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Memory Cards (4503)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Mount	Surface Mount	Number of Pins	Weight	Number of Terminals	Access Time-Max	CAS Latency	Chip Configuration	Chip Density (bit)	Chip Package Type	Connecting Mode	Conntact Coatings	Contact Materials	Data Bus Width (bit)	ECC Support	ECCN (US)	Height from mounting surface (mm)	HTS	Ihs Manufacturer	Lead Shape	Manufacturer	Manufacturer Part Number	Max. Access Time (ns)	Maximum Clock Rate (MHz)	Maximum Operating Supply Voltage (V)	Maximum Operating Temperature (°C)	Maximum Self Height	Minimum Operating Supply Voltage (V)	Minimum Operating Temperature (°C)	Module	Module Density	Module Sides	Mounting	Name	Number of Elements	Number of Chip Banks	Number of Chip per Module	Number of Ranks	Number of Words	Number of Words Code	Operating Current (mA)	Operating Temperature-Max	Operating Temperature-Min	Overall Dimension	Package Body Material	Package Code	Package Description	Package Height	Package Length	Package Shape	Package Specifications	Package Style	Package Width	Part Life Cycle Code	PC Type	PCB changed	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Soldering Temp (Max)	SPD EEPROM Support	Standard Package Name	Supplier Package	Supplier Temperature Grade	Supply Voltage-Nom (Vsup)	Typical Operating Supply Voltage (V)	Packaging	Part Status	ECCN Code	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Card Type	Max Supply Voltage	Min Supply Voltage	Number of Ports	Operating Mode	Access Time	Data Bus Width	Organization	Memory Width	Memory Density	Max Frequency	PLL	Memory IC Type	Refresh Cycles	Access Mode	Self Refresh	Module Type	Radiation Hardening	RoHS Status
Mfr Part No TS16D42AR00LNS	Transcend Information	Datasheet	-	-	Min: 1 Mult: 1								1Gx8	8G	FBGA				64	No	4A994.a		8473.30.11.40						2400	1.26	85		1.14	0	DRAM Module	16Gbyte		Socket					Dual			1088							31.25	133.35				3.9(Max)			288						Yes		UDIMM			1.2	Bulk	Active													288														2Gx64									288UDIMM		RoHS Compliant
Mfr Part No M391B1G73EB0-CMA00	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1							13	512Mx8	4G	78FBGA				64	Yes	4A994.a		8473.30.51.00						1866		85			0	DRAM Module	8Gbyte		Socket				18	Dual										30	133.35				4(Max)			240								UDIMM	Commercial		1.5															240														1Gx64									240UDIMM
Mfr Part No MT4LSDT864AG-10EG2	Micron Technology	Datasheet	-	-	Min: 1 Mult: 1							2	8Mx16	128M					64	No	EAR99				No Lead			6	100	3.6	65		3	0	DRAM Module	64Mbyte		Socket				4	Single			560							25.53(Max)	133.5(Max)				3.18(Max)			168							DIM	DIMM	Commercial		3.3	Tray	Obsolete													168														8Mx64									168UDIMM		RoHS non-compliant
Mfr Part No M471A5143EB1-CRC00	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1							17	512Mx8	4G	78FBGA				64	No	EAR99		8473.30.11.40						2400	1.26			1.14		DRAM Module	4Gbyte		Socket				8	Single			720							30	69.6				1.2(Max)			260								USODIMM			1.2		Obsolete													260														512Mx64									260USODIMM
Mfr Part No KVR1333D3E9S/8G	Kingston Technology	Datasheet	-	-	Min: 1 Mult: 1	Socket		240				9	512Mx8	4G	FBGA				72	Yes	EAR99				No Lead				1333	1.575	85		1.425	0	DRAM Module	8Gbyte	Double	Socket		18	8	18	Dual										30	133.35						PC3-10600	240			Compliant			No	DIM	DIMM			1.5		Obsolete		85 °C	0 °C										240			1.5 V					1.575 V	1.425 V					1Gx72			1.333 GHz	No				No	240DIMM	No	Yes with exemptions
Mfr Part No W332M72V-133SBI	Microsemi	Datasheet	-	-	Min: 1 Mult: 1		YES			208	5.5 ns	3\|2			PBGA				72	Yes	4A994.a			MICROSEMI CORP		Microsemi Corporation	W332M72V-133SBI		133	3.6	85		3	-40	DRAM Module	256Mbyte		Surface Mount			4	5		33554432 words	32000000	575	85 °C	-40 °C		PLASTIC/EPOXY	BGA	BGA,	3.2(Max)	22.15(Max)	RECTANGULAR		GRID ARRAY	16.15(Max)	Transferred		208	30	5.37		No		No		BGA	Industrial	3.3 V	3.3		Unconfirmed	EAR99			AUTO/SELF REFRESH	8542.32.00.36	CMOS	BOTTOM	BALL	225	1	1 mm	unknown	208	R-PBGA-B208	Not Qualified		3.6 V	INDUSTRIAL	3 V				1	SYNCHRONOUS			32Mx72	72	2415919104 bit		No	SYNCHRONOUS DRAM	8K	FOUR BANK PAGE BURST	Yes			Supplier Unconfirmed
Mfr Part No M393A2K43BB1-CTD7Q	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1							19	1Gx8	8G	FBGA				72	No	4A994.a		8542.32.00.71		No Lead				2666		85			0	DRAM Module	16Gbyte		Socket				18	Dual										31.25	133.35				3.9(Max)			288							DIM	RDIMM	Commercial		1.2		Active													288														2Gx72									288RDIMM		RoHS Compliant
