The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
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- Memory Density
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Reverse Pinout | Length | Width |
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 | Mfr Part No K9F1G16U0M-PCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | compliant | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.02 mA | 64MX16 | 16 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | NO | NO | YES | 1K | 64K | 1K words | YES | ||||||||||||||||||||||||||||||||
| Mfr Part No MX29GL128FUT2I-90G-TR | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M90BAIR00 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 90 ns | ADVANCED MICRO DEVICES INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA63,8X12,32 | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B63 | Not Qualified | INDUSTRIAL | 0.06 mA | 8MX8 | 8 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | YES | YES | YES | 128 | 64K | 8 words | YES | YES | |||||||||||||||||||||||||||
| Mfr Part No K9F1G08U0B-PIB0T | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 20 ns | SAMSUNG SEMICONDUCTOR INC | 3 | 134217728 words | 128000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, TSOP1-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | Yes | 3.3 V | EAR99 | SLC NAND TYPE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 128MX8 | 1.2 mm | 8 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | 2.7 V | NO | NO | YES | 1K | 128K | 2K words | YES | 18.4 mm | 12 mm | |||||||||||||||||
| Mfr Part No TMM24256AP | Toshiba America Electronic Components | Datasheet | 19 | - | Min: 1 Mult: 1 | NO | 28 | 200 ns | TOSHIBA CORP | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Contact Manufacturer | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T28 | Not Qualified | COMMERCIAL | 0.1 mA | 32KX8 | 3-STATE | 8 | 262144 bit | COMMON | OTP ROM | 12.5 V | |||||||||||||||||||||||||||||||||||
| Mfr Part No EN25F10A-104RBIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | EON SILICON SOLUTION INC | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSOP | 0.150 INCH, HALOGEN FREE, ROHS AND REACH COMPLIANT, VSOP-8 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Transferred | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 128KX8 | 0.9 mm | 8 | 1048576 bit | SERIAL | FLASH | 2.7 V | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No EN29GL064AT-70TIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | EON SILICON SOLUTION INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | 3 V | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 12 mm | |||||||||||||||||||||||||||||||||
 | Mfr Part No S29GL128N11FAI010 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 110 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | No | 3 V | e0 | No | 3A991.B.1.A | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 8MX16 | 1.4 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | YES | 13 mm | 11 mm | ||||||||||||
| Mfr Part No S29GL128N11FAI010 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 110 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, FBGA-64 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | R-PBGA-B64 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 8MX16 | 1.4 mm | 16 | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | 13 mm | 11 mm | ||||||||||||||||||||||||||
| Mfr Part No S29GL128N11FAI010 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 110 ns | ADVANCED MICRO DEVICES INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | GRID ARRAY | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B64 | Not Qualified | INDUSTRIAL | 0.09 mA | 8MX16 | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | YES | |||||||||||||||||||||||||||
| Mfr Part No W49F002UP12BN | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | WINBOND ELECTRONICS CORP | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-32 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | 5 V | EAR99 | NOR TYPE | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 256KX8 | 3.56 mm | 8 | 2097152 bit | PARALLEL | FLASH | 5 V | TOP | 13.97 mm | 11.43 mm | ||||||||||||||||||||||||||||||
| Mfr Part No AM28F020-120FC | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | ROCHESTER ELECTRONICS LLC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | SOP | REVERSE, TSOP-32 | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | 5 V | EAR99 | NOR TYPE | 10K WRITE/ERASE CYCLES MIN | 8542.32.00.51 | DUAL | GULL WING | 1 | unknown | R-PDSO-G32 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 256KX8 | 8 | 2097152 bit | PARALLEL | FLASH | 12 V | |||||||||||||||||||||||||||||||||||||
| Mfr Part No AM28F020-120FC | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | ADVANCED MICRO DEVICES INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, TSSOP32,.8,20 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE | Obsolete | TSOP | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 10K WRITE/ERASE CYCLES MIN | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 3-STATE | 8 | 0.0001 A | 2097152 bit | PARALLEL | FLASH | 12 V | 10000 Write/Erase Cycles | NO | NO | YES | YES | |||||||||||||||||||||
| Mfr Part No W25Q256JVESQ | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S25FL128POXNFI013 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | SPANSION INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SON | SON, SOLCC8,.3 | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE | Obsolete | Yes | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1.27 mm | compliant | 40 | R-PDSO-N8 | Not Qualified | INDUSTRIAL | 0.026 mA | 16MX8 | 8 | 0.00002 A | 134217728 bit | SERIAL | FLASH | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||
 | Mfr Part No AM29F010-55JE | AMD | Datasheet | 172 | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | ADVANCED MICRO DEVICES INC | 131072 words | 128000 | 125 °C | -55 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | No | 3A001.A.2.C | NOR TYPE | TIN LEAD | EMBEDDED ALGORITHM; HARDWARE DATA PROTECTION | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 3-STATE | 3.556 mm | 8 | 0.0001 A | 1048576 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | YES | YES | YES | 8 | 16K | 13.97 mm | 11.43 mm | |||||||||||||||
| Mfr Part No MX25L12833FM2I-10G/TUBE | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL256P11FFIR20 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 110 ns | SPANSION INC | 3 | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Transferred | BGA | Yes | 3.3 V | e1 | Yes | EAR99 | NOR TYPE | TIN SILVER COPPER | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 16MX16 | 3-STATE | 1.4 mm | 16 | 268435456 bit | PARALLEL | FLASH | 3 V | 13 mm | 11 mm | ||||||||||||||||||||||||
| Mfr Part No PF48F2000P0ZTQ0 | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 88 | 88 ns | MICRON TECHNOLOGY INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 8 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, SCSP-88 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | 1.8 V | EAR99 | NOR TYPE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | R-PBGA-B88 | 2 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 1.8 V | TOP | 10 mm | 8 mm | |||||||||||||||||||||||||||||||
| Mfr Part No EN27SN1G08-45CEIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | EON SILICON SOLUTION INC | 134217728 words | 128000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | 1.8 V | EAR99 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | R-PBGA-B63 | 1.95 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 128MX8 | 1 mm | 8 | 1073741824 bit | PARALLEL | FLASH | 1.8 V | 11 mm | 9 mm |
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K9F1G16U0M-PCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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MX29GL128FUT2I-90G-TR
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL064M90BAIR00
AMD
Package:Memory - Modules
Price: please inquire
-
K9F1G08U0B-PIB0T
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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TMM24256AP
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
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EN25F10A-104RBIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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EN29GL064AT-70TIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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S29GL128N11FAI010
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL128N11FAI010
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S29GL128N11FAI010
AMD
Package:Memory - Modules
Price: please inquire
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W49F002UP12BN
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
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AM28F020-120FC
Rochester Electronics LLC
Package:Memory - Modules
Price: please inquire
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AM28F020-120FC
AMD
Package:Memory - Modules
Price: please inquire
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W25Q256JVESQ
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
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S25FL128POXNFI013
Spansion
Package:Memory - Modules
Price: please inquire
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AM29F010-55JE
AMD
Package:Memory - Modules
Price: please inquire
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MX25L12833FM2I-10G/TUBE
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL256P11FFIR20
Spansion
Package:Memory - Modules
Price: please inquire
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PF48F2000P0ZTQ0
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
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EN27SN1G08-45CEIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire