The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No MX25L25635FZ2R-10G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL512N10TAI020 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142EC, TSOP-56 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | R-PDSO-G56 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 32MX16 | 1.2 mm | 16 | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 14 mm | ||||||||||||||||||||||||||
| Mfr Part No S29GL512N10TAI020 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.09 mA | 32MX16 | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | |||||||||||||||||||||||||||
| Mfr Part No S29GL032M90TCIR40 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | Matte Tin (Sn) | BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 2MX16 | 1.2 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | 4/8 words | YES | BOTTOM | YES | 18.4 mm | 12 mm | ||||||||||
 | Mfr Part No M27W512-80K6 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 80 ns | STMICROELECTRONICS | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | Yes | 3 V | e0 | EAR99 | ACCESS TIME 70 NANO SECS AT VCC 3V TO 3.6V | 8542.32.00.71 | QUAD | J BEND | NOT SPECIFIED | 1 | 1.27 mm | compliant | NOT SPECIFIED | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.015 mA | 64KX8 | 3-STATE | 3.56 mm | 8 | 0.000015 A | 524288 bit | PARALLEL | COMMON | OTP ROM | 13.97 mm | 11.43 mm | ||||||||||||||||||||||
| Mfr Part No S29GL016A90FFIR10 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | ADVANCED MICRO DEVICES INC | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA64,8X8,40 | BGA64,8X8,40 | SQUARE | GRID ARRAY | Transferred | Yes | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B64 | Not Qualified | INDUSTRIAL | 0.06 mA | 1MX16 | 16 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,31 | 8K,64K | 4/8 words | YES | TOP | YES | ||||||||||||||||||||||||||
| Mfr Part No S29GL016A90FFIR10 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | Yes | 3.3 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 40 | R-PBGA-B64 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 1MX16 | 1.4 mm | 16 | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM/TOP | 13 mm | 11 mm | ||||||||||||||||||||||||
| Mfr Part No W29N01HZYINA | Winbond Electronics Corp | Datasheet | 683 | - | Min: 1 Mult: 1 | YES | 68 | WINBOND ELECTRONICS CORP | 134217728 words | 128000000 | 105 °C | -40 °C | WLCSP | , | BGA68(UNSPEC) | RECTANGULAR | CHIP SCALE | Active | Yes | 1.8 V | EAR99 | SLC NAND TYPE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | compliant | NOT SPECIFIED | R-XBCS-B68 | 1.95 V | 1.7 V | ASYNCHRONOUS | 0.035 mA | 128MX8 | 0.54 mm | 8 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | 1.8 V | 100000 Write/Erase Cycles | 0.025 ms | 10 | HARDWARE | |||||||||||||||||||||||||||||
| Mfr Part No SST29VF020-70-4C-NH | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, MS-016AE, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 256KX8 | 3.556 mm | 8 | 0.000015 A | 2097152 bit | PARALLEL | FLASH | 2.7 V | YES | YES | NO | 2K | 128 | 13.97 mm | 11.43 mm | ||||||||||||||||||||
| Mfr Part No W25Q32FWTBIG | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 104 MHz | WINBOND ELECTRONICS CORP | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | TFBGA-24 | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | Yes | 1.8 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | NOT SPECIFIED | R-PBGA-B24 | Not Qualified | 1.95 V | INDUSTRIAL | 1.65 V | SYNCHRONOUS | 0.02 mA | 4MX8 | 3-STATE | 1.2 mm | 8 | 0.00002 A | 33554432 bit | SERIAL | FLASH | 1.8 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 8 mm | 6 mm | ||||||||||||||||||||
 | Mfr Part No M25P16-VMF6TG | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 25 MHz | NUMONYX | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | Yes | 3 V | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 16 | R-PDSO-G16 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.015 mA | 2MX8 | 2.65 mm | 8 | 0.00001 A | 16777216 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 15 ms | 20 | HARDWARE/SOFTWARE | 10.3 mm | 7.5 mm | ||||||||||||||||||
| Mfr Part No M25P16-VMF6TG | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 50 MHz | STMICROELECTRONICS | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | Yes | 3 V | e4 | EAR99 | NOR TYPE | NICKEL PALLADIUM GOLD | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 16 | R-PDSO-G16 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.015 mA | 2MX8 | 2.65 mm | 8 | 0.00001 A | 16777216 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 15 ms | 20 | HARDWARE/SOFTWARE | 10.3 mm | 7.5 mm | ||||||||||||||||||
 | Mfr Part No S29AL016D90DGI027 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 45 | 90 ns | SPANSION INC | 1048576 words | 1000000 | 85 °C | -40 °C | UNSPECIFIED | DIE | DIE-45 | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | Obsolete | DIE | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | UPPER | NO LEAD | 1 | unknown | 45 | R-XUUC-N45 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 1MX16 | 16 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM | |||||||||||||||||||||||||||||
