The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Data Rate | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Speed Grade | Number of Transceivers | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product Category | Length | Width |
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 | Mfr Part No M2S150-1FCS536I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | 64 kB | MICROSEMI CORP | - | - | M2S150-1FCS536I | 166 MHz | Microchip Technology | 293 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA536,30X30,20 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | not_compliant | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FG484 | Microchip | Datasheet | 2214 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S060 | 64 kB | MICROSEMI CORP | - | - | M2S060TS-1FG484 | 166 MHz | Microchip Technology | 3 | 267 | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||
| Mfr Part No M2GL060T-FG676I | Microchip | Datasheet | 2242 |
| Min: 1 Mult: 1 | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2GL060 | MICROSEMI CORP | M2GL060T-FG676I | + 100 C | Microchip Technology | - 40 C | 3 | SMD/SMT | 387 | 56520 LE | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 20 | 5.26 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 1.2 V | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | 4 Transceiver | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060TS-VF400 | Microchip | Datasheet | 1652 | - | Min: 1 Mult: 1 | Surface Mount | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2GL060 | MICROSEMI CORP | M2GL060TS-VF400 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 207 | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.26 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 1.2 V | OTHER | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | 4 Transceiver | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150-FC1152I | Microchip | Datasheet | 2357 |
| Min: 1 Mult: 1 | Surface Mount | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2GL150 | MICROSEMI CORP | M2GL150-FC1152I | 1.26 V | Microchip Technology | 1.14 V | 574 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | FPGA - Field Programmable Gate Array IGLOO 2 | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | STD | 146124 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025T-VF400 | Microchip | Datasheet | 2189 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | M2GL025 | MICROSEMI CORP | M2GL025T-VF400 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 207 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 1.2 V | OTHER | 138 kB | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 1130496 | 4 Transceiver | 27696 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1FG484I | Microchip | Datasheet | 37 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S005 | 64 kB | MICROSEMI CORP | - | - | M2S005-1FG484I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | SMD/SMT | 209 | 6060 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 217 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 217 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 5K Logic Modules | 4956 | 1 Core | 128KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||
| Mfr Part No M2GL010-1VF400 | Microchip | Datasheet | 37 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | M2GL010 | MICROSEMI CORP | M2GL010-1VF400 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 195 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 1.2 V | OTHER | 114 kB | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 1 | 12084 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060-FG676I | Microchip | Datasheet | 2249 |
| Min: 1 Mult: 1 | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2GL060 | MICROSEMI CORP | M2GL060-FG676I | + 100 C | Microchip Technology | - 40 C | 3 | SMD/SMT | 387 | 56520 LE | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 20 | 5.26 | No | FPGA - Field Programmable Gate Array IGLOO 2 | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 1.2 V | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-FG484I | Microchip | Datasheet | 23 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | M2S010T-FG484I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 233 | 12084 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-FCSG325I | Microchip | Datasheet | 2015 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | 64 kB | MICROSEMI CORP | - | - | M2S050TS-FCSG325I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 200 | 56340 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.82 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||
| Mfr Part No M2GL090TS-FGG676I | Microchip | Datasheet | 1710 | - | Min: 1 Mult: 1 | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2GL090 | MICROSEMI CORP | M2GL090TS-FGG676I | + 100 C | Microchip Technology | - 40 C | 3 | SMD/SMT | 425 | 86184 LE | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 4 Transceiver | 86316 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010T-1VFG256I | Microchip | Datasheet | 37 | - | Min: 1 Mult: 1 | Surface Mount | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | M2GL010 | MICROSEMI CORP | M2GL010T-1VFG256I | + 100 C | Microchip Technology | - 40 C | 3 | SMD/SMT | 138 | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.27 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 2 Transceiver | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090T-1FGG484 | Microchip | Datasheet | 1630 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 484 | M2GL090 | MICROSEMI CORP | M2GL090T-1FGG484 | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 267 | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | OTHER | 323.3 kB | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | 1 | 4 Transceiver | 86316 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150-FCG1152I | Microchip | Datasheet | 2215 |
| Min: 1 Mult: 1 | Surface Mount | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2GL150 | MICROSEMI CORP | M2GL150-FCG1152I | + 100 C | Microchip Technology | - 40 C | 4 | SMD/SMT | 574 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 1.2 V | 667 Mb/s | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | STD | 16 Transceiver | 146124 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1VFG256I | Microchip | Datasheet | 23 | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | 64 kB | MICROSEMI CORP | - | - | M2S010T-1VFG256I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 138 | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||
| Mfr Part No M2GL150-FCVG484 | Microchip | Datasheet | 1616 | - | Min: 1 Mult: 1 | Surface Mount | 484-BFBGA | YES | 484-BGA | 484 | M2GL150 | MICROSEMI CORP | M2GL150-FCVG484 | Microchip Technology | 4 | 248 | 85 °C | Tray | PLASTIC/EPOXY | FBGA | 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 30 | 5.27 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B484 | OTHER | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | STD | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCG1152 | Microchip | Datasheet | 1657 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | MICROSEMI CORP | - | - | M2S150T-FCG1152 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 4 | 574 | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 1152 | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||||||
| Mfr Part No M2GL005-1VFG256 | Microchip | Datasheet | 23 |
| Min: 1 Mult: 1 | Surface Mount | VFBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2GL005 | Microchip Technology / Atmel | 119 | MICROSEMI CORP | M2GL005-1VFG256 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 161 I/O | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.28 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL005 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | OTHER | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | FPGA - Field Programmable Gate Array | 719872 | - | FPGA - Field Programmable Gate Array | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060-VFG400I | Microchip | Datasheet | 1801 | - | Min: 1 Mult: 1 | Surface Mount | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2GL060 | Microchip Technology / Atmel | 90 | MICROSEMI CORP | M2GL060-VFG400I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 207 | 56520 LE | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.25 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.299386 oz | -40°C ~ 100°C (TJ) | Tray | IGLOO2 | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B400 | 1.2 V | 667 Mb/s | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | FPGA - Field Programmable Gate Array | 1869824 | STD | 4 Transceiver | FPGA - Field Programmable Gate Array | 17 mm | 17 mm |
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M2S150-1FCS536I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S060TS-1FG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
275.769848
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M2GL060T-FG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
146.070403
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M2GL060TS-VF400
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL150-FC1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
342.732995
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M2GL025T-VF400
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2S005-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2GL010-1VF400
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL060-FG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
209.184416
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M2S010T-FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S050TS-FCSG325I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL090TS-FGG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL010T-1VFG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL090T-1FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
241.071097
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M2GL150-FCG1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
365.452755
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M2S010T-1VFG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL150-FCVG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2S150T-FCG1152
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
M2GL005-1VFG256
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
33.237048
-
M2GL060-VFG400I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire