The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No FN-TRAN-QSFP28-SR-C | ATGBICS | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No N25Q512A13G12A0E | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 108 MHz | MICRON TECHNOLOGY INC | 67108864 words | 64000000 | 125 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B24 | 3.6 V | AUTOMOTIVE | 2.7 V | SYNCHRONOUS | 64MX8 | 3-STATE | 1.2 mm | 8 | 536870912 bit | SERIAL | FLASH | 3 V | QSPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 8 mm | 6 mm | ||||||||||||||||||||||||||
| Mfr Part No XC1765ELPC2OC | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | 250 ns | 2.5 MHz | ADVANCED MICRO DEVICES INC | 65536 words | 16000 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Active | No | 5 V | QUAD | J BEND | 1 | 1.27 mm | compliant | S-PQCC-J20 | Not Qualified | COMMERCIAL | SYNCHRONOUS | 0.01 mA | 16KX8 | 3-STATE | 8 | 0.00005 A | 131072 bit | PARALLEL | COMMON | OTP ROM | |||||||||||||||||||||||||||||||||||
| Mfr Part No GD25Q10UIGR | ELM Technology Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 120 MHz | ELM TECHNOLOGY CORP | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Contact Manufacturer | 3 V | EAR99 | 8542.32.00.51 | DUAL | NO LEAD | 1 | 0.5 mm | unknown | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 128KX8 | 0.65 mm | 8 | 1048576 bit | SERIAL | FLASH | 2.7 V | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No TC58F400F-90 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 90 ns | TOSHIBA CORP | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | SOP | 0.600 INCH, PLASTIC, SOP-44 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 100000 ERASE/PROGRAM CYCLES; BLOCK ERASE; ALSO CONFIGURABLE AS 256K X 16 | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 512KX8 | 3.1 mm | 8 | 4194304 bit | PARALLEL | FLASH | 5 V | BOTTOM | 28.2 mm | 12.6 mm | |||||||||||||||||||||||||
| Mfr Part No HY29F400ABT-55 | SK Hynix Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 55 ns | SK HYNIX INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | 5 V | e6 | EAR99 | NOR TYPE | TIN BISMUTH | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 256KX16 | 1.2 mm | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||||
| Mfr Part No S29GL064M90TFIR6 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | ADVANCED MICRO DEVICES INC | Obsolete | EAR99 | 8542.32.00.51 | unknown | FLASH | 3 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M90TFIR6 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 128 | 32K | 4 words | YES | 18.4 mm | 12 mm | ||||||||||||||
| Mfr Part No IS25LP064A-JMLA2 | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 133 MHz | INTEGRATED SILICON SOLUTION INC | 8388608 words | 8000000 | 105 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | 3 V | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G16 | 3.6 V | INDUSTRIAL | 2.3 V | SYNCHRONOUS | 8MX8 | 3-STATE | 2.65 mm | 8 | 67108864 bit | AEC-Q100 | SERIAL | FLASH | 3 V | 10.3 mm | 7.5 mm | |||||||||||||||||||||||||||||||
| Mfr Part No IS25LP256D-JMLA3-TY | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29JL032H90TFI220 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142DDD, TSOP-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | 3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||||||||||||
 | Mfr Part No S29JL032H90TFI220 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142DD, LEAD FREE, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | Yes | 3 V | e3 | Yes | 3A991.B.1.A | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 40 | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.045 mA | 2MX16 | 1.2 mm | 16 | 0.00001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | BOTTOM | YES | 18.4 mm | 12 mm | ||||||||||
| Mfr Part No S29JL032H90TFI220 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | ADVANCED MICRO DEVICES INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | LEAD FREE, MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP1 | Yes | 3 V | e3 | EAR99 | NOR TYPE | TIN | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.045 mA | 2MX16 | 1.2 mm | 16 | 0.00001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | BOTTOM | YES | 18.4 mm | 12 mm | |||||||||||||
 | Mfr Part No S29GL128M11FAIR10 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 110 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, FORTIFIED, BGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 8MX16 | 1.4 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 256 | 64K | 4/8 words | YES | YES | 13 mm | 11 mm | ||||||||||||
 | Mfr Part No S29PL127J60BFI00 | Spansion | Datasheet | 504 | - | Min: 1 Mult: 1 | YES | 80 | 60 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 8 X 11 MM, LEAD FREE, FBGA-80 | BGA80,8X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | TOP AND BOTTOM BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 80 | R-PBGA-B80 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.07 mA | 8MX16 | 1 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,254 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 11 mm | 8 mm | ||||||||||
| Mfr Part No S29GL512N10TAI01 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 32MX16 | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | BOTTOM/TOP | YES | |||||||||||||||||||||||||
| Mfr Part No S29AL004D70TAI020 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | ADVANCED MICRO DEVICES INC | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | INDUSTRIAL | 0.035 mA | 256KX16 | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | ||||||||||||||||||||||||||
| Mfr Part No S29AL004D70TAI020 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSOP-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 256KX16 | 1.2 mm | 16 | 4194304 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||||||||||||
| Mfr Part No MX25UW51245GXDI00/TRAY | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TN28F512-150 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 |
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FN-TRAN-QSFP28-SR-C
ATGBICS
Package:Memory - Modules
Price: please inquire
-
N25Q512A13G12A0E
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
-
XC1765ELPC2OC
AMD
Package:Memory - Modules
Price: please inquire
-
GD25Q10UIGR
ELM Technology Corp
Package:Memory - Modules
Price: please inquire
-
TC58F400F-90
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
-
HY29F400ABT-55
SK Hynix Inc
Package:Memory - Modules
Price: please inquire
-
S29GL064M90TFIR6
AMD
Package:Memory - Modules
Price: please inquire
-
S29GL064M90TFIR6
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
-
IS25LP064A-JMLA2
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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IS25LP256D-JMLA3-TY
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
-
S29JL032H90TFI220
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
-
S29JL032H90TFI220
Spansion
Package:Memory - Modules
Price: please inquire
-
S29JL032H90TFI220
AMD
Package:Memory - Modules
Price: please inquire
-
S29GL128M11FAIR10
Spansion
Package:Memory - Modules
Price: please inquire
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S29PL127J60BFI00
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL512N10TAI01
AMD
Package:Memory - Modules
Price: please inquire
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S29AL004D70TAI020
AMD
Package:Memory - Modules
Price: please inquire
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S29AL004D70TAI020
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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MX25UW51245GXDI00/TRAY
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
-
TN28F512-150
Intel Corporation
Package:Memory - Modules
Price: please inquire