The category is 'Memory'
Memory (2)
- All Manufacturers
- Access Time
- Address Bus Width
- Architecture
- Brand
- Data Rate Architecture
- Density
- Factory Pack QuantityFactory Pack Quantity
- Interface Type
- Manufacturer
- Max Operating Temperature
- Maximum Clock Rate
- Supply Current-Max
- Supply Current-Max:
300 mA, 390 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Brand | Clock Frequency-Max (fCLK) | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | ECCN Code | Type | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Supply Current-Max | Access Time | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Product Category | Length | Width | Radiation Hardening |
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 | Mfr Part No GS8322Z72C-225M | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 4.4 ns | GSI Technology | 225 MHz | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8322Z72C-225M | 225 MHz | 143@Flow-Through/225@Pipelined MHz | 2.7, 3.6 V | + 125 C | SDR | 2.3, 3 V | - 55 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | 512000 | 125 °C | -55 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA209,11X19,40 | BGA209,11X19,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | 5.16 | N | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | Military grade | -55 to 125 °C | Tray | GS8322Z72C | 3A991.B.2.B | NBT Pipeline/Flow Through | 125 °C | -55 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | 2.5/3.3 V | MILITARY | 2.3 V | 36 Mbit | 8 | SYNCHRONOUS | 300 mA, 390 mA | 7 ns | Flow-Through/Pipelined | 512 k x 72 | 3-STATE | 1.7 mm | 72 | 19 Bit | SRAM | 36 Mbit | 0.2 A | 37748736 bit | Military | PARALLEL | COMMON | ZBT SRAM | 2.3 V | SRAM | 22 mm | 14 mm | No | |
| Mfr Part No GS832272C-225M | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 14 | Parallel | GSI Technology | 225 MHz | 143@Flow-Through/225@Pipelined MHz | 2.7, 3.6 V | + 125 C | SDR | 2.3, 3 V | - 55 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | Compliant | FBGA | 3.6 V | 2.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | Military grade | -55 to 125 °C | Tray | GS832272C | Synchronous Burst | 125 °C | -55 °C | Memory & Data Storage | 209 | 36 Mbit | 8 | 300 mA, 390 mA | 7 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Military | SRAM | No |