The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
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- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | Supply Voltage-Nom (Vsup) | JESD-609 Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Analog IC - Other Type | Supply Current-Max | Data Rate | Seated Height-Max | Supply Current-Max (Isup) | Telecom IC Type | Standard | Carrier Type | ISDN Access Rate | Reference Point | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No MRFIC0001 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | MOTOROLA SEMICONDUCTOR PRODUCTS | 85 °C | -30 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP20,.25 | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 0.635 mm | unknown | R-PDSO-G20 | Not Qualified | 3/5 V | OTHER | 12 mA | ||||||||||||||||||||||||
| Mfr Part No TISP61CAP3P | Power Innovations International, Inc. | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | POWER INNOVATIONS LTD | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Transferred | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T8 | Not Qualified | 5.08 mm | SURGE PROTECTION CIRCUIT | 7.62 mm | ||||||||||||||||||||||||||||
 | Mfr Part No TISP61CAP3P | Bourns Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | BOURNS INC | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 8542.39.00.01 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | not_compliant | NOT SPECIFIED | 8 | R-PDIP-T8 | Not Qualified | SURGE PROTECTION CIRCUIT | ||||||||||||||||||||||||||
| Mfr Part No TSOT0410G14 | Avago Technologies | Datasheet | - | - | Min: 1 Mult: 1 | YES | 600 | AVAGO TECHNOLOGIES INC | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | 2.5 V | e0 | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 1.27 mm | unknown | 30 | S-PBGA-B600 | Not Qualified | INDUSTRIAL | 3.05 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 45 mm | 45 mm | |||||||||||||||||||
| Mfr Part No TK5530H-138-PP | Temic Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No FX-500-LAC-GNJ-A3-E7 | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | MICROCHIP TECHNOLOGY INC | 70 °C | CERAMIC, METAL-SEALED COFIRED | SOJ | PACKAGE-6 | SOJ8(UNSPEC) | RECTANGULAR | SMALL OUTLINE | Obsolete | Yes | 3.3 V | 8542.39.00.01 | DUAL | J BEND | 1 | 2.54 mm | compliant | R-CDSO-J6 | 3.6 V | 3 V | PLL FREQUENCY SYNTHESIZER | 4.69 mm | 40 mA | 13.97 mm | 8.89 mm | |||||||||||||||||||||
| Mfr Part No FX-500-LAC-GNJ-A3-E7 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 6 | MICROSEMI CORP | 1 | 70 °C | PLASTIC/EPOXY | SOJ | PACKAGE-6 | RECTANGULAR | SMALL OUTLINE | Transferred | Yes | 3.3 V | e4 | NICKEL GOLD | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | R-PDSO-J6 | COMMERCIAL | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 13.97 mm | 8.89 mm | |||||||||||||||||||
| Mfr Part No PEF2091F | Infineon Technologies AG | Datasheet | 4 | - | Min: 1 Mult: 1 | YES | 64 | INFINEON TECHNOLOGIES AG | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP64,.47SQ,20 | SQUARE | FLATPACK | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | not_compliant | S-PQFP-G64 | Not Qualified | INDUSTRIAL | 144 Mbps | CCITT I.430 | BASIC | U | |||||||||||||||||||||
| Mfr Part No CS61544-ID | Crystal Semiconductor Corp | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | CRYSTAL SEMICONDUCTOR CORP | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T28 | Not Qualified | INDUSTRIAL | 0.145 mA | PCM TRANSCEIVER | T-1(DS1) | ||||||||||||||||||||||
| Mfr Part No SC14408B80VDX | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | NATIONAL SEMICONDUCTOR CORP | PLASTIC/EPOXY | QFP | QFP, QFP80,.68SQ | QFP80,.68SQ | SQUARE | FLATPACK | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 0.635 mm | unknown | S-PQFP-G80 | Not Qualified | ||||||||||||||||||||||||||||
