The category is 'USB Flash Drives'
USB Flash Drives (1612)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Address Bus Width (bit) | Automotive | Base Product Number | Block Organization | Cell Type | Chip Density (bit) | Clock Frequency-Max (fCLK) | Command Compatible | Dimensions | ECC Support | ECCN (US) | EU RoHS | HTS | Ihs Manufacturer | Interface Type | Lead Shape | Location of Boot Block | Manufacturer | Manufacturer Part Number | Max. Access Time (ns) | Maximum Erase Time (S) | Maximum Operating Frequency (MHz) | Maximum Operating Supply Voltage | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature | Maximum Operating Temperature (°C) | Maximum Programming Time (ms) | Memory Types | Mfr | Minimum Endurance (Cycles) | Minimum Operating Supply Voltage | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature | Minimum Operating Temperature (°C) | Mounting | Number of Bits/Word (bit) | Number of Words | Number of Words Code | Operating Current (mA) | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Height | Package Length | Package Shape | Package Style | Package Type | Package Width | Part Life Cycle Code | PCB changed | PPAP | Product Status | Program Current (mA) | Programmability | Programmable | Programming Voltage (V) | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Standard Package Name | Supplier Package | Supplier Temperature Grade | Supply Voltage-Nom (Vsup) | Support of Page Mode | Timing Type | Typical Operating Supply Voltage (V) | Operating Temperature | Packaging | Series | Part Status | Type | Additional Feature | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Speed | Operating Mode | Clock Frequency | Access Time | Memory Format | Memory Interface | Architecture | Organization | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Memory IC Type | Programming Voltage | Sector Size | Page Size | Boot Block | Temperature | Memory Organization | Height | Length | Width |
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 | Mfr Part No AT26DF321S3U | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 1 | Unknown | Symmetrical | 32M | Yes | No | 3A991.b.1.a | Compliant | 8542.32.00.71 | Serial-SPI | Gull-wing | 6 | 56/Chip | 3.6 | 85 | 5/Page | 100000 | 2.7 | -40 | Surface Mount | 8 | 4M | 15 | 2.35(Max) | 10.3 | 7.5 | 16 | Unknown | 18 | Yes | 2.7 to 3.6 | SOP | SOIC | Industrial | No | Synchronous | 3.3 | Obsolete | 16 | Sectored | 4Kbyte x 1024 | 256byte | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q16JLUXIG | Winbond Electronics Corporation | Datasheet | 6400 | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 16M | Yes | No | EAR99 | Compliant | Serial (SPI, Dual SPI, Quad SPI) | 6 | 25/Chip | 104 | 3.6 | 85 | 3/Page | 100000 | 2.3 | -40 | Surface Mount | 8 | 2M | 25 | 0.53 | 2 | 3 | 8 | No | 25 | Yes | 2.3 to 3.6 | USON EP | Industrial | No | Synchronous | 3.3|2.5 | Active | 8 | Sectored | 4Kbyte x 512 | 256byte | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 2Gbit NOR Flash | MT25QL02GCBB8E12-0SIT | Micron Technology | Datasheet | 3121 |
| Min: 1 Mult: 1 | 32 | No | Symmetrical | NOR | 2G | Yes | No | EAR99 | Compliant | 8542.32.00.71 | Serial (SPI, Dual SPI, Quad SPI) | Ball | Bottom|Top | 7 | 1/Sector | 133 | 3.6 | 85 | 1.8/Page | 100000 | 2.7 | -40 | Surface Mount | 1/2/4 | 2G/1G/512M | 94 | 0.8 | 8 | 6 | 24 | No | 35 | Yes | BGA | TBGA | No | Synchronous | 3|3.3 | Tray | Active | 24 | Sectored | 64Kbyte x 4096 | 256byte | Yes | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q128FWFIQ | Winbond Electronics Corporation | Datasheet | 225 | - | Min: 1 Mult: 1 | YES | 16 | 24 | No | Symmetrical | NOR | 128M | 104 MHz | Yes | No | 3A991b.1.a. | Compliant | 8542.32.00.71 | WINBOND ELECTRONICS CORP | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | Winbond Electronics Corp | W25Q128FWFIQ | 6 | 200/Chip | 1.95 | 85 | 5/Page | 100000 | 1.65 | -40 | Surface Mount | 8 | 16M | 16000000 | 20 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | 2.31 | 10.31 | RECTANGULAR | SMALL OUTLINE | 7.49 | Obsolete | 16 | No | 25 | Yes | 1.65 to 1.95 | 5.7 | Yes | SOP | SOIC W | Industrial | 1.8 V | No | Synchronous | 1.8 | Tube | Obsolete | CMOS | DUAL | GULL WING | 1 | 1.27 mm | compliant | 16 | R-PDSO-G16 | 1.95 V | INDUSTRIAL | 1.65 V | SYNCHRONOUS | Sectored | 16MX8 | 2.64 mm | 8 | 134217728 bit | SERIAL | FLASH | 1.8 V | 4Kbyte x 4096 | 256byte | No | 10.31 mm | 7.49 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q32JVZEIQ TR | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | No | Symmetrical | 32M | Compliant | 8542.32.00.71 | Serial (SPI, Dual SPI, Quad SPI) | 3.6 | 2.7 | Surface Mount | 0.73 | 6 | 8 | 8 | No | WSON EP | Synchronous | 3|3.3 | Tape and Reel | 8 | Sectored | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q128FWSIQ TR | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | 8-SOIC | No | W25Q128 | Symmetrical | 128M | Compliant | 8542.32.00.02 | WINBOND ELECTRONICS CORP | Serial (SPI, Dual SPI, Quad SPI) | Winbond Electronics Corp | W25Q128FWSIQTR | 1.95 | Non-Volatile | Winbond Electronics | 1.65 | Surface Mount | Tape & Reel (TR) | , | 1.8 | 5.28 | 5.28 | Not Recommended | 8 | No | Obsolete | 5.7 | SOIC | Synchronous | 1.8 | -40°C ~ 85°C (TA) | SpiFlash® | Obsolete | FLASH - NOR | 1.65V ~ 1.95V | unknown | 8 | 128Mbit | 104 MHz | FLASH | SPI - Quad I/O, QPI | Sectored | 60µs, 5ms | FLASH | 1.8 V | 16M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W74M25FVZEIQ | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | No | Symmetrical | 256M | Yes | No | 3A991.b.1.a | Compliant | 8542.32.00.71 | Serial (SPI, Dual SPI, Quad SPI) | 7 | 3.6 | 85 | 100000 | 2.7 | -40 | Surface Mount | 8 | 32M | 30 | 0.73 | 6 | 8 | 8 | No | Yes | WSON EP | Industrial | No | Synchronous | 3|3.3 | Tube | 8 | Sectored | 4Kbyte x 8192 | 256byte | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662GXB-AB | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Unknown | MLC NAND | 32G | Compliant | 8542.32.00.71 | Ball | Surface Mount | 1.4 | 18 | 14 | 100 | Unknown | BGA | BGA | Commercial | Unconfirmed | 100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662GE8-AB | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Unknown | MLC NAND | 8G | Compliant | 8542.32.00.71 | Ball | Surface Mount | 1.4 | 18 | 14 | 100 | Unknown | BGA | BGA | Industrial | Unconfirmed | 100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N08GVSIAA | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-TFSOP (0.724, 18.40mm Width) | YES | 48-TSOP | 48 | 31 | Yes | Symmetrical | SLC NAND | 8G | No | 18.5 x 12.1 x 1.05mm | Yes | 3A991b.1.a. | Compliant | 8542.32.00.71 | WINBOND ELECTRONICS CORP | Parallel | Gull-wing | Winbond Electronics Corp | W29N08GVSIAA | 0.01/Block | 3.6 V | 3.6 | +85 °C | 85 | 0.7/Page | Non-Volatile | Winbond Electronics | 100000 | 2.7 V | 2.7 | -40 °C | -40 | Surface Mount | 8 | 1G | 1000000000 | 35 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TSOP1 | TSOP1, | 1 | 12 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | TSOP | 18.4 | Active | 48 | Unknown | Active | 35 | Yes | 2.7 to 3.6 | NOT SPECIFIED | 2.28 | Yes | SOP | TSOP-I | Industrial | 2.7V - 3.6V | Yes | Asynchronous | 3|3.3 | -40°C ~ 85°C (TA) | - | Active | SLC NAND Flash | FLASH - NAND (SLC) | 2.7V ~ 3.6V | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | 8Gbit | 40MHz | ASYNCHRONOUS | 25 ns | FLASH | Parallel | Sectored | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 1.2 mm | 8 | 25ns, 700µs | 8Gb | PARALLEL | FLASH | 3 V | 128Kbyte x 8192 | 2Kbyte | No | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 1G x 8 | 1.05mm | 12.1mm | 18.5mm | |||||||||||
