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The category is 'Memory'

Memory (30)

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Access Time
Interface Type
Maximum Clock Frequency
Maximum Operating Supply Voltage
Maximum Operating Temperature
Memory Size
Minimum Operating Supply Voltage
Minimum Operating Temperature
Mounting Styles
Number of I/O Lines
Organization
Supply Current-Max

Supply Current-Max:
270 mA, 370 mA

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Factory Lead Time	Package / Case	Surface Mount	Number of Terminals	Access Time-Max	Brand	Clock Frequency-Max (fCLK)	Data Rate Architecture	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Clock Rate	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of I/O Lines	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Timing Type	Tradename	Typical Operating Supply Voltage	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Memory Size	Number of Ports	Operating Mode	Supply Current-Max	Access Time	Architecture	Organization	Output Characteristics	Seated Height-Max	Memory Width	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Standby Voltage-Min	Product Category	Length	Width	Radiation Hardening
	Mfr Part No GS8321E18AGD-375I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-165	YES	165	4.2 ns		375 MHz	SDR		GSI TECHNOLOGY	Parallel	GSI Technology	GS8321E18AGD-375I	375 MHz	238@Flow-Through/375@Pipelined MHz	2.7, 3.6 V	+ 85 C		2.3, 3 V	- 40 C		3	Surface Mount	SMD/SMT	18 Bit	2 MWords	2000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.31		Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous		2.5, 3.3 V	Industrial grade	-40 to 100 °C			e1	Yes	3A991.B.2.B		TIN SILVER COPPER			IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE		SRAMs	CMOS	BOTTOM	BALL	260	1	1 mm	compliant	165	R-PBGA-B165	Not Qualified		2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V	36 Mbit	2	SYNCHRONOUS	270 mA, 370 mA	4.2 ns	Flow-Through/Pipelined	2 M x 18	3-STATE	1.4 mm	18	21 Bit		36 Mbit	0.04 A	37748736 bit	Industrial	PARALLEL	COMMON	CACHE SRAM	2.3 V		15 mm	13 mm
	Mfr Part No GS864218GB-300	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	5.5 ns	GSI Technology		SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS864218GB-300	300 MHz	181.8@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR	2.3, 3 V	0 C	Yes	3	Surface Mount	SMD/SMT	18 Bit	4 MWords	4000000	70 °C		PLASTIC/EPOXY	BGA	BGA,		RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.17	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Commercial grade	0 to 70 °C	Tray	GS864218GB	e1	Yes	3A991.B.2.B	SCD/DCD Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	260	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified		2.7 V		COMMERCIAL	2.3 V	72 Mbit	2	SYNCHRONOUS	270 mA, 370 mA	5.5 ns	Flow-Through/Pipelined	4 M x 18		1.99 mm	18	22 Bit	SRAM	72 Mbit		75497472 bit	Commercial	PARALLEL		CACHE SRAM		SRAM	22 mm	14 mm
	Mfr Part No GS864436E-225V	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165				GSI Technology		SDR	15		Parallel	GSI Technology		225 MHz	153.8@Flow-Through/225@Pipelined MHz	2, 2.7 V	+ 70 C	SDR	1.7, 2.3 V	0 C	Yes		Surface Mount	SMD/SMT	36 Bit	2 MWords														N		FBGA	2.7 V	1.7 V		Synchronous	SyncBurst	1.8, 2.5 V	Commercial grade	0 to 70 °C	Tray	GS864436E				Synchronous Burst						Memory & Data Storage								165								72 Mbit	4		270 mA, 370 mA	6.5 ns	Flow-Through/Pipelined	2 M x 36				21 Bit	SRAM	72 Mbit			Commercial					SRAM
	Mfr Part No GS832218AB-375I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	4.2 ns	GSI Technology	375 MHz	SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS832218AB-375I	375 MHz	238@Flow-Through/375@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	2 MWords	2000000	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.11		No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 100 °C	Tray	GS832218AB	e0	No	3A991.B.2.B	Pipeline/Flow Through	Tin/Lead (Sn/Pb)			ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified		2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V	36 Mbit	2	SYNCHRONOUS	270 mA, 370 mA	4.2 ns	Flow-Through/Pipelined	2 M x 18	3-STATE	1.99 mm	18	21 Bit	SRAM	36 Mb	0.04 A	37748736 bit	Industrial	PARALLEL	COMMON	CACHE SRAM	2.3 V	SRAM	22 mm	14 mm