Mfr Part No M386A8K40CM2-CRC	Samsung Electronics	Datasheet	400 In Stock	-	Min: 1 Mult: 1								4Gx4	16G	78FBGA				72	Yes			8473.30.11.40							1.26			1.14		DRAM Module	64Gbyte	Double				16	36	Quad																								No			Extended		1.2		Active																											8Gx72				No				Yes	288LRDIMM
Mfr Part No WF128K32N-70H1M5	Microsemi	Datasheet	-	-	Min: 1 Mult: 1								128Kx8	1M	HIP				32	No	4A994.a							70		5.5	125		4.5	-55	Flash Module	4Mbit		Through Hole				4				140							3.71(Max)	27.3				27.3			66								HIP	Military		5		Obsolete													66														128Kx32								No			Supplier Unconfirmed
Mfr Part No KVR24N17S6L/4	Kingston Technology	Datasheet	-	-	Min: 1 Mult: 1							17	512Mx16	8G	FBGA				64	No	EAR99		8473.30.11.40						2400		85			0	DRAM Module	4Gbyte	Single	Socket				4	Single										18.75	133.35						PC4-2400	288						Yes		VLP DIMM			1.2		LTB													288														512Mx64								Yes	288DIMM		RoHS Compliant
Mfr Part No M386A4G40DM1-CRC00	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1							15	2Gx4	8G	FBGA				72	No	4A994.a				Ball				2400		95			0	DRAM Module	32Gbyte		Socket			16	36	Quad																		288								LRDIMM	Commercial		1.2		Obsolete													288														4Gx72									288RDIMM		RoHS Compliant
Mfr Part No M393B1G73BH0-CMA	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1							13	512Mx8	4G	FBGA				72	Yes	4A994.a				No Lead			20	1866	1.575	95		1.425	0	DRAM Module	8Gbyte	Double	Socket			8	18	Dual			1945							30	133.35				4(Max)			240						Yes	DIMM	RDIMM			1.5		Obsolete													240														1Gx72				No				Yes	240RDIMM		RoHS Compliant
Mfr Part No MT16LSDT3264AY-13EG3	Micron Technology	Datasheet	-	-	Min: 1 Mult: 1	Socket		168				2	16Mx8	128M					64	No	EAR99				No Lead			5.4	133	3.6	65		3	0	DRAM Module	256Mbyte		Socket		16		16	Dual			1336							35.05(Max)	133.5(Max)				3.99(Max)			168			Compliant				DIM	DIMM	Commercial		3.3	Tray	Obsolete		65 °C	0 °C										168			3.3 V					3.6 V	3 V			5.4 ns	64 b	32Mx64			133 MHz						168UDIMM	No	Yes with exemptions
Mfr Part No M393A8G40MB2-CVF	Samsung Electronics	Datasheet	800 In Stock	-	Min: 1 Mult: 1							21	4Gx4	16G	78FBGA				72	Yes	EAR99		8473.30.11.40							1.26			1.14		DRAM Module	64Gbyte	Double	Socket				36	Dual			2981							31.25	133.35				4.3(Max)			288						No	DIM	RDIMM			1.2		Preliminary													288														8Gx72				No				Yes	288RDIMM		RoHS Compliant
Mfr Part No XKSD-020	XKB CONNECTIVITY	Datasheet	-	-	Min: 1 Mult: 1				0							Self-ejecting	Gold plated	Phosphor Bronze														2.85mm							#REF!																	SMD										260°C								Active																				标准SD卡
Mfr Part No XKTF-0803-0	XKB CONNECTIVITY	Datasheet	160000 In Stock	1: $0.072141 10: $0.068058 100: $0.064206 500: $0.060571 View all price	Min: 1 Mult: 1											Plug and Play	Gold plated	Copper alloys														1.5mm							#REF!																	SMD										260°C																												MicroSD卡(TF卡)
Mfr Part No XKSIM-220	XKB CONNECTIVITY	Datasheet	-	-	Min: 1 Mult: 1				1.984							Self-ejecting	Gold plated	Copper alloys				1.9										1.9mm							#REF!										W26.85XD19.20XH1.9							SMD										260°C								Active													9							MicroSIM卡
Mfr Part No XKSD-006	XKB CONNECTIVITY	Datasheet	160000 In Stock	1: $0.203878 10: $0.192338 100: $0.181451 500: $0.171180 View all price	Min: 1 Mult: 1				2.767							Self-ejecting	Gold plated	Copper alloys				2.82										2.82mm							#REF!										W29.0XD28.48XH2.82							SMD										260°C								Active													11							标准SD卡
Mfr Part No XKTF-1307-16	XKB CONNECTIVITY	Datasheet	160000 In Stock	1: $0.054890 10: $0.051783 100: $0.048852 500: $0.046087 View all price	Min: 1 Mult: 1				0							Flip-lid type	Gold plated	Copper alloys				1.6										1.6mm							#REF!										W13.4XD13.6XH1.6							SMD										260°C								Active													8							MicroSD卡(TF卡)
Mfr Part No M470T6464EHS-CE7	Samsung Electronics	Datasheet	-	-	Min: 1 Mult: 1							5	64Mx16	1G	FBGA				64	No	4A994.a				No Lead			0.4	800	1.9	95		1.7	0	DRAM Module	512Mbyte	Single	Socket			8	4	Single			480							30	67.6				3.8(Max)			200						Yes	DIM	USODIMM	Commercial		1.8		Obsolete													200														64Mx64				No				Yes	200SODIMM		RoHS Compliant

Memory Cards (4503)