Memory - Modules (5402)

-

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

YES

56

100 ns

SPANSION INC

3

4194304 words

4000000

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

LEAD FREE, MO-142EC, TSOP-56

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Obsolete

TSOP1

Yes

3.3 V

e3

EAR99

NOR TYPE

MATTE TIN

8542.32.00.51

DUAL

GULL WING

260

1

0.5 mm

unknown

40

56

R-PDSO-G56

Not Qualified

3.6 V

INDUSTRIAL

3 V

ASYNCHRONOUS

0.06 mA

4MX16

1.2 mm

16

0.000005 A

67108864 bit

PARALLEL

FLASH

3 V

8

YES

YES

YES

128

64K

4/8 words

YES

YES

18.4 mm

14 mm

-

-

Min: 1

Mult: 1

YES

44

85 ns

INTEL CORP

2097152 words

2000000

70 °C

PLASTIC/EPOXY

SOP

SOP, SOP44,.63

SOP44,.63

RECTANGULAR

SMALL OUTLINE

Obsolete

SOIC

No

5 V

e0

EAR99

NOR TYPE

TIN LEAD

8542.32.00.51

DUAL

GULL WING

1

1.27 mm

unknown

44

R-PDSO-G44

Not Qualified

5.25 V

COMMERCIAL

4.75 V

ASYNCHRONOUS

0.05 mA

2MX8

3-STATE

2.95 mm

8

0.00001 A

16777216 bit

PARALLEL

FLASH

5 V

NO

NO

YES

32

64K

YES

28.2 mm

13.3 mm

-

-

Min: 1

Mult: 1

NO

32

60 ns

MICROSS COMPONENTS

131072 words

128000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP, DIP32,.6

DIP32,.6

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Active

MODULE

5 V

e4

3A001.A.2.C

NOR TYPE

GOLD

100K ERASE/PROGRAM CYCLES

8542.32.00.51

DUAL

THROUGH-HOLE

1

2.54 mm

compliant

32

R-XDIP-T32

Not Qualified

5.5 V

MILITARY

4.5 V

ASYNCHRONOUS

0.05 mA

128KX8

8

0.0016 A

1048576 bit

38535Q/M;38534H;883B

PARALLEL

FLASH MODULE

5 V

YES

YES

NO

8

16K

-

-

Min: 1

Mult: 1

NO

32

60 ns

AEROFLEX MICROELECTRONIC SOLUTIONS

131072 words

128000

125 °C

-55 °C

CERAMIC

DIP

DIP32,.6

RECTANGULAR

IN-LINE

Obsolete

5 V

3A001.A.2.C

NOR TYPE

8542.32.00.51

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T32

Not Qualified

MILITARY

0.05 mA

128KX8

8

0.0016 A

1048576 bit

38535Q/M;38534H;883B

PARALLEL

FLASH

YES

YES

NO

8

16K

-

-

Min: 1

Mult: 1

YES

32

200 ns

ATMEL CORP

3

262144 words

256000

70 °C

PLASTIC/EPOXY

TSOP1

TSOP1, TSSOP32,.8,20

TSSOP32,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

Obsolete

TSOP

No

5 V

e0

No

EAR99

TIN LEAD

8542.32.00.71

DUAL

GULL WING

240

1

0.5 mm

compliant

32

R-PDSO-G32

Not Qualified

5.5 V

COMMERCIAL

3 V

ASYNCHRONOUS

0.025 mA

256KX8

3-STATE

1.2 mm

8

0.00002 A

2097152 bit

PARALLEL

COMMON

OTP ROM

18.4 mm

8 mm

-

-

Min: 1

Mult: 1

YES

69

103 ns

TOSHIBA CORP

33554432 words

32000000

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

FBGA, BGA69,10X12,32

BGA69,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

Obsolete

No

EAR99

8542.32.00.51

BOTTOM

BALL

0.8 mm

unknown

R-PBGA-B69

Not Qualified

INDUSTRIAL

0.045 mA

32MX8

8

0.00004 A

268435456 bit

PARALLEL

FLASH

NO

NO

NO

2K

16K

512 words

YES

-

-

Min: 1

Mult: 1

NO

16

60 ns

NATIONAL SEMICONDUCTOR CORP

256 words

256

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP, DIP16,.3

DIP16,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

e0

No

EAR99

TIN LEAD

8542.32.00.71

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

16

R-GDIP-T16

Not Qualified

5.5 V

MILITARY

4.5 V

ASYNCHRONOUS

0.13 mA

256X4

OPEN-COLLECTOR

5.08 mm

4

1024 bit

PARALLEL

OTP ROM

19.43 mm

7.62 mm

-

-

Min: 1

Mult: 1

NO

32

90 ns

MACRONIX INTERNATIONAL CO LTD

524288 words

512000

70 °C

PLASTIC/EPOXY

DIP

DIP, DIP32,.6

DIP32,.6

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

EAR99

8542.32.00.71

DUAL

THROUGH-HOLE

NOT SPECIFIED

1

2.54 mm

unknown

NOT SPECIFIED

32

R-PDIP-T32

Not Qualified

5.5 V

COMMERCIAL

4.5 V

ASYNCHRONOUS

0.04 mA

512KX8

3-STATE

4.9 mm

8

0.0001 A

4194304 bit

PARALLEL

COMMON

OTP ROM

41.91 mm

15.24 mm

-

-

Min: 1

Mult: 1

YES

48

70 ns

NUMONYX

1

2097152 words

2000000

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