| Mfr Part No LAN9311I-NZW-TR | SMSC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | STANDARD MICROSYSTEMS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Transferred | 3.3 V | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.4 mm | unknown | S-PQFP-G128 | INDUSTRIAL | 1.2 mm | LAN SWITCHING CIRCUIT | 14 mm | 14 mm | ||||||||||||||||||||||||
| Mfr Part No GD16557 | Giga | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S19205CBIAB | Applied Micro Circuits Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PEB2260N2V3.0 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RF6555 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | RF MICRO DEVICES INC | UNSPECIFIED | QCCN | QCCN, | SQUARE | CHIP CARRIER | Transferred | 8542.39.00.01 | QUAD | NO LEAD | 1 | unknown | S-XQCC-N20 | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||
| Mfr Part No R8071AG | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 68 | CONEXANT SYSTEMS | 70 °C | CERAMIC | PGA | PGA, PGA68,11X11 | PGA68,11X11 | SQUARE | GRID ARRAY | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | compliant | S-XPGA-P68 | Not Qualified | COMMERCIAL | |||||||||||||||||||||||||
 | Mfr Part No PX1012AI-EL1/G | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 81 | NXP SEMICONDUCTORS | SOT-643-1 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.2 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 81 | S-PBGA-B81 | Not Qualified | INDUSTRIAL | 1.6 mm | INTERFACE CIRCUIT | 9 mm | 9 mm | |||||||||||||||||
 | Mfr Part No TH72015 | Melexis Microelectronic Integrated Systems | Datasheet | 8 | - | Min: 1 Mult: 1 | YES | 10 | MELEXIS N V | 125 °C | -40 °C | UNSPECIFIED | HVSON | HVSON, | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | 3 V | 8542.39.00.01 | DUAL | NO LEAD | 1 | 0.5 mm | compliant | 10 | S-XDSO-N10 | Not Qualified | AUTOMOTIVE | 1 mm | TELECOM CIRCUIT | 3 mm | 3 mm | |||||||||||||||||||||
| Mfr Part No ATA8403C-6AQY | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | MICROCHIP TECHNOLOGY INC | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, TSSOP-8 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | Yes | 3 V | 8542.39.00.01 | DUAL | GULL WING | 1 | 0.65 mm | compliant | S-PDSO-G8 | Not Qualified | INDUSTRIAL | 0.011 mA | 1.05 mm | TELECOM CIRCUIT | 3 mm | 3 mm | ||||||||||||||||||||
| Mfr Part No MXL86282C-ABE-R | MaxLinear Inc | Datasheet | - | - | Min: 1 Mult: 1 |
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MRFIC0001
Freescale Semiconductor
Package:Interface - Telecom
Price: please inquire
-
TISP61CAP3P
Power Innovations International, Inc.
Package:Interface - Telecom
Price: please inquire
-
TISP61CAP3P
Bourns Inc
Package:Interface - Telecom
Price: please inquire
-
TSOT0410G14
Avago Technologies
Package:Interface - Telecom
Price: please inquire
-
TK5530H-138-PP
Temic Semiconductors
Package:Interface - Telecom
Price: please inquire
-
FX-500-LAC-GNJ-A3-E7
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
-
FX-500-LAC-GNJ-A3-E7
Microsemi Corporation
Package:Interface - Telecom
Price: please inquire
-
PEF2091F
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
-
CS61544-ID
Crystal Semiconductor Corp
Package:Interface - Telecom
Price: please inquire
-
SC14408B80VDX
National Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
-
LAN9311I-NZW-TR
SMSC
Package:Interface - Telecom
Price: please inquire
-
GD16557
Giga
Package:Interface - Telecom
Price: please inquire
-
S19205CBIAB
Applied Micro Circuits Corporation
Package:Interface - Telecom
Price: please inquire
-
PEB2260N2V3.0
Infineon Technologies AG
Package:Interface - Telecom
Price: please inquire
-
RF6555
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
-
R8071AG
Conexant Systems Inc
Package:Interface - Telecom
Price: please inquire
-
PX1012AI-EL1/G
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
-
TH72015
Melexis Microelectronic Integrated Systems
Package:Interface - Telecom
Price: please inquire
-
ATA8403C-6AQY
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
-
MXL86282C-ABE-R
MaxLinear Inc
Package:Interface - Telecom
Price: please inquire