The category is 'Memory'

  • All Manufacturers
  • Access Time
  • Address Bus Width
  • Architecture
  • Data Rate Architecture
  • Density
  • Ihs Manufacturer
  • Interface Type
  • Manufacturer
  • Manufacturer Part Number
  • Maximum Clock Frequency
  • Maximum Operating Temperature
  • Supply Current-Max
  • Supply Current-Max:

    300 mA, 435 mA

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Factory Lead Time

Package / Case

Surface Mount

Number of Terminals

Access Time-Max

Brand

Data Rate Architecture

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

Interface Type

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Clock Rate

Maximum Operating Supply Voltage

Maximum Operating Temperature

Memory Types

Minimum Operating Supply Voltage

Minimum Operating Temperature

Moisture Sensitive

Mounting

Mounting Styles

Number of I/O Lines

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Supplier Package

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom (Vsup)

Timing Type

Tradename

Typical Operating Supply Voltage

Usage Level

Operating Temperature

Packaging

Series

Pbfree Code

ECCN Code

Type

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Temperature Grade

Supply Voltage-Min (Vsup)

Memory Size

Number of Ports

Operating Mode

Supply Current-Max

Access Time

Architecture

Organization

Seated Height-Max

Memory Width

Address Bus Width

Product Type

Density

Memory Density

Screening Level

Parallel/Serial

Memory IC Type

Product Category

Length

Width

Radiation Hardening

GS8642Z36B-250M

Mfr Part No

GS8642Z36B-250M

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

BGA-119

YES

119

6.5 ns

SDR

GSI TECHNOLOGY

Parallel

GSI Technology

GS8642Z36B-250M

250 MHz

153.8@Flow-Through/250@Pipelined MHz

2.7, 3.6 V

+ 125 C

2.3, 3 V

- 55 C

Surface Mount

SMD/SMT

36 Bit

2 MWords

2000000

125 °C

-55 °C

PLASTIC/EPOXY

BGA

BGA,

RECTANGULAR

GRID ARRAY

Active

BGA

NOT SPECIFIED

5.74

No

FBGA

3.6 V

2.3 V

2.5 V

Synchronous

2.5, 3.3 V

Military grade

-55 to 125 °C

GS8642Z36B

3A991.B.2.B

FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3.3V SUPPLY

8542.32.00.41

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1.27 mm

compliant

119

R-PBGA-B119

Not Qualified

2.7 V

MILITARY

2.3 V

72 Mbit

4

SYNCHRONOUS

300 mA, 435 mA

6.5 ns

Flow-Through/Pipelined

2MX36

1.99 mm

36

21 Bit

72 Mbit

75497472 bit

Military

PARALLEL

ZBT SRAM

22 mm

14 mm

GS864236B-250M

Mfr Part No

GS864236B-250M

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-119

GSI Technology

SDR

14

GSI TECHNOLOGY

Parallel

GSI Technology

GS864236B-250M

250 MHz

2.7, 3.6 V

+ 125 C

SDR

2.3, 3 V

- 55 C

Yes

Surface Mount

SMD/SMT

36 Bit

2 MWords

BGA, BGA119,7X17,50

Active

BGA

Compliant

No

FBGA

3.6 V

2.3 V

Synchronous

SyncBurst

2.5, 3.3 V

Military grade

-55 to 125 °C

Tray

GS864236B

No

SCD/DCD Pipeline/Flow Through

125 °C

-55 °C

Memory & Data Storage

119

72 Mbit

4

300 mA, 435 mA

6.5 ns

Flow-Through/Pipelined

2 M x 36

21 b

SRAM

72 Mbit

Military

SRAM

No