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The category is 'Memory'

Memory (10)

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Factory Pack QuantityFactory Pack Quantity
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Supply Current-Max

Supply Current-Max:
280 mA, 360 mA

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Factory Lead Time	Package / Case	Surface Mount	Number of Terminals	Access Time-Max	Brand	Clock Frequency-Max (fCLK)	Data Rate Architecture	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Clock Rate	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of I/O Lines	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Timing Type	Tradename	Typical Operating Supply Voltage	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Memory Size	Number of Ports	Operating Mode	Supply Current-Max	Access Time	Architecture	Organization	Output Characteristics	Seated Height-Max	Memory Width	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Standby Voltage-Min	Product Category	Length	Width	Radiation Hardening
	Mfr Part No GS864272GC-167IV	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-209				GSI Technology		SDR	14		Parallel	GSI Technology		167 MHz	125@Flow-Through/167@Pipelined MHz	2, 2.7 V	+ 85 C	SDR	1.7, 2.3 V	- 40 C	Yes		Surface Mount	SMD/SMT	72 Bit	1 MWords														Details		FBGA	2.7 V	1.7 V		Synchronous	SyncBurst	1.8, 2.5 V	Industrial grade	-40 to 85 °C	Tray	GS864272GC				SCD/DCD Pipeline/Flow Through						Memory & Data Storage								209							72 Mbit	8		280 mA, 360 mA	8 ns	Flow-Through/Pipelined	1 M x 72				20 Bit	SRAM	72 Mbit			Industrial					SRAM
	Mfr Part No GS8322Z36B-225M	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-119							14		Parallel			225 MHz			+ 125 C	SDR		- 55 C				SMD/SMT																			3.6 V	2.3 V												NBT Pipeline/Flow Through																					36 Mbit			280 mA, 360 mA	7 ns		1 M x 36
	Mfr Part No GS8322Z36E-225M	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-165							14		Parallel			225 MHz			+ 125 C	SDR		- 55 C				SMD/SMT																			3.6 V	2.3 V												NBT Pipeline/Flow Through																					36 Mbit			280 mA, 360 mA	7 ns		1 M x 36
	Mfr Part No GS8642Z72C-167I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	8 ns	GSI Technology	167 MHz	SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8642Z72C-167I	167 MHz	125@Flow-Through/167@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	1 MWords	1000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA, BGA209,11X19,40	BGA209,11X19,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.18	Compliant	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS8642Z72C		No	3A991.B.2.B	NBT Pipeline/Flow Through		85 °C	-40 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V	72 Mbit	8	SYNCHRONOUS	280 mA, 360 mA	8 ns	Flow-Through/Pipelined	1 M x 72	3-STATE	1.7 mm	72	20 Bit	SRAM	72 Mbit	0.12 A	75497472 bit	Industrial	PARALLEL	COMMON	ZBT SRAM	2.3 V	SRAM	22 mm	14 mm	No
	Mfr Part No GS8642Z72GC-167IV	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	8 ns	GSI Technology		SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8642Z72GC-167IV	167 MHz	125@Flow-Through/167@Pipelined MHz	2, 2.7 V	+ 85 C	SDR	1.7, 2.3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	1 MWords	1000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	1.5	Compliant	Yes	FBGA	2.7 V	1.7 V	1.8 V	Synchronous	NBT SRAM	1.8, 2.5 V	Industrial grade	-40 to 85 °C	Tray	GS8642Z72GC	e1	Yes	3A991.B.2.B	NBT Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	-40 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	260	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2 V		INDUSTRIAL	1.7 V	72 Mbit	8	SYNCHRONOUS	280 mA, 360 mA	8 ns	Flow-Through/Pipelined	1 M x 72		1.7 mm	72	20 Bit	SRAM	72 Mbit		75497472 bit	Industrial	PARALLEL		ZBT SRAM		SRAM	22 mm	14 mm	No
