The category is 'Memory Cards'

  • All Manufacturers
  • ECCN Code
  • Organization
  • Memory Width
  • Number of Functions
  • Part Status
  • RoHS Status
  • Supply Voltage-Max (Vsup)
  • Supply Voltage-Min (Vsup)
  • Surface Mount
  • Terminal Form
  • Terminal Position
  • CAS Latency
  • ECCN Code:

    EAR99

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Mount

Surface Mount

Number of Pins

Number of Terminals

Access Time-Max

CAS Latency

Chip Configuration

Chip Density (bit)

Chip Package Type

Data Bus Width (bit)

ECC Support

ECCN (US)

Ihs Manufacturer

Lead Shape

Manufacturer

Manufacturer Part Number

Max. Access Time (ns)

Maximum Clock Rate (MHz)

Maximum Operating Supply Voltage (V)

Maximum Operating Temperature (°C)

Memory Types

Minimum Operating Supply Voltage (V)

Minimum Operating Temperature (°C)

Module

Module Density

Module Sides

Mounting

Number of Elements

Number of Chip Banks

Number of Chip per Module

Number of Ranks

Number of Words

Number of Words Code

Operating Current (mA)

Operating Temperature (Max.)

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Height

Package Length

Package Shape

Package Style

Package Width

Part Life Cycle Code

Part Package Code

PC Type

PCB changed

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Schedule B

SPD EEPROM Support

Standard Package Name

Supplier Package

Supplier Temperature Grade

Supply Voltage-Nom (Vsup)

Typical Operating Supply Voltage (V)

Published

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Temperature Grade

Supply Voltage-Min (Vsup)

Max Supply Voltage

Min Supply Voltage

Memory Size

Number of Ports

Operating Mode

Clock Frequency

Organization

Seated Height-Max

Memory Width

Memory Density

Max Frequency

PLL

Parallel/Serial

Memory IC Type

Refresh Cycles

Access Mode

Self Refresh

Module Type

Height Seated (Max)

Length

Width

RoHS Status

MT16KTF1G64AZ-1G4E1

Mfr Part No

MT16KTF1G64AZ-1G4E1

Micron Technology Datasheet

-

-

Min: 1

Mult: 1

NO

240

9

512Mx8

4G

64

No

EAR99

MICRON TECHNOLOGY INC

No Lead

Micron Technology Inc

MT16KTF1G64AZ-1G4E1

1333

1.45/1.575

70

1.283/1.425

0

DRAM Module

8Gbyte

Double

Socket

18

Dual

1073741824 words

1000000000

1248

70 °C

UNSPECIFIED

DIMM

DIMM,

30.5(Max)

133.5(Max)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

4(Max)

Obsolete

DIMM

PC3-10600

240

5.67

Yes

DIM

UDIMM

Commercial

1.35 V

1.35/1.5

e4

Obsolete

EAR99

GOLD

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX

8542.32.00.36

CMOS

DUAL

NO LEAD

1

1 mm

unknown

240

R-XDMA-N240

1.45 V

COMMERCIAL

1.283 V

1

SYNCHRONOUS

1Gx64

30.5 mm

64

68719476736 bit

No

DDR DRAM MODULE

8K

DUAL BANK PAGE BURST

Yes

240UDIMM

133.35 mm

4 mm

Supplier Unconfirmed

MT18JDF1G72PDZ-1G6D1

Mfr Part No

MT18JDF1G72PDZ-1G6D1

Micron Technology Datasheet

-

-

Min: 1

Mult: 1

Socket

NO

240

240

11

512Mx8

4G

72

Yes

EAR99

MICRON TECHNOLOGY INC

No Lead

Micron Technology Inc

MT18JDF1G72PDZ-1G6D1

1600

1.575

70

1.425

0

DRAM Module

8Gbyte

Double

Socket

18

8

18

Dual

1073741824 words

1000000000

1863

70 °C

UNSPECIFIED

DIMM

DIMM,

18.9(Max)

133.5(Max)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

4(Max)

Obsolete

DIMM

PC3-12800

240

NOT SPECIFIED

5.66

Compliant

Yes

8473300002

Yes

DIM

VLP RDIMM

Commercial

1.5 V

1.5

Obsolete

EAR99

70 °C

0 °C

AUTO/SELF REFRESH

8542.32.00.36

CMOS

DUAL

NO LEAD

NOT SPECIFIED

1

1 mm

unknown

240

R-XDMA-N240

1.5 V

1.575 V

COMMERCIAL

1.425 V

1.575 V

1.425 V

1

SYNCHRONOUS

1Gx72

18.9 mm

72

77309411328 bit

1.6 GHz

Yes

DDR DRAM MODULE

8K

DUAL BANK PAGE BURST

Yes

240RDIMM

133.35 mm

Yes with exemptions

W3H128M72E-667NBM

Mfr Part No

W3H128M72E-667NBM

Microsemi Datasheet

-

-

Min: 1

Mult: 1

YES

208

0.5 ns

6

1.8G

PBGA

72

Yes

4A994.a

MICROSEMI CORP

Microsemi Corporation

W3H128M72E-667NBM

1.25

667

1.9

125

1.7

-55

DRAM Module

1Gbyte

Surface Mount

8

5

134217728 words

128000000

1375

125 °C

-55 °C

PLASTIC/EPOXY

BGA

BGA,

3.94(Max)

22.1(Max)

RECTANGULAR

GRID ARRAY

16.1(Max)

Transferred

BGA

208

5.43

No

No

BGA

Military

1.8 V

1.8

EAR99

AUTO/SELF REFRESH

8542.32.00.36

CMOS

BOTTOM

BALL

1

1 mm

compliant

208

R-PBGA-B208

Not Qualified

1.9 V

MILITARY

1.7 V

1

SYNCHRONOUS

128Mx72

72

9663676416 bit

No

DDR DRAM

MULTI BANK PAGE BURST

Yes

Supplier Unconfirmed

W332M64V-100SBI

Mfr Part No

W332M64V-100SBI

Microsemi Datasheet

-

-

Min: 1

Mult: 1

YES

208

7 ns

3|2

512M

PBGA

64

No

4A994.a

MICROSEMI CORP

Microsemi Corporation

W332M64V-100SBI

7

100

3.6

85

3

-40

DRAM Module

256Mbyte

Surface Mount

4

4

33554432 words

32000000

460

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA,

2.27(Max)

22.15(Max)

RECTANGULAR

GRID ARRAY

13.15(Max)

Transferred

BGA

208

30

5.37

No

No

BGA

Industrial

3.3 V

3.3

No

Unconfirmed

EAR99

AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED

8542.32.00.36

CMOS

BOTTOM

BALL

225

1

1 mm

unknown

208

R-PBGA-B208

Not Qualified

3.6 V

INDUSTRIAL

3 V

1

SYNCHRONOUS

32Mx64

2.77 mm

64

2147483648 bit

No

SYNCHRONOUS DRAM

8K

MULTI BANK PAGE BURST

Yes

22.15 mm

13.15 mm

XCCACE128-I

Mfr Part No

XCCACE128-I

Xilinx Inc. Datasheet

-

-

Min: 1

Mult: 1

NO

CompactFlash®

60°C

1999

Obsolete

1 (Unlimited)

50

EAR99

8542.39.00.01

UNSPECIFIED

UNSPECIFIED

1

3.3V

50

R-XXMA-X50

Not Qualified

3.6V

COMMERCIAL

3V

128MB

SYNCHRONOUS

33MHz

8MX16

16

134217728 bit

SERIAL

3.3mm

42.8mm

36mm

Non-RoHS Compliant