The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
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- Memory IC Type
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- Memory Density
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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![]() | Mfr Part No S29AL004D90TAI010 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SPANSION INC | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 256KX16 | 1.2 mm | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 3 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | TOP | 18.4 mm | 12 mm | ||||||||||||
![]() | Mfr Part No SDINBDV4-64GT | Western Digital Corp | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TBP28S86AN-60 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 50 ns | TEXAS INSTRUMENTS INC | 1024 words | 512 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | not_compliant | NOT SPECIFIED | R-PDIP-T24 | Not Qualified | COMMERCIAL | ASYNCHRONOUS | 0.17 mA | 512X8 | 8 | 4096 bit | PARALLEL | OTP ROM | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM27C020-75PC | AMD | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 70 ns | ADVANCED MICRO DEVICES INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 32 | R-PDIP-T32 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 3-STATE | 5.715 mm | 8 | 0.0001 A | 2097152 bit | PARALLEL | COMMON | OTP ROM | 42.164 mm | 15.24 mm | |||||||||||||||||||||||||
![]() | Mfr Part No CY7C243-20PC | Cypress Semiconductor | Datasheet | 4 | - | Min: 1 Mult: 1 | NO | 24 | 20 ns | CYPRESS SEMICONDUCTOR CORP | 4096 words | 4000 | 70 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 24 | R-PDIP-T24 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.1 mA | 4KX8 | 3-STATE | 8 | 32768 bit | PARALLEL | COMMON | OTP ROM | ||||||||||||||||||||||||||||||
![]() | Mfr Part No HY27US08561A-TCB | SK Hynix Inc | Datasheet | 1600 | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SK HYNIX INC | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | No | EAR99 | SLC NAND TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 32MX8 | 1.2 mm | 8 | 0.00005 A | 268435456 bit | PARALLEL | FLASH | 3.3 V | NO | NO | YES | 2K | 16K | 512 words | YES | 18.4 mm | 12 mm | ||||||||||||||||||
![]() | Mfr Part No MX27C4000AQC-90 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 90 ns | MACRONIX INTERNATIONAL CO LTD | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.04 mA | 512KX8 | 3-STATE | 3.55 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | 14.05 mm | 11.43 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No MBM29LV008T-10PTN | FUJITSU Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 100 ns | FUJITSU LTD | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | PLASTIC, TSOP1-40 | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | MINIMUM 100000 WRITE/ERASE CYCLES | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | R-PDSO-G40 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.035 mA | 1MX8 | 1.2 mm | 8 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 3 V | 100000 Write/Erase Cycles | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | 18.4 mm | 10 mm | |||||||||||||||||||
![]() | Mfr Part No PM25LV040-100SCE | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 100 MHz | INTEGRATED SILICON SOLUTION INC | 524288 words | 512000 | 105 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1.27 mm | compliant | R-PDSO-G8 | Not Qualified | INDUSTRIAL | 0.03 mA | 512KX8 | 8 | 0.00002 A | 4194304 bit | SERIAL | FLASH | SPI | 200000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM29SL800DB-90WCD | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | ADVANCED MICRO DEVICES INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA48,6X8,32 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B48 | Not Qualified | COMMERCIAL | 0.03 mA | 512KX16 | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | BOTTOM | ||||||||||||||||||||||||||||||
![]() | Mfr Part No SST39LF040-55-4C-WH | Silicon Storage Technology | Datasheet | 128 | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP32,.56,20 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.02 mA | 512KX8 | 1.2 mm | 8 | 0.000015 A | 4194304 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 128 | 4K | 12.4 mm | 8 mm | |||||||||||||||||||||
![]() | Mfr Part No M29W040B90K6E | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 90 ns | STMICROELECTRONICS | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LEAD FREE, PLASTIC, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 512KX8 | 3.56 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | FLASH | 2.7 V | 100000 Write/Erase Cycles | YES | YES | YES | 8 | 64K | 13.97 mm | 11.43 mm | |||||||||||||||||||
![]() | Mfr Part No TMSJL27C010A-12 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K9F2816U0C-YIB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | SLC NAND TYPE | TIN LEAD | CONTAINS ADDITIONAL 4M BIT NAND FLASH | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 8MX16 | 1.2 mm | 16 | 0.00005 A | 134217728 bit | PARALLEL | FLASH | 2.7 V | NO | NO | YES | 1K | 8K | 256 words | YES | 18.4 mm | 12 mm | |||||||||||||||||
![]() | Mfr Part No BL24CM1A-SFRC | BL(Shanghai Belling) | Datasheet | 48000 | - | Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K4B4G1646E-BYK000 | Samsung Electro-Mechanics | Datasheet | 1460 |
| Min: 1 Mult: 1 | Tray | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TC58CVG1S3HRAIJ(BAJ) | KIOXIA | Datasheet | - | - | Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No FT24C128A-TSR-B | FMD(Fremont Micro Devices) | Datasheet | - | - | Min: 1 Mult: 1 | Tube-packed | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29WS128J0PBFW110 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 55 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | 8 X 11.60 MM, LEAD FREE, FBGA-84 | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 84 | R-PBGA-B84 | Not Qualified | 1.95 V | OTHER | 1.65 V | ASYNCHRONOUS | 0.054 mA | 8MX16 | 1 mm | 16 | 0.00005 A | 134217728 bit | PARALLEL | FLASH | 1.8 V | YES | YES | YES | 16,254 | 4K,32K | YES | BOTTOM/TOP | YES | 11.6 mm | 8 mm | |||||||||||||
![]() | Mfr Part No SST39SF020A-45-4C-NHE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 45 ns | SILICON STORAGE TECHNOLOGY INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, MS-016AE, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | Yes | 5 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | QUAD | J BEND | 260 | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.035 mA | 256KX8 | 3.556 mm | 8 | 0.0001 A | 2097152 bit | PARALLEL | FLASH | 5 V | YES | YES | YES | 64 | 4K | 13.97 mm | 11.43 mm |
S29AL004D90TAI010
Spansion
Package:Memory - Modules
Price: please inquire
SDINBDV4-64GT
Western Digital Corp
Package:Memory - Modules
Price: please inquire
TBP28S86AN-60
Texas Instruments
Package:Memory - Modules
Price: please inquire
AM27C020-75PC
AMD
Package:Memory - Modules
Price: please inquire
CY7C243-20PC
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
HY27US08561A-TCB
SK Hynix Inc
Package:Memory - Modules
Price: please inquire
MX27C4000AQC-90
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
MBM29LV008T-10PTN
FUJITSU Limited
Package:Memory - Modules
Price: please inquire
PM25LV040-100SCE
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
AM29SL800DB-90WCD
AMD
Package:Memory - Modules
Price: please inquire
SST39LF040-55-4C-WH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
M29W040B90K6E
STMicroelectronics
Package:Memory - Modules
Price: please inquire
TMSJL27C010A-12
Texas Instruments
Package:Memory - Modules
Price: please inquire
K9F2816U0C-YIB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
BL24CM1A-SFRC
BL(Shanghai Belling)
Package:Memory - Modules
Price: please inquire
K4B4G1646E-BYK000
Samsung Electro-Mechanics
Package:Memory - Modules
3.228789
TC58CVG1S3HRAIJ(BAJ)
KIOXIA
Package:Memory - Modules
Price: please inquire
FT24C128A-TSR-B
FMD(Fremont Micro Devices)
Package:Memory - Modules
Price: please inquire
S29WS128J0PBFW110
Spansion
Package:Memory - Modules
Price: please inquire
SST39SF020A-45-4C-NHE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
