The category is 'PMIC - Thermal Management'
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- Package / Case:
8-WFDFN Exposed Pad
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Base Product Number | Brand | Factory Pack QuantityFactory Pack Quantity | Interface Type | Manufacturer | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Mounting Styles | MSL | Package | Product Status | RoHS | Supply Voltage-Max | Supply Voltage-Min | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Subcategory | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Reach Compliance Code | Base Part Number | Function | Body Length or Diameter | Body Breadth | Output Type | Operating Supply Voltage | Power Supplies | Configuration | Interface | Max Supply Voltage | Min Supply Voltage | Termination Type | Number of Bits | Accuracy | Topology | Resolution | Product Type | Sensor Type | Memory IC Type | Sensors/Transducers Type | Housing | Source Url Status Check Date | Output Interface Type | Product | Output Alarm | Sensing Temperature | Output Fan | Shutdown | Product Category | Body Height | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No MCP98242T-BE/MNYBA2 | Microchip Technology | Datasheet | 1760 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 8-WFDFN Exposed Pad | 8 | -40°C~125°C | Tape & Reel (TR) | 2009 | Active | 1 (Unlimited) | 3V~3.6V | MCP98242 | Temp Monitoring System (Sensor), DIMM DDR Memory | I2C/SMBus | 2-Wire, I2C, SMBus, Serial | ±3°C(Max) | ADC (Sigma Delta), Register Bank | Internal | Yes | -40°C~125°C | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCP9805T-BE/MNY | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 8-WFDFN Exposed Pad | 8 | -40°C~125°C | Tape & Reel (TR) | 2005 | Active | 1 (Unlimited) | 3V~3.6V | MCP9805 | Temp Monitoring System (Sensor) | I2C/SMBus | 3.6V | 2-Wire, Serial | SOLDER | 10 | ±3°C(Max) | ADC (Sigma Delta), Register Bank | Internal | TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL | No | -40°C~125°C | Yes | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TSE2004GB2C0NCG8 | Renesas | Datasheet | 9 |
| Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | 8-VFQFPN (2x3) | Renesas Electronics | 2500 | 2-Wire, I2C, SMBus | Renesas Electronics | + 125 C | PEI-Genesis | - 40 C | SMD/SMT | MSL 1 - Unlimited | Bulk | Active | Details | 3.6 V | 2.2 V | 0.006307 oz | -40°C ~ 125°C | MouseReel | * | Sensors | 2.2V ~ 3.6V | Temp Monitoring System (Sensor) | Digital | +/- 2 C | ADC (Sigma Delta), Control Logic, Register Bank | 10 bit | Temperature Sensor ICs | Internal | Temperature Sensors | No | - | No | Shutdown | Board Mount Temperature Sensors | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No MAX6604ATA TW | Analog Devices | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | 8 | 8-TDFN (2x3) | MAX6604 | Analog Devices Inc./Maxim Integrated | Tape & Reel (TR) | Obsolete | Compliant | -20°C ~ 125°C | Tape and Reel | - | 125 °C | -20 °C | 2.7V ~ 3.6V | Temp Monitoring System (Sensor), DIMM DDR Memory | Digital, I2C | 3.6 V | 2-Wire, I2C, SMBus | ±3°C(Max) | - | 1.375 B | Internal | Yes | -20°C ~ 125°C | No | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MAX6604AATA T | Analog Devices | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | MAX6604 | 2-Wire, I2C, SMBus | + 125 C | Analog Devices Inc./Maxim Integrated | - 20 C | SMD/SMT | MSL 1 - Unlimited | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | 3.6 V | 2.7 V | -20°C ~ 125°C | - | 2.7V ~ 3.6V | Temp Monitoring System (Sensor), DIMM DDR Memory | 2-Wire Serial, I²C/SMBUS | Local | ±3°C(Max) | - | 11 bit | Internal | Yes | -20°C ~ 125°C | No | Shutdown | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TSE2004GB2C0NCG8/B | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | 8-VFQFPN (2x3) | Renesas Electronics America