| Mfr Part No SM668GEA-AB | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Unknown | SLC NAND | 16G | Compliant | 8542.32.00.71 | Ball | Surface Mount | 1.4 | 18 | 14 | 100 | Unknown | BGA | BGA | Industrial | Unconfirmed | 100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q80NESNIG | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 24 | No | Symmetrical | NOR | 8M | Yes | No | EAR99 | Compliant | 8542.32.00.71 | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | 7 | 20/Chip | 1.3 | 85 | 5/Page | 100000 | 1.14 | -40 | Surface Mount | 8 | 1M | 20 | 1.5(Max) | 5(Max) | 4(Max) | 8 | No | 20 | Yes | SOIC N | Industrial | No | Synchronous | 1.2 | Tube | Unconfirmed | 8 | Sectored | 4Kbyte x 256 | 256byte | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W25Q128FWYIC TR | Winbond Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 32-UFBGA, WLCSP | 32-WLCSP (3.98x3.19) | No | W25Q128 | Symmetrical | 128M | Compliant | Serial (SPI, Dual SPI, Quad SPI) | 1.95 | Non-Volatile | Winbond Electronics | 1.65 | Surface Mount | Tape & Reel (TR) | 0.33 | 32 | No | Obsolete | WLCSP | Synchronous | 1.8 | -40°C ~ 85°C (TA) | SpiFlash® | Obsolete | FLASH - NOR | 1.65V ~ 1.95V | 32 | 128Mbit | 104 MHz | FLASH | SPI - Quad I/O, QPI | Sectored | 60µs, 5ms | 16M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KLMDG4UCTA-B0410 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | No | Compliant | 8542.32.00.71 | No | Unconfirmed | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KLMDG8JENB-B0410 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 153 | No | 1T | 200 MHz | 8542.32.00.71 | SAMSUNG SEMICONDUCTOR INC | Serial e-MMC | Samsung Semiconductor | KLMDG8JENB-B0410 | 1.95|3.6 | 1.7|2.7 | 137438953472 words | 128000000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | FBGA-153 | 1 | 13 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 11.5 | Active | No | 5.78 | 1.8 V | Synchronous | 1.8|3.3 | Unconfirmed | MLC NAND TYPE | CMOS | BOTTOM | BALL | 1 | 0.5 mm | compliant | R-PBGA-B153 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 128GX8 | 1.2 mm | 8 | 1099511627776 bit | PARALLEL | FLASH | 1.8 V | 13 mm | 11.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W29N04GVBIAA TR | Winbond Electronics Corporation | Datasheet | 12 |
| Min: 1 Mult: 1 | Surface Mount | 63-VFBGA | 63-VFBGA (9x11) | 30 | Yes | Symmetrical | SLC NAND | 4G | No | Yes | 3A991b.1.a. | Compliant | 8542.32.00.71 | Parallel | 0.01/Block | 3.6 | 85 | 0.7/Page | Non-Volatile | Winbond Electronics | 100000 | 2.7 | -40 | Surface Mount | 8 | 512M | 35 | Tape & Reel (TR) | 0.6(Max) | 11 | VFBGA | 9 | 63 | Unknown | Active | 35 | Yes | Yes | 2.7 to 3.6 | No | VFBGA | Industrial | 2.7V - 3.6V | Yes | Asynchronous | 3.3 | -40°C ~ 85°C (TA) | - | Active | SLC NAND Flash | FLASH - NAND (SLC) | 2.7V ~ 3.6V | 63 | 4Gbit | 40MHz | 20 ns | FLASH | ONFI | Sectored | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 25ns, 700µs | 4Gb | 128Kbyte x 4096 | 2Kbyte | No | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 512M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662PE8-AB | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Unknown | MLC NAND | 8G | Compliant | 8542.32.00.71 | Ball | Surface Mount | 1.4 | 18 | 14 | 100 | Unknown | BGA | BGA | Industrial | Unconfirmed | 100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662PEB-AB | Silicon Motion | Datasheet | - | - | Min: 1 Mult: 1 | Unknown | MLC NAND | 32G | Compliant | 8542.32.00.71 | Ball | Surface Mount | 1.4 | 18 | 14 | 100 | Unknown | BGA | BGA | Industrial | Unconfirmed | 100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM662PXD-BDS | 153-b eMMC 5.1 TLC NAND 128GB C-temp | Silicon Motion | Datasheet | 36 |