| Mfr Part No S29NS016J0LBFW003 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 70 ns | SPANSION INC | 3 | 1048576 words | 1000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | 7.70 X 6.20 MM, LEAD FREE, FBGA-44 | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 44 | R-PBGA-B44 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 0.06 mA | 1MX16 | 1 mm | 16 | 0.00004 A | 16777216 bit | PARALLEL | FLASH | 1.8 V | 80 ms | YES | YES | YES | 4,31 | 8K,32K | YES | TOP | YES | 7.7 mm | 6.2 mm | |||||||||||
| Mfr Part No AM29F400BB-45ED | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 45 ns | ADVANCED MICRO DEVICES INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 5 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.06 mA | 256KX16 | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | |||||||||||||||||||||||||||||
| Mfr Part No FM27C040VE150 | Fairchild Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 150 ns | FAIRCHILD SEMICONDUCTOR CORP | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 512KX8 | 3-STATE | 3.56 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | 13.995 mm | 11.455 mm | ||||||||||||||||||||||||
 | Mfr Part No SST37VF040-70-3C-WH | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | 8 X 14 MM, MO-142BA, TSOP1-32 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 512KX8 | 1.2 mm | 8 | 0.000015 A | 4194304 bit | PARALLEL | FLASH | 2.7 V | NO | NO | NO | 12.4 mm | 8 mm | |||||||||||||||||||||
| Mfr Part No UPB429C | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 70 ns | RENESAS ELECTRONICS CORP | 2048 words | 2000 | 70 °C | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | 2KX8 | 8 | 16384 bit | OTP ROM | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EN25F20A-104XIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | EON SILICON SOLUTION INC | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, HALOGEN FREE, ROHS AND REACH COMPLIANT, USON-8 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | 1 | 0.5 mm | unknown | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 256KX8 | 0.6 mm | 8 | 2097152 bit | SERIAL | FLASH | 2.7 V | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||
 | Mfr Part No SST39VF800A-90-4C-B3KE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TFBGA | 6 X 8 MM, LEAD FREE, 0.80 MM PITCH, MO-210AB-1, TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 512KX16 | 1.2 mm | 16 | 0.00002 A | 8388608 bit | PARALLEL | FLASH | 2.7 V | YES | YES | YES | 256 | 2K | YES | 8 mm | 6 mm |
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MX25L25635FZ2R-10G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL512N10TAI020
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S29GL512N10TAI020
AMD
Package:Memory - Modules
Price: please inquire
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S29GL032M90TCIR40
Spansion
Package:Memory - Modules
Price: please inquire
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M27W512-80K6
STMicroelectronics
Package:Memory - Modules
Price: please inquire
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S29GL016A90FFIR10
AMD
Package:Memory - Modules
Price: please inquire
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S29GL016A90FFIR10
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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W29N01HZYINA
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
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SST29VF020-70-4C-NH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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W25Q32FWTBIG
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
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M25P16-VMF6TG
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
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M25P16-VMF6TG
STMicroelectronics
Package:Memory - Modules
Price: please inquire
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S29AL016D90DGI027
Spansion
Package:Memory - Modules
Price: please inquire
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S29NS016J0LBFW003
Spansion
Package:Memory - Modules
Price: please inquire
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AM29F400BB-45ED
AMD
Package:Memory - Modules
Price: please inquire
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FM27C040VE150
Fairchild Semiconductor Corporation
Package:Memory - Modules
Price: please inquire
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SST37VF040-70-3C-WH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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UPB429C
Renesas Electronics Corporation
Package:Memory - Modules
Price: please inquire
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EN25F20A-104XIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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SST39VF800A-90-4C-B3KE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire