bit | 2 M x 8 | 2.16 mm | 8 | 3ms | NOR Flash | 16Mb | 16777216 bit | SERIAL | FLASH | 3 V | NOR Flash | -40~+85˚C | 2M x 8 | 5.28 mm | 5.28 mm | |||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W25Q64JVZPIQ | Winbond | Datasheet | 36 | - | Min: 1 Mult: 1 | Surface Mount | WSON-8 | YES | 8-WSON (6x5) | 8 | 25 mA | 24(b) | W25Q64 | Winbond | 133 MHz | 5X6mm2 | 600 | WINBOND ELECTRONICS CORP | SPI | Winbond | W25Q64JVZPIQ | 133 MHz | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | Surface Mount | SMD/SMT | 8M | 64000000 | 3.6(V) | 2.7(V) | 3/3.3(V) | -40C to 85C | 85C | -40C | Industrial | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | HVSON | HVSON, | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | WSON EP | Active | Active | Yes | No | NOT SPECIFIED | 1.65 | Details | Yes | NOR Flash spiFlash, 64M-bit, DTR, 4Kb Uniform Sector | 3.6 V | 2.7 V | 3 V | Synchronous | SpiFlash | -40°C ~ 85°C (TA) | Rail/Tube | W25Q64JV | 3A991.B.1.A | 8542.32.00.51 | Memory & Data Storage | FLASH - NOR | 2.7V ~ 3.6V | DUAL | NO LEAD | NOT SPECIFIED | 1 | 1.27 mm | compliant | 133MHz | 8 | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.7 V | 2.7 ~ 3.6V | 64 Mbit | SYNCHRONOUS | 133 MHz | 25 mA | 6 ns | FLASH | SPI - Quad I/O | 8 bit | 8 M x 8 | 0.8 mm | 1 | 3ms | NOR Flash | 67108864(Bit) | 67108864 bit | 6(ns) | SERIAL | Synchronous | 8(b) | FLASH | 2.7 V | 25(mA) | NOR Flash | -40~+85˚C | 8M x 8 | 6 mm | 5 mm | |||||||||||||||||||||||
| Mfr Part No W979H6KBVX1I TR | Winbond Electronics | Datasheet | 16 |
| Min: 1 Mult: 1 | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) | W979H6 | Winbond | 3500 | Winbond | 533 MHz | + 85 C | Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Not For New Designs | Details | 1.95 V | 1.14 V | 1.8V / 1.2V | -40°C ~ 85°C (TC) | Reel | W979H6KB | Low Power DDR2 SDRAM | Memory & Data Storage | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 512Mbit | 400 / 533 MHz | 533 MHz | 25 mA | DRAM | HSUL_12 | 16 bit | 32Mbit x32 | 15ns | DRAM | 512Gb | DRAM | -25ºC~85ºC, -40ºC~85ºC/ Automotive | 32M x 16 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N01HZSINA TR | Winbond Electronics | Datasheet | 32 |
| Min: 1 Mult: 1 | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP | 25 mA | W29N01 | Winbond | 1500 | Parallel | Winbond | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tape & Reel (TR) | Active | Details | 1.95 V | 1.7 V | 1.7V - 1.95V | -40°C ~ 85°C (TA) | Reel | - | SLC NAND Flash | Memory & Data Storage | 1.7V ~ 1.95V | 1Gbit | 40MHz | 25 mA | 22 ns | FLASH | ONFI | 8 bit | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 25ns | NAND Flash | 1Gb | NAND Flash | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 128M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N01HWBINF TR | Winbond Electronics | Datasheet | 29 |
| Min: 1 Mult: 1 | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) | 25 mA | W29N01 | Winbond | 2500 | Parallel | Winbond | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Active | Details | 1.95 V | 1.7 V | 1.7V - 1.95V | -40°C ~ 85°C (TA) | Reel | W29N01HW | SLC NAND Flash | Memory & Data Storage | 1.7V ~ 1.95V | 1Gbit | 40MHz | 25 mA | 22 ns | FLASH | ONFI | 16 bit | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 25ns | NAND Flash | 1Gb | NAND Flash | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 64M x 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q256JVMIQ TR | Winbond Electronics | Datasheet | 36 |
| Min: 1 Mult: 1 | Surface Mount | 8-WLGA Exposed Pad | 8-WFLGA (6x5) | 25 mA | W25Q256 | Winbond | 5000 | SPI | Winbond | 133 MHz | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | SMD/SMT | Tape & Reel (TR) | Active | 3.6 V | 2.7 V | Asynchronous | -40°C ~ 85°C (TA) | Reel | Memory & Data Storage | 2.7V ~ 3.6V | 256Mbit | 133 MHz | 133 MHz | 25 mA | 6 ns | FLASH | SPI - Quad I/O | 8 bit | 32 M x 8 | 3ms | NOR Flash | NOR Flash | 32M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W979H6KBVX1E TR | Winbond Electronics | Datasheet | 6 |