| Min: 1 Mult: 1 | Yes | TLC NAND | 1T | Yes | Yes | EAR99 | Compliant | 8542.32.00.71 | Serial e-MMC | 85 | -25 | Surface Mount | 1.4 | 18 | 14 | 153 | Unknown | Yes | BGA | Commercial | No | Synchronous | Tray | Obsolete | 153 | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No KLMCG4JETD-B0410 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 153 | No | NAND | 512G | 200 MHz | Yes | Yes | 3A991.b.1.a | Compliant | 8542.32.00.71 | SAMSUNG SEMICONDUCTOR INC | Serial e-MMC | Ball | Samsung Semiconductor | KLMCG4JETD-B0410 | 0.02 | 200 | 1.95|3.6 | 85 | 1.7|2.7 | -25 | Surface Mount | 1/4/8 | 512G/128G/64G | 64000000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | 0.71 | 13 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 11.5 | Active | 153 | No | Yes | 5.79 | BGA | FBGA | 1.8 V | No | Synchronous | 1.8|3.3 | Active | MLC NAND TYPE | ALSO OPERATES @ 3V SUP NOM | CMOS | BOTTOM | BALL | 1 | 0.5 mm | compliant | 153 | R-PBGA-B153 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 64GX8 | 1 mm | 8 | 549755813888 bit | PARALLEL | FLASH | 1.8 V | Yes | 13 mm | 11.5 mm |
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AT26DF321S3U
Microchip Technology
Package:USB Flash Drives
Price: please inquire
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W25Q16JLUXIG
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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2Gbit NOR Flash | MT25QL02GCBB8E12-0SIT
Micron Technology
Package:USB Flash Drives
22.914256
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W25Q128FWFIQ
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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W25Q32JVZEIQ TR
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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W25Q128FWSIQ TR
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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W74M25FVZEIQ
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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SM662GXB-AB
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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SM662GE8-AB
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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W29N08GVSIAA
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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SM668GEA-AB
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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W25Q80NESNIG
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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W25Q128FWYIC TR
Winbond Electronics Corporation
Package:USB Flash Drives
Price: please inquire
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KLMDG4UCTA-B0410
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire
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KLMDG8JENB-B0410
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire
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W29N04GVBIAA TR
Winbond Electronics Corporation
Package:USB Flash Drives
9.265521
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SM662PE8-AB
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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SM662PEB-AB
Silicon Motion
Package:USB Flash Drives
Price: please inquire
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SM662PXD-BDS | 153-b eMMC 5.1 TLC NAND 128GB C-temp
Silicon Motion
Package:USB Flash Drives
7.045120
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KLMCG4JETD-B0410
Samsung Semiconductor
Package:USB Flash Drives
Price: please inquire