The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Clock Frequency-Max | Frequency(Max) | Ihs Manufacturer | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Max Supply Voltage | Min Supply Voltage | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Supply Current-Max | Bit Size | Access Time | Data Bus Width | Halogen Free | Seated Height-Max | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Bus Compatibility | Security Features | Display & Interface Controllers | SATA | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No X6589-R6-C | ATGBICS | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XPC823VF66B2 | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | MOTOROLA INC | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | 3.6 V | 3 V | 3.3 V | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B256 | Not Qualified | COMMERCIAL | 66 MHz | MICROPROCESSOR, RISC | 32 | 1.75 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XPC823VF66B2 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | MOTOROLA SEMICONDUCTOR PRODUCTS | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | 3.3 V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 3.3 V | COMMERCIAL | 66 MHz | MICROPROCESSOR, RISC | 32 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NQ80332M667 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TMS8080ANL | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | TEXAS INSTRUMENTS INC | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 8542.31.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | NOT SPECIFIED | R-PDIP-T40 | Not Qualified | COMMERCIAL | MICROPROCESSOR, RISC | 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68881FN12B | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 12 MHz | MOTOROLA SEMICONDUCTOR PRODUCTS | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC(UNSPEC) | LDCC(UNSPEC) | CHIP CARRIER | Obsolete | No | 5.25 V | 4.75 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | unknown | Not Qualified | COMMERCIAL | MATH PROCESSOR, FLOATING POINT ACCELERATOR | 150 mA | 6 | NO | 32 | MC68020 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TS68882MR25 | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | ATMEL CORP | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, PGA68,10X10 | PGA68,10X10 | SQUARE | GRID ARRAY | Transferred | PGA | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 68 | S-CPGA-P68 | Not Qualified | MILITARY | MATH PROCESSOR, COPROCESSOR | 136 mA | 4.184 mm | 26.92 mm | 26.92 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TS68882MR25 | Thomson Electron Tubes & Devices Corp | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | THOMSON ELECTRON TUBES & DEVICES CORP | 125 °C | -55 °C | CERAMIC | PGA | PGA, PGA68,10X10 | PGA68,10X10 | SQUARE | GRID ARRAY | Transferred | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | S-XPGA-P68 | Not Qualified | MILITARY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TC8087-2 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 8 MHz | INTEL CORP | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5.25 V | 4.75 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | INDUSTRIAL | MATH PROCESSOR, COPROCESSOR | 475 mA | 20 | NO | 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 79R3010A-20G | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 84 | 40 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 70 °C | CERAMIC | PGA | PGA84,12X12 | SQUARE | GRID ARRAY | Obsolete | No | 5.25 V | 4.75 V | 5 V | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | S-XPGA-P84 | Not Qualified | COMMERCIAL | MATH PROCESSOR, FLOATING POINT ACCELERATOR | 600 mA | NO | 32 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A06G033SGBA#BC0 | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 196-LFBGA | 196-LFBGA (12x12) | -40°C ~ 110°C (TJ) | Bulk | RZ/N1S | Obsolete | 500MHz | ARM® Cortex®-A7 | 3.3V | 10/100/1000Mbps (5) | 1 Core, 32-Bit | Yes | DDR2, DDR3 | USB 2.0 (2) | CANbus, I2C, SPI, UART | ARM® Cortex®-M3 | Secure JTAG | LCD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RK80546KG0801M | Intel | Datasheet | - | - | Min: 1 Mult: 1 | NO | 604 | 3GHz | e0 | 604 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 1.2V | 1.27mm | 604 | 1.2V | 3000 MHz | MICROPROCESSOR, RISC | 120000mA | 32 | No | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P2020NSE2NHC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Not For New Designs | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | YES | YES | FIXED POINT | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | Cryptography, Random Number Generator | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P3041NSN7NNC | NXP USA Inc. | Datasheet | 1923 |
