The category is 'Memory'
Memory (1)
- All Manufacturers
- Access Time
- Access Time-Max
- Base Product Number
- ECCN Code
- Factory Pack QuantityFactory Pack Quantity
- HTS Code
- I/O Type
- Ihs Manufacturer
- Interface Type
- JESD-30 Code
- Length
- Supply Current-Max
- Supply Current-Max:
9 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Tradename | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Type | Terminal Finish | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Mode | Supply Current-Max | Access Time | Memory Format | Memory Interface | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Memory Organization | Length | Width |
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 | Mfr Part No CY62187EV30LL-55BAXI | Infineon Technologies | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-48 | YES | 48-FBGA (8x9.5) | 48 | 55 ns | CY62187 | 420 | CYPRESS SEMICONDUCTOR CORP | Parallel | CY62187EV30LL-55BAXI | - | + 85 C | Volatile | Infineon Technologies | - 40 C | Yes | 3 | SMD/SMT | 4194304 words | 4000000 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA48,6X8,30 | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | BGA | Active | 40 | 1.39 | Details | Yes | 3.6 V | 2.2 V | 3 V | MoBL | 0.004677 oz | -40°C ~ 85°C (TA) | Tray | CY62187EV30LL | e1 | 3A991.B.2.A | Asynchronous | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.41 | SRAM - Asynchronous | 2.2V ~ 3.7V | BOTTOM | BALL | 260 | 1 | 0.75 mm | compliant | 48 | R-PBGA-B48 | Not Qualified | 3.7 V | 2.5/3.3 V | INDUSTRIAL | 2.2 V | 64 Mbit | ASYNCHRONOUS | 9 mA | 55 ns | SRAM | Parallel | 4 M x 16 | 3-STATE | 1.5 mm | 16 | 55ns | 0.000048 A | 67108864 bit | PARALLEL | COMMON | STANDARD SRAM | 1.5 V | 4M x 16 | 9.5 mm | 8 mm |