Inc | Bulk | Active | -40°C ~ 125°C | - | 2.2V ~ 3.6V | Temp Monitoring System (Sensor) | I²C/SMBus | ±2°C | ADC (Sigma Delta), Control Logic, Register Bank | Internal | No | - | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MAX6604ATA T | Analog Devices | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | MAX6604 | Analog Devices Inc./Maxim Integrated | Tape & Reel (TR) | Obsolete | -20°C ~ 125°C | - | 2.7V ~ 3.6V | Temp Monitoring System (Sensor), DIMM DDR Memory | 2-Wire Serial, I²C/SMBUS | ±3°C(Max) | - | Internal | Yes | -20°C ~ 125°C | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TSE2004GB2C0NCG8/M | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | 8-VFQFPN (2x3) | Renesas Electronics America Inc | Bulk | Active | -40°C ~ 125°C | - | 2.2V ~ 3.6V | Temp Monitoring System (Sensor) | I²C/SMBus | ±2°C | ADC (Sigma Delta), Control Logic, Register Bank | Internal | No | - | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No STTS424BDN3F | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 8-WFDFN Exposed Pad | 8 | -40°C~125°C | Tape & Reel (TR) | e4 | yes | Obsolete | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.7V~3.6V | DUAL | 260 | STTS424 | Temp Monitoring System (Sensor) | I2C/SMBus | 2-Wire, I2C, SMBus | ±3°C(Max) | ADC (Sigma Delta), Register Bank | 2 B | Internal | MEMORY CIRCUIT | Yes | -40°C~125°C | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCP98242T-CE/MNY | Microchip Technology | Datasheet | 1531 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 8-WFDFN Exposed Pad | 8 | 8-TDFN (2x3) | -40°C~125°C | Tape & Reel (TR) | 2009 | Obsolete | 1 (Unlimited) | 125°C | -40°C | 3V~3.6V | MCP98242 | Temp Monitoring System (Sensor), DIMM DDR Memory | I2C/SMBus | 3.3V | 2-Wire, I2C, SMBus, Serial | 3.6V | 3V | ±3°C(Max) | ADC (Sigma Delta), Register Bank | Internal | Yes | -40°C~125°C | Yes | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SE98ATP,147 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | -40°C~125°C | Tape & Reel (TR) | 2003 | Obsolete | 1 (Unlimited) | 1.7V~3.6V | unknown | SE98 | Temp Monitoring System (Sensor) | I2C/SMBus | ±4°C(Max) | ADC (Sigma Delta), Register Bank | Internal | 2013-06-14 00:00:00 | Yes | -40°C~125°C | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SE97TP/S900,547 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | -40°C~125°C | Tape & Reel (TR) | 2009 | Obsolete | 3 (168 Hours) | 3V~3.6V | unknown | SE97 | Temp Monitoring System (Sensor), DIMM DDR Memory | 2-Wire Serial, I2C/SMBUS | ±3°C | ADC (Sigma Delta), Comparator, Register Bank | Internal | Yes | -40°C~125°C | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SE97TP,128 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | YES | -40°C~125°C | Tape & Reel (TR) | 2009 | e3 | Obsolete | 1 (Unlimited) | Matte Tin (Sn) | 3V~3.6V | unknown | SE97 | Temp Monitoring System (Sensor), DIMM DDR Memory | 3mm | 2 mm | 2-Wire Serial, I2C/SMBUS | SOLDER | 11 | ±3°C | ADC (Sigma Delta), Comparator, Register Bank | Internal | TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL | PLASTIC | 2-WIRE INTERFACE | Yes | -40°C~125°C | 0.8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SE97TP,147 | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | -40°C~125°C | Tape & Reel (TR) | 2009 | Obsolete | 1 (Unlimited) | 3V~3.6V | unknown | SE97 | Temp Monitoring System (Sensor), DIMM DDR Memory | 2-Wire Serial, I2C/SMBUS | ±3°C | ADC (Sigma Delta), Comparator, Register Bank | Internal | Yes | -40°C~125°C | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TSE2002B3CNCG | Renesas Electronics America Inc. | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | -20°C~125°C | Tube | Obsolete | 3 (168 Hours) | 3V~3.6V | IDTTSE2002 | Temp Monitoring System (Sensor) | 2-Wire Serial, I2C/SMBUS | ±1°C(Max) | ADC (Sigma Delta), Control Logic, Register Bank | Internal | No | -20°C~125°C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MAX6604ATA TW | Maxim Integrated | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | YES | 8 | -20°C~125°C | Tape & Reel (TR) | 2011 | Obsolete | 1 (Unlimited) | 8 | 2.7V~3.6V | MAX6604 | Temp Monitoring System (Sensor), DIMM DDR Memory | 2-Wire Serial, I2C/SMBUS | 3.6V | 3/3.3V | 2-Wire, I2C, SMBus | ±3°C(Max) | 1.375 B | Internal | TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL | Yes | -20°C~125°C | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TSE2002B3CNCG8 | Renesas Electronics America Inc. | Datasheet | 2230 |
| Min: 1 Mult: 1 | Surface Mount | 8-WFDFN Exposed Pad | -20°C~125°C | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | 3V~3.6V | IDTTSE2002 | Temp Monitoring System (Sensor) | 2-Wire Serial, I2C/SMBUS | ±1°C(Max) | ADC (Sigma Delta), Control Logic, Register Bank | Internal | No | -20°C~125°C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MAX6604ATA T | Maxim Integrated | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 8-WFDFN Exposed Pad | 8 | -20°C~125°C | Tape & Reel (TR) | 2011 | e3 | Obsolete | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.7V~3.6V | MAX6604 | Temp Monitoring System (Sensor), DIMM DDR Memory | 3mm | 2 mm | 2-Wire Serial, I2C/SMBUS | 3.6V | 3/3.3V | 2-Wire, I2C, SMBus | SOLDER | 11 | ±3°C(Max) | 1.375 B | Internal | TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL | Yes | -20°C~125°C | No | 0.75mm | ROHS3 Compliant | Lead Free |
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MCP98242T-BE/MNYBA2
Microchip Technology
Package:PMIC - Thermal Management
Price: please inquire
-
MCP9805T-BE/MNY
Microchip Technology
Package:PMIC - Thermal Management
Price: please inquire
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TSE2004GB2C0NCG8
Renesas
Package:PMIC - Thermal Management
2.581969
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MAX6604ATA TW
Analog Devices
Package:PMIC - Thermal Management
Price: please inquire
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MAX6604AATA T
Analog Devices
Package:PMIC - Thermal Management
Price: please inquire
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TSE2004GB2C0NCG8/B
Renesas
Package:PMIC - Thermal Management
Price: please inquire
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MAX6604ATA T
Analog Devices
Package:PMIC - Thermal Management
Price: please inquire
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TSE2004GB2C0NCG8/M
Renesas
Package:PMIC - Thermal Management
Price: please inquire
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STTS424BDN3F
STMicroelectronics
Package:PMIC - Thermal Management
Price: please inquire
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MCP98242T-CE/MNY
Microchip Technology
Package:PMIC - Thermal Management
1.234295
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SE98ATP,147
NXP USA Inc.
Package:PMIC - Thermal Management
Price: please inquire
-
SE97TP/S900,547
NXP USA Inc.
Package:PMIC - Thermal Management
Price: please inquire
-
SE97TP,128
NXP USA Inc.
Package:PMIC - Thermal Management
Price: please inquire
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SE97TP,147
NXP USA Inc.
Package:PMIC - Thermal Management
Price: please inquire
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TSE2002B3CNCG
Renesas Electronics America Inc.
Package:PMIC - Thermal Management
Price: please inquire
-
MAX6604ATA TW
Maxim Integrated
Package:PMIC - Thermal Management
Price: please inquire
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TSE2002B3CNCG8
Renesas Electronics America Inc.
Package:PMIC - Thermal Management
1.715726
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MAX6604ATA T
Maxim Integrated
Package:PMIC - Thermal Management
Price: please inquire