The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
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- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Ihs Manufacturer | Mfr | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Power Supplies | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Supply Current-Max | Bit Size | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of External Interrupts | Security Features | Display & Interface Controllers | SATA | Length | Width |
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![]() | Mfr Part No P5010NXE1QMB | Freescale | Datasheet | 2392 |
| Min: 1 Mult: 1 | Surface Mount | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) | P5010 | Freescale Semiconductor | Bulk | Active | -40°C ~ 105°C (TA) | QorIQ P5 | 2.0GHz | PowerPC e5500 | - | 1Gbps (5), 10Gbps (1) | 1 Core, 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I²C, MMC/SD, SPI | Security; SEC 4.2 | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | - | SATA 3Gbps (2) | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No T2081NSE8TTB | Freescale | Datasheet | 1864 |
| Min: 1 Mult: 1 | Freescale Semiconductor | Bulk | Active | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IBMPPC750GXECR5092T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No R65C02P3 | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 3 MHz | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 40 | R-PDIP-T40 | Not Qualified | COMMERCIAL | 3 MHz | MICROPROCESSOR | 12 mA | 8 | 5.08 mm | 16 | NO | YES | 8 | FIXED POINT | NO | 0 | 2 | 52.07 mm | 15.24 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC823ZT25Z3 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | NXP SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 8542.31.00.01 | BOTTOM | BALL | unknown | S-PBGA-B256 | COMMERCIAL | 25 MHz | MICROPROCESSOR | 32 | YES | YES | FIXED POINT | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC823ZT25Z3 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | FREESCALE SEMICONDUCTOR INC | 70 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | 8542.31.00.01 | BOTTOM | BALL | unknown | S-PBGA-B256 | COMMERCIAL | 25 MHz | MICROPROCESSOR | 32 | YES | YES | FIXED POINT | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IDT79R3052E-40MJ | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 80 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 1 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC84,1.2SQ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | QFN | No | 5.25 V | 4.75 V | 5 V | e0 | No | 3A991.A.2 | TIN LEAD | 35 DHYRSTONE MIPS; BURST BUS; 5 PIPELINE STAGES | 8542.31.00.01 | QUAD | J BEND | 225 | 1.27 mm | not_compliant | 30 | 84 | S-PQCC-J84 | Not Qualified | COMMERCIAL | 40 MHz | MICROPROCESSOR, RISC | 500 mA | 32 | 4.57 mm | 32 | NO | NO | 32 | FIXED POINT | NO | 0 | 6 | 29.083 mm | 29.083 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No S3C44B0X01 | Samsung Semiconductor | Datasheet | 2 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TS68HC811E2MC | Thomson-CSF Compsants Specific | Datasheet | - | - | Min: 1 Mult: 1 | THOMSON-CSF COMPSANTS SPECIFIC | , | Obsolete | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC862SRCZP66 | Motorola Mobility LLC | Datasheet | 9216 | - | Min: 1 Mult: 1 | YES | 357 | 66 MHz | MOTOROLA INC | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA357,19X19,50 | BGA357,19X19,50 | SQUARE | GRID ARRAY | Obsolete | BGA | 3.465 V | 3.135 V | 3.3 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 357 | S-PBGA-B357 | Not Qualified | 66 MHz | MICROPROCESSOR, RISC | 32 | 2.05 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 25 mm | 25 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SCIMX6U6AVM083CR | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SC2200UFH-266BF | AMD | Datasheet | 197 | - | Min: 1 Mult: 1 | YES | 481 | 27 MHz | ADVANCED MICRO DEVICES INC | 3 | 85 °C | PLASTIC/EPOXY | HBGA | LEAD FREE, MS-034BAU-1, BGU-481 | BGA481,31X31,50 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Obsolete | BGA | Yes | 1.89 V | 1.71 V | 1.8 V | e2 | 3A991.A.1 | TIN SILVER | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 481 | S-PBGA-B481 | Not Qualified | OTHER | 266 MHz | MICROPROCESSOR | 32 | 2.59 mm | 32 | YES | YES | 32 | FLOATING POINT | YES | 40 mm | 40 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No NSC800TD-4-MIL | National Semiconductor Corporation | Datasheet | 32 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NSC800TD-4-MIL | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 8 MHz | NATIONAL SEMICONDUCTOR CORP | 90 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | 5.5 V | 4.5 V | 5 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-CDIP-T40 | Not Qualified | OTHER | 4 MHz | MICROPROCESSOR | 8 | 5.08 mm | 16 | NO | YES | 8 | FIXED POINT | NO | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GX2-X28-TD | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 368 | ADVANCED MICRO DEVICES INC | PLASTIC/EPOXY | BGA | BGA368,26X26,50 | SQUARE | GRID ARRAY | Active | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | S-PBGA-B368 | Not Qualified | 366 MHz | MICROPROCESSOR, RISC | 32 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No HM1-6100-2 | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | INTERSIL CORP | 125 °C | -55 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T40 | Not Qualified | MILITARY | 2.5 MHz | MICROPROCESSOR, RISC | 12 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XPC8240RZU250D | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 352 | FREESCALE SEMICONDUCTOR INC | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352 | BGA352,26X26,50 | SQUARE | GRID ARRAY | Obsolete | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B352 | Not Qualified | 2.5,3.3 V | 250 MHz | MICROPROCESSOR, RISC | 32 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SAA7215HS/C2 | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | PHILIPS SEMICONDUCTORS | PLASTIC/EPOXY | QFP | QFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK | Transferred | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G208 | Not Qualified | CONSUMER CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PPC460EX-NUB800T | MACOM | Datasheet | - | - | Min: 1 Mult: 1 | YES | 728 | 100 MHz | M/A-COM TECHNOLOGY SOLUTIONS INC | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, PLASTIC, MS-034, TEEBGA-728 | SQUARE | GRID ARRAY | Obsolete | Yes | 1.3 V | 1.2 V | 1.25 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | NOT SPECIFIED | S-PBGA-B728 | INDUSTRIAL | 800 MHz | MICROPROCESSOR, RISC | 2.65 mm | 32 | YES | YES | 32 | FLOATING POINT | YES | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPC8560VT833LC | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 783 | 166 MHz | ROCHESTER ELECTRONICS LLC | 3 | 105 °C | PLASTIC/EPOXY | BGA | 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783 | SQUARE | GRID ARRAY | Active | BGA | Yes | 1.26 V | 1.14 V | 1.2 V | e2 | No | TIN COPPER/TIN SILVER | BOTTOM | BALL | 260 | 1 mm | unknown | 40 | 783 | S-PBGA-B783 | COMMERCIAL | OTHER | 833 MHz | MICROPROCESSOR, RISC | 32 | 3.85 mm | 64 | YES | YES | 64 | FIXED POINT | YES | 29 mm | 29 mm |
P5010NXE1QMB
Freescale
Package:Embedded - Microprocessors
534.429445
T2081NSE8TTB
Freescale
Package:Embedded - Microprocessors
309.987761
IBMPPC750GXECR5092T
IBM
Package:Embedded - Microprocessors
Price: please inquire
R65C02P3
Conexant Systems Inc
Package:Embedded - Microprocessors
Price: please inquire
XPC823ZT25Z3
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
XPC823ZT25Z3
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
IDT79R3052E-40MJ
Integrated Device Technology Inc
Package:Embedded - Microprocessors
Price: please inquire
S3C44B0X01
Samsung Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
TS68HC811E2MC
Thomson-CSF Compsants Specific
Package:Embedded - Microprocessors
Price: please inquire
XPC862SRCZP66
Motorola Mobility LLC
Package:Embedded - Microprocessors
Price: please inquire
SCIMX6U6AVM083CR
NXP Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
SC2200UFH-266BF
AMD
Package:Embedded - Microprocessors
Price: please inquire
NSC800TD-4-MIL
National Semiconductor Corporation
Package:Embedded - Microprocessors
Price: please inquire
NSC800TD-4-MIL
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
GX2-X28-TD
AMD
Package:Embedded - Microprocessors
Price: please inquire
HM1-6100-2
Intersil Corporation
Package:Embedded - Microprocessors
Price: please inquire
XPC8240RZU250D
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
SAA7215HS/C2
Philips Semiconductors
Package:Embedded - Microprocessors
Price: please inquire
PPC460EX-NUB800T
MACOM
Package:Embedded - Microprocessors
Price: please inquire
MPC8560VT833LC
Rochester Electronics LLC
Package:Embedded - Microprocessors
Price: please inquire