	Mfr Part No GS8642Z72GC-167I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	8 ns	GSI Technology	167 MHz		14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8642Z72GC-167I	167 MHz	125@Flow-Through/167@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	3		SMD/SMT	72 Bit	1048576 words	1000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA, BGA209,11X19,40	BGA209,11X19,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.18	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS8642Z72GC	e1	Yes	3A991.B.2.B	NBT Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	260	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V	72 Mbit		SYNCHRONOUS	280 mA, 360 mA	8@Flow-Through/3.5@P		1 M x 72	3-STATE	1.7 mm	72		SRAM		0.12 A	72	Industrial	PARALLEL	COMMON	ZBT SRAM	2.3 V	SRAM	22 mm	14 mm
	Mfr Part No GS864272C-167I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	8 ns	GSI Technology		SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS864272C-167I	167 MHz	125@Flow-Through/167@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	1 MWords	1000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.18		No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS864272C		No	3A991.B.2.B	SCD/DCD Pipeline/Flow Through				FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2.7 V		INDUSTRIAL	2.3 V	72 Mbit	8	SYNCHRONOUS	280 mA, 360 mA	8 ns	Flow-Through/Pipelined	1 M x 72		1.7 mm	72	20 Bit	SRAM	72 Mbit		75497472 bit	Industrial	PARALLEL		CACHE SRAM		SRAM	22 mm	14 mm
	Mfr Part No GS8642Z72C-167IV	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	8 ns	GSI Technology		SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8642Z72C-167IV	167 MHz	125@Flow-Through/167@Pipelined MHz	2, 2.7 V	+ 85 C	SDR	1.7, 2.3 V	- 40 C	Yes		Surface Mount	SMD/SMT	72 Bit	1 MWords	1000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.18		No	FBGA	2.7 V	1.7 V	1.8 V	Synchronous	NBT SRAM	1.8, 2.5 V	Industrial grade	-40 to 85 °C	Tray	GS8642Z72C		No	3A991.B.2.B	NBT Pipeline/Flow Through				FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2 V		INDUSTRIAL	1.7 V	72 Mbit	8	SYNCHRONOUS	280 mA, 360 mA	8 ns	Flow-Through/Pipelined	1 M x 72		1.7 mm	72	20 Bit	SRAM	72 Mbit		75497472 bit	Industrial	PARALLEL		ZBT SRAM		SRAM	22 mm	14 mm
	Mfr Part No GS864272C-167IV	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-209	YES	209	8 ns	GSI Technology		SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS864272C-167IV	167 MHz	125@Flow-Through/167@Pipelined MHz	2, 2.7 V	+ 85 C	SDR	1.7, 2.3 V	- 40 C	Yes		Surface Mount	SMD/SMT	72 Bit	1 MWords	1000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA,		RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.18		No	FBGA	2.7 V	1.7 V	1.8 V	Synchronous	SyncBurst	1.8, 2.5 V	Industrial grade	-40 to 85 °C	Tray	GS864272C		No	3A991.B.2.B	SCD/DCD Pipeline/Flow Through				FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant	209	R-PBGA-B209	Not Qualified	2 V		INDUSTRIAL	1.7 V	72 Mbit	8	SYNCHRONOUS	280 mA, 360 mA	8 ns	Flow-Through/Pipelined	1 M x 72		1.7 mm	72	20 Bit	SRAM	72 Mbit		75497472 bit	Industrial	PARALLEL		CACHE SRAM		SRAM	22 mm	14 mm
	Mfr Part No GS864272GC-167I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-209				GSI Technology			14		Parallel	GSI Technology		167 MHz	125@Flow-Through/167@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes			SMD/SMT	72 Bit															Details		FBGA	3.6 V	2.3 V		Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS864272GC				SCD/DCD Pipeline/Flow Through		85 °C	-40 °C			Memory & Data Storage								209							72 Mbit	8		280 mA, 360 mA	8@Flow-Through/3.5@P		1 M x 72				20 b	SRAM	72 Mb		72	Industrial					SRAM			No