The category is 'Memory'

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  • Supply Current-Max:

    300 mA

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Factory Lead Time

Mounting Type

Package / Case

Surface Mount

Supplier Device Package

Number of Terminals

Access Time-Max

Base Product Number

Brand

Clock Frequency-Max

Data Rate Architecture

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

Interface Type

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Clock Rate

Maximum Operating Temperature

Memory Types

Mfr

Minimum Operating Temperature

Moisture Sensitive

Moisture Sensitivity Levels

Mounting

Mounting Styles

Number of I/O Lines

Number of Words

Number of Words Code

Operating Temperature-Max

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Product Status

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Supplier Package

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Supply Voltage-Nom (Vsup)

Timing Type

Tradename

Typical Operating Supply Voltage

Unit Weight

Usage Level

Operating Temperature

Packaging

Series

JESD-609 Code

Pbfree Code

ECCN Code

Type

Terminal Finish

Additional Feature

HTS Code

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Memory Size

Number of Ports

Operating Mode

uPs/uCs/Peripheral ICs Type

Clock Frequency

Supply Current-Max

Bit Size

Access Time

Memory Format

Data Rate

Memory Interface

Architecture

Organization

Seated Height-Max

Memory Width

Write Cycle Time - Word, Page

Address Bus Width

Product Type

Density

Memory Density

On Chip Program ROM Width

Boundary Scan

Low Power Mode

Screening Level

Parallel/Serial

External Data Bus Width

Format

Memory IC Type

Integrated Cache

RAM (words)

Number of Timers

ROM Programmability

Number of External Interrupts

Barrel Shifter

Internal Bus Architecture

On Chip Data RAM Width

Number of DMA Channels

Product Category

Memory Organization

Length

Width

DSPIC33EP256MC506T-H/PT

Mfr Part No

DSPIC33EP256MC506T-H/PT

Microchip Datasheet

-

-

Min: 1

Mult: 1

13 Weeks

YES

64

60 MHz

MICROCHIP TECHNOLOGY INC

Microchip Technology Inc

DSPIC33EP256MC506T-H/PT

PLASTIC/EPOXY

TFQFP

TFQFP, TQFP64,.47SQ

TQFP64,.47SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Active

5.07

3.6 V

3 V

3.3 V

Automotive grade

CMOS

QUAD

GULL WING

0.5 mm

compliant

S-PQFP-G64

DIGITAL SIGNAL PROCESSOR, OTHER

300 mA

16

1.2 mm

8

YES

NO

TS 16949

FLOATING POINT

NO

16384

5

FLASH

3

YES

MULTIPLE

8

4

12 mm

12 mm

CY7C1382D-200AXC

Mfr Part No

CY7C1382D-200AXC

Infineon Technologies Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

TQFP-100

100-TQFP (14x20)

CY7C1382

72

Parallel

200 MHz

+ 70 C

SDR

Infineon Technologies

0 C

Yes

SMD/SMT

Tray

Obsolete

Details

3.6 V

3.135 V

0.023175 oz

0°C ~ 70°C (TA)

Tray

CY7C1382D

Synchronous

SRAM - Synchronous, SDR

3.135V ~ 3.6V

18 Mbit

2

200 MHz

300 mA

3 ns

SRAM

SDR

Parallel

1 M x 18

-

1M x 18

DSPIC33EP512MC504-H/MV

Mfr Part No

DSPIC33EP512MC504-H/MV

Microchip Datasheet

-

-

Min: 1

Mult: 1

YES

48

60 MHz

MICROCHIP TECHNOLOGY INC

Microchip Technology Inc

DSPIC33EP512MC504-H/MV

PLASTIC/EPOXY

HVQCCN

HVQCCN, LCC48,.24SQ,16

LCC48,.24SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Active

5.38

3.6 V

3 V

3.3 V

Automotive grade

CMOS

QUAD

NO LEAD

0.4 mm

compliant

S-PQCC-N48

DIGITAL SIGNAL PROCESSOR, OTHER

300 mA

16

0.55 mm

8

YES

NO

TS 16949

FLOATING POINT

NO

2048

5

FLASH

3

YES

MULTIPLE

8

4

6 mm

6 mm

NS32202D10

Mfr Part No

NS32202D10

National Semiconductor Datasheet

-

-

Min: 1

Mult: 1

NO

40

NATIONAL SEMICONDUCTOR CORP

National Semiconductor Corporation

NS32202D-10

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP, DIP40,.6

DIP40,.6

RECTANGULAR

IN-LINE

Obsolete

NOT SPECIFIED

8.8

Non-Compliant

No

5.25 V

4.75 V

5 V

e0

Tin/Lead (Sn/Pb)

Interrupt Controllers

CMOS

DUAL

THROUGH-HOLE

NOT SPECIFIED

2.54 mm

unknown

R-CDIP-T40

Not Qualified

5 V

COMMERCIAL

INTERRUPT CONTROLLER

300 mA

5.08 mm

8

16

15.24 mm

GS8640FZ36GT-5.5

Mfr Part No

GS8640FZ36GT-5.5

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

TQFP-100

YES

100

5.5 ns

GSI Technology

SDR

18

GSI TECHNOLOGY

Parallel

GSI Technology

GS8640FZ36GT-5.5

181.8 MHz

+ 70 C

SDR

0 C

Yes

3

Surface Mount

SMD/SMT

36 Bit

2 MWords

2000000

70 °C

PLASTIC/EPOXY

LQFP

LQFP,

RECTANGULAR

FLATPACK, LOW PROFILE

Active

QFP

NOT SPECIFIED

5.6

Details

Yes

TQFP

3.6 V

2.3 V

2.5 V

Synchronous

NBT SRAM

3.3000 V

Commercial grade

0 to 70 °C

Tray

GS8640FZ36GT

e3

Yes

3A991.B.2.B

NBT Flow Through

Matte Tin (Sn)

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY.

8542.32.00.41

Memory & Data Storage

CMOS

QUAD

GULL WING

260

1

0.65 mm

compliant

100

R-PQFP-G100

Not Qualified

2.75 V

COMMERCIAL

2.25 V

72 Mbit

4

SYNCHRONOUS

300 mA

5.5 ns

Flow-Through

2 M x 36

1.6 mm

36

21 Bit

SRAM

72 Mbit

75497472 bit

Commercial

PARALLEL

ZBT SRAM

SRAM

20 mm

14 mm