| Min: 1 Mult: 1 | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) | W979H6 | Winbond | 3500 | Winbond | 533 MHz | + 85 C | Volatile | Winbond Electronics | - 25 C | Yes | SMD/SMT | Tape & Reel (TR) | Not For New Designs | Details | 1.95 V | 1.14 V | 1.8V / 1.2V | -25°C ~ 85°C (TC) | Reel | - | Low Power DDR2 SDRAM | Memory & Data Storage | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 512Mbit | 400 / 533 MHz | 533 MHz | 25 mA | DRAM | HSUL_12 | 16 bit | 32Mbit x32 | 15ns | DRAM | 512Gb | DRAM | -25ºC~85ºC, -40ºC~85ºC/ Automotive | 32M x 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W979H2KBVX1E TR | Winbond Electronics | Datasheet | 6 |
| Min: 1 Mult: 1 | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) | W979H2 | Winbond | 3500 | Winbond | 533 MHz | + 85 C | Volatile | Winbond Electronics | - 25 C | Yes | SMD/SMT | Tape & Reel (TR) | Not For New Designs | Details | 1.95 V | 1.14 V | 1.8V / 1.2V | -25°C ~ 85°C (TC) | Reel | - | Low Power DDR2 SDRAM | Memory & Data Storage | 1.14V ~ 1.3V, 1.7V ~ 1.95V | 512Mbit | 400 / 533 MHz | 533 MHz | 25 mA | DRAM | HSUL_12 | 32 bit | 16Mbit x16 | 15ns | DRAM | 512Gb | DRAM | -25ºC~85ºC, -40ºC~85ºC/ Automotive | 16M x 32 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N01HWSINF TR | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | TSOP-48 | 48-TSOP | 25 mA | W29N01 | 1500 | Parallel | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Tape & Reel (TR) | Active | Details | 1.95 V | 1.7 V | 1.7V - 1.95V | -40°C ~ 85°C (TA) | Reel | W29N01HW | SLC NAND Flash | FLASH - NAND (SLC) | 1.7V ~ 1.95V | 1 Gbit | 40MHz | 25 mA | 22 ns | FLASH | ONFI | 16 bit | 64 M x 16 | 25ns | 1Gb | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 64M x 16 |
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IS25LP080D-JULE-TR
Integrated Silicon Solution, Inc. (ISSI)
Package:Memory
Price: please inquire
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W25Q16JVSNIM TR
Winbond Electronics
Package:Memory
0.655207
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W25Q32JVSNIQ TR
Winbond Electronics Corporation
Package:Memory
0.952853
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IS25LP032D-JTLA3-TR
Integrated Silicon Solution, Inc. (ISSI)
Package:Memory
1.436737
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IS25LP032D-JNLA3-TR
Integrated Silicon Solution, Inc. (ISSI)
Package:Memory
2.698194
-
W29N01HZBINF TR
Winbond Electronics
Package:Memory
3.787740
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W29N01HZSINF TR
Winbond Electronics
Package:Memory
3.554216
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IS43LD32160A-18BLI
Integrated Silicon Solution, Inc. (ISSI)
Package:Memory
Price: please inquire
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W29N01HZBINA TR
Winbond Electronics
Package:Memory
4.572306
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W29N01HZDINF TR
Winbond Electronics
Package:Memory
4.196090
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W25Q80DLSNIG TR
Winbond Electronics Corporation
Package:Memory
Price: please inquire
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W25Q16JVSSIM
Winbond
Package:Memory
0.601864
-
W25Q64JVZPIQ
Winbond
Package:Memory
Price: please inquire
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W979H6KBVX1I TR
Winbond Electronics
Package:Memory
5.291336
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W29N01HZSINA TR
Winbond Electronics
Package:Memory
3.803212
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W29N01HWBINF TR
Winbond Electronics
Package:Memory
4.255493
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W25Q256JVMIQ TR
Winbond Electronics
Package:Memory
3.871788
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W979H6KBVX1E TR
Winbond Electronics
Package:Memory
5.246646
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W979H2KBVX1E TR
Winbond Electronics
Package:Memory
5.101411
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W29N01HWSINF TR
Winbond Electronics Corporation
Package:Memory
Price: please inquire