| Min: 1 Mult: 1 | 12 Weeks | 1295-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P3 | e1 | Active | 3 (168 Hours) | 3A991.A.1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | P3041 | S-PBGA-B1295 | 1.05V | 0.95V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 133MHz | YES | YES | FIXED POINT | YES | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P2010NSN2KHC | NXP USA Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2010 | S-PBGA-B689 | 1.1V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 16 | YES | YES | 64 | FLOATING POINT | YES | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TMPR4938XBG-300 | Toshiba | Datasheet | 192 | - | Min: 1 Mult: 1 | 22 Weeks | Surface Mount | BGA | 484 | 300MHz | 2012 | yes | Discontinued | 484 | 3A001.A.3 | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1.5V | 1.27mm | 300MHz | 484 | 1.5V | 1.53.3V | COMMERCIAL | 1.6V | 1.4V | 64 | 64b | 20 | RISC | YES | YES | FLOATING POINT | YES | 2.46mm | 35mm | No | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R8A77430HA02BG#UA | Renesas Electronics America | Datasheet | 20 |
| Min: 1 Mult: 1 | 20 Weeks | yes | Active | 831 | 1.5GHz | DISPLAY CONTROLLER, CRT CHARACTER OR GRAPHICS DISPLAY | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IDT79RV4640-200DU | Renesas Electronics America Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 128-BQFP | 0°C~85°C TC | Tray | Obsolete | 3 (168 Hours) | IDT79RV4640 | 200MHz | MIPS-I | 3.3V | 1 Core 64-Bit | No | DRAM | System Control; CP0 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TN80960SA16 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 84-LCC (J-Lead) | 0°C~85°C TC | Tube | 1994 | i960 | Obsolete | 3 (168 Hours) | 16MHz | 5V | 16 μs | 5.0V | 1 Core 32-Bit | No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC7410RX500LE | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 360 | Bulk | e0 | 1 (Unlimited) | 360 | Tin/Lead (Sn/Pb) | 105°C | 0°C | BOTTOM | BALL | 245 | 1.8V | 500MHz | 30 | 360 | Not Qualified | MICROPROCESSOR, RISC | 32 | 500 μs | Halogen Free | 32 | PowerPC | YES | YES | 64 | FLOATING POINT | YES | 1 | 3.2mm | 25mm | 25mm | RoHS Compliant | Contains Lead |
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X6589-R6-C
ATGBICS
Package:Embedded - Microprocessors
Price: please inquire
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XPC823VF66B2
Motorola Semiconductor Products
Package:Embedded - Microprocessors
Price: please inquire
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XPC823VF66B2
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
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NQ80332M667
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
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TMS8080ANL
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MC68881FN12B
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
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TS68882MR25
Atmel Corporation
Package:Embedded - Microprocessors
Price: please inquire
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TS68882MR25
Thomson Electron Tubes & Devices Corp
Package:Embedded - Microprocessors
Price: please inquire
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TC8087-2
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
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79R3010A-20G
Integrated Device Technology Inc
Package:Embedded - Microprocessors
Price: please inquire
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R9A06G033SGBA#BC0
Renesas Electronics Corporation
Package:Embedded - Microprocessors
Price: please inquire
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RK80546KG0801M
Intel
Package:Embedded - Microprocessors
Price: please inquire
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P2020NSE2NHC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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P3041NSN7NNC
NXP USA Inc.
Package:Embedded - Microprocessors
474.702365
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P2010NSN2KHC
NXP USA Inc.
Package:Embedded - Microprocessors
Price: please inquire
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TMPR4938XBG-300
Toshiba
Package:Embedded - Microprocessors
Price: please inquire
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R8A77430HA02BG#UA
Renesas Electronics America
Package:Embedded - Microprocessors
91.693165
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IDT79RV4640-200DU
Renesas Electronics America Inc.
Package:Embedded - Microprocessors
Price: please inquire
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TN80960SA16
Intel
Package:Embedded - Microprocessors
Price: please inquire
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MPC7410RX500LE
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - Microprocessors
Price: please inquire