TFBGA, BGA48,6X8,32

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

No

3 V

No

EAR99

NOR TYPE

TOP BOOT BLOCK

8542.32.00.51

BOTTOM

BALL

1

0.8 mm

unknown

48

R-PBGA-B48

Not Qualified

3.6 V

INDUSTRIAL

2.7 V

ASYNCHRONOUS

0.02 mA

2MX16

1.2 mm

16

0.0001 A

33554432 bit

PARALLEL

FLASH

3 V

8

YES

YES

YES

8,63

8K,64K

YES

TOP

YES

8 mm

6 mm

-

-

Min: 1

Mult: 1

YES

8

100 MHz

INTEGRATED SILICON SOLUTION INC

262144 words

256000

105 °C

-40 °C

PLASTIC/EPOXY

SOP

,

SOP8,.25

RECTANGULAR

SMALL OUTLINE

Active

3 V

EAR99

NOR TYPE

8542.32.00.51

DUAL

GULL WING

1

1.27 mm

compliant

R-PDSO-G8

3.6 V

2.7 V

SYNCHRONOUS

0.015 mA

256KX8

3-STATE

1.75 mm

8

0.003 A

2097152 bit

SERIAL

FLASH

SPI

200000 Write/Erase Cycles

20

HARDWARE/SOFTWARE

4.9 mm

3.9 mm

-

-

Min: 1

Mult: 1

YES

64

65 ns

MICRON TECHNOLOGY INC

8388608 words

8000000

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

TBGA,

RECTANGULAR

GRID ARRAY, THIN PROFILE

Obsolete

BGA

Yes

1.8 V

e1

Yes

EAR99

NOR TYPE

TIN SILVER COPPER

TOP BOOT; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8542.32.00.51

BOTTOM

BALL

1

1 mm

compliant

64

R-PBGA-B64

2 V

INDUSTRIAL

1.7 V

ASYNCHRONOUS

8MX16

1.2 mm

16

134217728 bit

PARALLEL

FLASH

1.8 V

TOP

13 mm

10 mm

-

-

Min: 1

Mult: 1

YES

40

80 ns

STMICROELECTRONICS

65536 words

64000

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

10 X 14 MM, PLASTIC, TSOP-40

TSSOP40,.56,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

Obsolete

TSOP

Yes

3.3 V

e0

EAR99

TIN LEAD

8542.32.00.71

DUAL

GULL WING

1

0.5 mm

unknown

40

R-PDSO-G40

Not Qualified

3.6 V

INDUSTRIAL

2.7 V

ASYNCHRONOUS

0.015 mA

64KX16

3-STATE

1.2 mm

16

0.000015 A

1048576 bit

PARALLEL

COMMON

OTP ROM

12.4 mm

10 mm

-

-

Min: 1

Mult: 1

YES

28

45 ns

PHILIPS SEMICONDUCTORS

4096 words

4000

70 °C

PLASTIC/EPOXY

QCCJ

QCCJ, LDCC28,.5SQ

LDCC28,.5SQ

SQUARE

CHIP CARRIER

Transferred

No

5 V

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.71

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J28

Not Qualified

COMMERCIAL

0.175 mA

4KX8

8

32768 bit

OTP ROM

-

-

Min: 1

Mult: 1

NO

24

140 ns

HARRIS SEMICONDUCTOR

2048 words

2000

125 °C

-55 °C

CERAMIC, GLASS-SEALED

,

RECTANGULAR

IN-LINE

Obsolete

5 V

EAR99

8542.32.00.71

DUAL

THROUGH-HOLE

1

unknown

R-GDIP-T24

Not Qualified

5.5 V

MILITARY

4.5 V

ASYNCHRONOUS

2KX8

8

16384 bit

PARALLEL

OTP ROM

-

-

Min: 1

Mult: 1

NO

24

140 ns

HARRIS SEMICONDUCTOR

2048 words

2000

125 °C

-55 °C

CERAMIC, GLASS-SEALED

,

RECTANGULAR

IN-LINE

Obsolete

5 V

EAR99

8542.32.00.71

DUAL

THROUGH-HOLE

1

unknown

R-GDIP-T24

Not Qualified

5.5 V

MILITARY

4.5 V

ASYNCHRONOUS

2KX8

8

16384 bit

PARALLEL

OTP ROM

96
In Stock

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

YES

48

70 ns

SPANSION INC

1048576 words

1000000

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

PLASTIC, FBGA-48

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

No

3 V

e0

EAR99

NOR TYPE

TIN LEAD

8542.32.00.51

BOTTOM

BALL

1

0.8 mm

compliant

48

R-PBGA-B48

Not Qualified

3.6 V

INDUSTRIAL

2.7 V

ASYNCHRONOUS

0.05 mA

1MX16

1.2 mm

16

0.000005 A

16777216 bit

PARALLEL

FLASH

3 V

8

YES

YES

YES

8,31

8K,64K

YES

BOTTOM

YES

8 mm

6 mm

-

-

Min: 1

Mult: 1

YES

48

70 ns

SPANSION INC

3

4194304 words

4000000

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

VFBGA, BGA48,6X8,32

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Transferred

BGA

Yes

3 V

e1

Yes

EAR99

NOR TYPE

TIN SILVER COPPER

8542.32.00.51

BOTTOM

BALL

260

1

0.8 mm

unknown

40

48

R-PBGA-B48

Not Qualified

3.6 V

INDUSTRIAL

2.7 V

ASYNCHRONOUS

0.07 mA

4MX16

1 mm

16

0.000005 A

67108864 bit

PARALLEL

FLASH

3 V

YES

YES

YES

16,126

4K,32K

8 words

YES

BOTTOM/TOP

YES

8.15 mm

6.15 mm

-

-

Min: 1

Mult: 1