The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
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- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Direction Type | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Maximum Propagation Delay Time @ Maximum CL | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Mounting | Mounting Styles | Number of Element Inputs | Number of Element Outputs | Number of Elements per Chip | Number of Selection Inputs per Element | Operating Temperature-Max | Operating Temperature-Min | Operation Mode | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Parallel Enable Input | Part Life Cycle Code | Part Package Code | Product Status | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Terminal Count Output | Triggering Type | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Type | Terminal Finish | HTS Code | Subcategory | Terminal Position | Terminal Form | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | uPs/uCs/Peripheral ICs Type | Core Processor | Supply Current-Max | Bit Size | Logic Function | Data Bus Width | Seated Height-Max | Address Bus Width | Product Type | Reverse Recovery Time | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Diode Configuration | Integrated Cache | Voltage - I/O | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Number of External Interrupts | Repetitive Peak Reverse Voltage | Security Features | Display & Interface Controllers | SATA | Number of Stages | Product Category | Length | Width |
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 | Mfr Part No IBM25PPC750FX-GB0533V | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A07G044C26GBG#AC0 | Renesas | Datasheet | 104 |
| Min: 1 Mult: 1 | Surface Mount | 361-LFBGA | 361-LFBGA (13x13) | Renesas Electronics | 119 | Renesas Electronics | Renesas Electronics America Inc | Tray | Active | Details | -40°C ~ 85°C (TA) | Tray | RZ/G2LC | Microprocessors - MPU | 200MHz, 1.2GHz | ARM® Cortex®-A55, ARM® Cortex®-M33 | Microprocessors - MPU | 1.8V, 3.3V | 10/100/1000Mbps (2) | 3 Core, 64-Bit | No | DDR3L, DDR4 | USB 2.0 (2) | CANbus, eMMC/SD/SDIO, I²C, SPI, UART | ARM® Mali-G31 | AES, RSA, SHA-1, SHA-224, SHA-256, TRNG | MIPI/CSI, MIPI/DSI | - | Microprocessors - MPU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A07G044L24GBG#YJ0 | Renesas | Datasheet | 30 |
| Min: 1 Mult: 1 | Surface Mount | 551-LFBGA | 551-LFBGA (21x21) | Renesas Electronics | 25 | Renesas Electronics | Renesas Electronics America Inc | Yes | Tray | Active | Details | -40°C ~ 85°C (TA) | Tray | RZ/G2L | Microprocessors - MPU | 200MHz, 1.2GHz | ARM® Cortex®-A55, ARM® Cortex®-M33 | Microprocessors - MPU | 1.8V, 3.3V | 10/100/1000Mbps (2) | 3 Core, 64-Bit | No | DDR3L, DDR4 | USB 2.0 (2) | CANbus, eMMC/SD/SDIO, I²C, SPI, UART | ARM® Mali-G31 | - | MIPI/CSI, MIPI/DSI | - | Microprocessors - MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A07G044L18GBG#AC0 | Renesas | Datasheet | 120 |
| Min: 1 Mult: 1 | Surface Mount | 551-LFBGA | 551-LFBGA (21x21) | Renesas Electronics | 60 | Renesas Electronics | Renesas Electronics America Inc | Yes | Tray | Active | Details | -40°C ~ 85°C (TA) | Tray | RZ/G2L | Microprocessors - MPU | 200MHz, 1.2GHz | ARM® Cortex®-A55, ARM® Cortex®-M33 | Microprocessors - MPU | 16 | Single | 1.8V, 3.3V | 10/100/1000Mbps (2) | 2 Core, 64-Bit | No | DDR3L, DDR4 | USB 2.0 (2) | CANbus, eMMC/SD/SDIO, I²C, SPI, UART | ARM® Mali-G31 | 500 | AES, RSA, SHA-1, SHA-224, SHA-256, TRNG | MIPI/CSI, MIPI/DSI | - | Microprocessors - MPU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A07G044L23GBG#YJ0 | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 456-LFBGA | 456-LFBGA (15x15) | Renesas Electronics | 25 | 2 x 32 kB | 2 x 32 kB | Renesas Electronics | 200 MHz, 500 MHz, 1.2 GHz | 5.5 V | + 85 C | [email protected]/15@2V/[email protected]/[email protected] ns | Renesas Electronics America Inc | 1 V | - 40 C | Yes | Through Hole | SMD/SMT | Tray | Active | Details | PDIP | -40 to 125 °C | Tray | RZ/G2L | Microprocessors - MPU | 14 | 1.05 V to 1.15 V | 200MHz, 1.2GHz | ARM® Cortex®-A55, ARM® Cortex®-M33 | AND | 32 bit/64 bit | Microprocessors - MPU | 1.8V, 3.3V | 10/100/1000Mbps (2) | 3 Core, 64-Bit | No | DDR3L, DDR4 | USB 2.0 (2) | CANbus, eMMC/SD/SDIO, I²C, SPI, UART | ARM® Mali-G31 | 4 Core | - | MIPI/CSI, MIPI/DSI | - | Microprocessors - MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A07G044C16GBG#BC0 | Renesas | Datasheet | 854 |