	Mfr Part No GS832118AGD-375I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-165	YES	165	4.5 ns	GSI Technology	375 MHz	SDR	18	GSI TECHNOLOGY	Parallel	GSI Technology	GS832118AGD-375I	375 MHz	238@Flow-Through/375@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	2 MWords	1000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.16	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 100 °C	Tray	GS832118AGD			3A991.B.2.B	Pipeline/Flow Through		100 °C	-40 °C	PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant	165	R-PBGA-B165	Not Qualified		2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V	36 Mbit	2	SYNCHRONOUS	270 mA, 370 mA	4.2 ns	Flow-Through/Pipelined	2 M x 18	3-STATE	1.4 mm	18	21 Bit	SRAM	36 Mbit	0.04 A	18874368 bit	Industrial	PARALLEL	COMMON	CACHE SRAM	2.3 V	SRAM	15 mm	13 mm	No
	Mfr Part No GS8640E18GT-300	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			TQFP-100				GSI Technology		SDR	18		Parallel	GSI Technology		300 MHz	181.8@Flow-Through/300@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR	2.3, 3 V	0 C	Yes		Surface Mount	SMD/SMT	18 Bit	4 MWords														Details		TQFP	3.6 V	2.3 V		Synchronous	SyncBurst	2.5, 3.3 V	Commercial grade	0 to 70 °C	Tray	GS8640E18GT				Pipeline/Flow Through						Memory & Data Storage								100								72 Mbit	2		270 mA, 370 mA	5.5 ns	Flow-Through/Pipelined	4 M x 18				22 Bit	SRAM	72 Mbit			Commercial					SRAM
	Mfr Part No GS864436E-225	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165				GSI Technology			15		Parallel	GSI Technology		225 MHz	153.8@Flow-Through/225@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR	2.3, 3 V	0 C	Yes			SMD/SMT	36 Bit															N		FBGA	3.6 V	2.3 V		Synchronous	SyncBurst	2.5, 3.3 V		0 to 70 °C	Tray	GS864436E				Synchronous Burst						Memory & Data Storage								165								72 Mbit			270 mA, 370 mA	6.5@Flow-Through/2.7		2 M x 36					SRAM			72						SRAM
	Mfr Part No GS832218AGD-375I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-165	YES	165	4.2 ns	GSI Technology	375 MHz	SDR	18	GSI TECHNOLOGY	Parallel	GSI Technology	GS832218AGD-375I	375 MHz		2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	18 Bit	2 MWords	2000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.11	Compliant	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 100 °C	Bulk	GS832218AGD	e1	Yes	3A991.B.2.B	Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C	ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	260	1	1 mm	compliant	165	R-PBGA-B165	Not Qualified		2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V	36 Mbit	2	SYNCHRONOUS	270 mA, 370 mA	4.2 ns	Flow-Through/Pipelined	2 M x 18	3-STATE	1.4 mm	18	21 b	SRAM	36 Mbit	0.04 A	37748736 bit	Industrial	PARALLEL	COMMON	CACHE SRAM	2.3 V	SRAM	15 mm	13 mm	No
	Mfr Part No GS864018GT-300	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	TQFP-100	YES	100	5.5 ns					GSI TECHNOLOGY	Parallel	GSI Technology	GS864018GT-300	300 MHz	181.8@Flow-Through/300@Pipelined MHz	3.6 V	+ 70 C		3 V	0 C		3		SMD/SMT	18 Bit	4194304 words	4000000	70 °C		PLASTIC/EPOXY	LQFP	LQFP,		RECTANGULAR	FLATPACK, LOW PROFILE	Active	QFP	NOT SPECIFIED	5.37	Compliant	Yes		3.6 V	2.3 V	2.5 V			3.3000 V	Commercial grade	0 to 70 °C		GS864018GT	e3	Yes	3A991.B.2.B		PURE MATTE TIN	70 °C	0 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41		CMOS	QUAD	GULL WING	260	1	0.65 mm	compliant	100	R-PQFP-G100	Not Qualified	3.3 V	2.7 V		COMMERCIAL	2.3 V	72 Mbit	2	SYNCHRONOUS	270 mA, 370 mA	5.5@Flow-Through/2.3		4 M x 18		1.6 mm	18	22 b		72 Mb		72	Commercial	PARALLEL		CACHE SRAM			20 mm	14 mm	No
	Mfr Part No GS8322Z18AD-375I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-165	YES	165	4.2 ns	GSI Technology	375 MHz	SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8322Z18AD-375I	375 MHz	238@Flow-Through/375@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	2 MWords	2000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.13	Compliant	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 100 °C	Tray	GS8322Z18AD	e0	No	3A991.B.2.B	NBT Pipeline/Flow Through	Tin/Lead (Sn/Pb)	100 °C	-40 °C	ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant	165	R-PBGA-B165	Not Qualified		2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V	36 Mbit	2	SYNCHRONOUS	270 mA, 370 mA	4.2 ns	Flow-Through/Pipelined	2 M x 18	3-STATE	1.4 mm	18	21 Bit	SRAM	36 Mbit	0.04 A	37748736 bit	Industrial	PARALLEL	COMMON	ZBT SRAM	2.3 V	SRAM	15 mm	13 mm	No

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