| Min: 1 Mult: 1 | Surface Mount | 361-LFBGA | - | Renesas Electronics | Uni-Directional | 952 | Renesas Electronics | 6 V | 200@2V/[email protected]/34@6V ns | Renesas Electronics America Inc | 2 V | Surface Mount | 1 | 1 | 1 | 3 | Down Counter | Tray | No | Active | Details | SOIC | No | Positive-Edge | 5 V | -40 to 125 °C | Tray | * | Decade | Microprocessors - MPU | 24 | 200MHz, 1.2GHz | ARM® Cortex®-A55, ARM® Cortex®-M33 | Counter/Divider | Microprocessors - MPU | 1.8V, 3.3V | 10/100/1000Mbps (2) | 2 Core, 64-Bit | No | DDR3L, DDR4 | USB 2.0 (2) | CANbus, eMMC/SD/SDIO, I²C, SPI, UART | ARM® Mali-G31 | AES, RSA, SHA-1, SHA-224, SHA-256, TRNG | MIPI/CSI, MIPI/DSI | - | 5 | Microprocessors - MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A07G044L28GBG#BC0 | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 551-LFBGA | 551-LFBGA (21x21) | Renesas Electronics | 480 | Renesas Electronics | Renesas Electronics America Inc | Tray | Active | Details | -40°C ~ 85°C (TA) | Tray | RZ/G2L | Microprocessors - MPU | 200MHz, 1.2GHz | ARM® Cortex®-A55, ARM® Cortex®-M33 | Microprocessors - MPU | 1.8V, 3.3V | 10/100/1000Mbps (2) | 3 Core, 64-Bit | No | DDR3L, DDR4 | USB 2.0 (2) | CANbus, eMMC/SD/SDIO, I²C, SPI, UART | ARM® Mali-G31 | AES, RSA, SHA-1, SHA-224, SHA-256, TRNG | MIPI/CSI, MIPI/DSI | - | Microprocessors - MPU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A07G044C22GBG#YJ0 | Renesas | Datasheet | 16 |
| Min: 1 Mult: 1 | Surface Mount | 361-LFBGA | 361-LFBGA (13x13) | Renesas Electronics | 25 | Renesas Electronics | Renesas Electronics America Inc | Yes | Tray | Active | Details | -40°C ~ 85°C (TA) | Tray | * | Microprocessors - MPU | 200MHz, 1.2GHz | ARM® Cortex®-A55, ARM® Cortex®-M33 | Microprocessors - MPU | 1.8V, 3.3V | 10/100/1000Mbps (2) | 3 Core, 64-Bit | No | DDR3L, DDR4 | USB 2.0 (2) | CANbus, eMMC/SD/SDIO, I²C, SPI, UART | ARM® Mali-G31 | - | MIPI/CSI, MIPI/DSI | - | Microprocessors - MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A07G044C26GBG#BC0 | Renesas | Datasheet | 834 |
| Min: 1 Mult: 1 | Surface Mount | 361-LFBGA | - | Renesas Electronics | 952 | Renesas Electronics | Renesas Electronics America Inc | Yes | Tray | Active | Details | -40°C ~ 85°C (TA) | Tray | * | Microprocessors - MPU | 200MHz, 1.2GHz | ARM® Cortex®-A55, ARM® Cortex®-M33 | Microprocessors - MPU | 1.8V, 3.3V | 10/100/1000Mbps (2) | 3 Core, 64-Bit | No | DDR3L, DDR4 | USB 2.0 (2) | CANbus, eMMC/SD/SDIO, I²C, SPI, UART | ARM® Mali-G31 | AES, RSA, SHA-1, SHA-224, SHA-256, TRNG | MIPI/CSI, MIPI/DSI | - | Microprocessors - MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A07G044C22GBG#BC0 | Renesas | Datasheet | 30 |
| Min: 1 Mult: 1 | 361-BGA | 361-BGA (13x13) | R9A07 | Renesas Electronics | 952 | Renesas Electronics | Renesas Electronics America Inc | Tray | Active | Details | -40°C ~ 85°C (TA) | Tray | - | Microprocessors - MPU | 1.2GHz | ARM® Cortex®-A55, ARM® Cortex®-M33 | Microprocessors - MPU | 1.8V, 3.3V | 10/100/1000Mbps (2) | 3 Core, 64-Bit | No | DDR3L, DDR4 | USB 2.0 (2) | CANbus, eMMC/SD/SDIO, I²C, SPI, UART | ARM® Mali-G31 | - | MIPI/CSI, MIPI/DSI | - | Microprocessors - MPU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BXCP-40H-11M-J19-3-A1-00-0-3 | Bridgelux Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S80C188XL-16 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | INTEL CORP | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP80,.7X.9,32 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Active | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | compliant | R-PQFP-G80 | Not Qualified | COMMERCIAL | 16 MHz | MICROPROCESSOR, RISC | 80 mA | 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No UPD70208GF-10-3B9 | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | RENESAS ELECTRONICS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP-80 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | 80 | R-PQFP-G80 | Not Qualified | INDUSTRIAL | 10 MHz | MICROPROCESSOR | 120 mA | 8 | 3 mm | 20 | NO | YES | 8 | FIXED POINT | NO | 5 | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PPC750FX-GB1032V | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IBMPPC750GXECR5092Z | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Bulk | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 25PPC750FX-FB25-3T | IBM | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 292-BCBGA Exposed Pad | 292-CBGA (21x21) | 0°C ~ 105°C (TJ) | Bulk | Active | 800MHz | PowerPC 750FX | 2.5V | 1 Core, 32-Bit | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No RCPXA270C0C416 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 356 | 13.002 MHz | INTEL CORP | PLASTIC/EPOXY | VFBGA | VFBGA, BGA356,24X24,20 | BGA356,24X24,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | BGA | No | 1.705 V | 1.2825 V | 1.35 V | e0 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 0.5 mm | compliant | 356 | S-PBGA-B356 | Not Qualified | 416 MHz | MICROPROCESSOR, RISC | 32 | 1 mm | 26 | YES | YES | 32 | FIXED POINT | YES | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S3C44B0X01 | Samsung Semiconductor | Datasheet | 2 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TS68HC811E2MC | Thomson-CSF Compsants Specific | Datasheet | - | - | Min: 1 Mult: 1 | THOMSON-CSF COMPSANTS SPECIFIC | , | Obsolete | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC68HC000L8 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 64 | MOTOROLA SEMICONDUCTOR PRODUCTS | 70 °C | CERAMIC | DIP | DIP, DIP64,.9 | DIP64,.9 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T64 | Not Qualified | 5 V | COMMERCIAL | 8 MHz | MICROPROCESSOR, RISC | 25 mA | 32 |
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IBM25PPC750FX-GB0533V
IBM
Package:Embedded - Microprocessors
Price: please inquire
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R9A07G044C26GBG#AC0
Renesas
Package:Embedded - Microprocessors
17.544808
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R9A07G044L24GBG#YJ0
Renesas
Package:Embedded - Microprocessors
21.257636
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R9A07G044L18GBG#AC0
Renesas
Package:Embedded - Microprocessors
22.828197
-
R9A07G044L23GBG#YJ0
Renesas
Package:Embedded - Microprocessors
Price: please inquire
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R9A07G044C16GBG#BC0
Renesas
Package:Embedded - Microprocessors
16.848327
-
R9A07G044L28GBG#BC0
Renesas
Package:Embedded - Microprocessors
Price: please inquire
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R9A07G044C22GBG#YJ0
Renesas
Package:Embedded - Microprocessors
12.649244
-
R9A07G044C26GBG#BC0
Renesas
Package:Embedded - Microprocessors
14.949674
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R9A07G044C22GBG#BC0
Renesas
Package:Embedded - Microprocessors
17.004265
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BXCP-40H-11M-J19-3-A1-00-0-3
Bridgelux Inc
Package:Embedded - Microprocessors
Price: please inquire
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S80C188XL-16
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
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UPD70208GF-10-3B9
Renesas Electronics Corporation
Package:Embedded - Microprocessors
Price: please inquire
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PPC750FX-GB1032V
IBM
Package:Embedded - Microprocessors
Price: please inquire
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IBMPPC750GXECR5092Z
IBM
Package:Embedded - Microprocessors
Price: please inquire
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25PPC750FX-FB25-3T
IBM
Package:Embedded - Microprocessors
Price: please inquire
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RCPXA270C0C416
Intel Corporation
Package:Embedded - Microprocessors
Price: please inquire
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S3C44B0X01
Samsung Semiconductor
Package:Embedded - Microprocessors
Price: please inquire
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TS68HC811E2MC
Thomson-CSF Compsants Specific
Package:Embedded - Microprocessors
Price: please inquire
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MC68HC000L8
Freescale Semiconductor
Package:Embedded - Microprocessors
Price: please inquire