The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Reverse Pinout | Length | Width |
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 | Mfr Part No EN25Q64-104BBIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EN25Q64-104BBIP | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No HY27UF081G2M-TPIB | SK Hynix Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SK HYNIX INC | 134217728 words | 128000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | Yes | 3.3 V | e6 | EAR99 | SLC NAND TYPE | TIN BISMUTH | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 128MX8 | 1.2 mm | 8 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | 3.3 V | NO | NO | YES | 1K | 128K | 2K words | YES | 18.4 mm | 12 mm | ||||||||||||||||
| Mfr Part No N82HS641CA | YAGEO Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 25 ns | PHILIPS COMPONENTS | 8192 words | 8000 | 75 °C | PLASTIC/EPOXY | , | SQUARE | CHIP CARRIER | Obsolete | 5 V | EAR99 | 8542.32.00.71 | QUAD | J BEND | 1 | unknown | S-PQCC-J28 | Not Qualified | 5.25 V | COMMERCIAL EXTENDED | 4.75 V | ASYNCHRONOUS | 8KX8 | 3-STATE | 8 | 65536 bit | PARALLEL | OTP ROM | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29AL016D70BF102 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M25P64-VMF6T | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 50 MHz | STMICROELECTRONICS | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | not_compliant | 16 | R-PDSO-G16 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.02 mA | 8MX8 | 2.59 mm | 8 | 0.00005 A | 67108864 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 10.3 mm | 7.49 mm | |||||||||||||||||||
| Mfr Part No M29DW128G60ZA6 | STMicroelectronics | Datasheet | 2616 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M29DW128G60ZA6 | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | MICRON TECHNOLOGY INC | Active | e1 | EAR99 | TIN SILVER COPPER | 8542.32.00.51 | 260 | compliant | 30 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M25P80-VMW3TG | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 40 MHz | NUMONYX | 1048576 words | 1000000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.200 INCH, ROHS COMPLIANT, PLASTIC, SO-8 | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | AUTOMOTIVE | 2.7 V | SYNCHRONOUS | 0.015 mA | 1MX8 | 2.03 mm | 8 | 0.0001 A | 8388608 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 15 ms | 20 | HARDWARE/SOFTWARE | NO | 5.3 mm | 5.25 mm | ||||||||||||||||||
| Mfr Part No TC58NYG0S3ETAI0 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | TOSHIBA CORP | 134217728 words | 128000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | TSOP | 1.8 V | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | 1.95 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 128MX8 | 1.2 mm | 8 | 1073741824 bit | SERIAL | FLASH | 1.8 V | 18.4 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No MX25L51245GMQ-08G | MXIC(Macronix) | Datasheet | 15 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FT24C32A-ELR-T | FMD(Fremont Micro Devices) | Datasheet | - | - | Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M378A2G43AB3-CWE | Samsung | Datasheet | 10 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M378A1K43DB2-CTD | Samsung | Datasheet | 15 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K4ABG165WA-MCWE | Samsung | Datasheet | 80 |
| Min: 1 Mult: 1 | Tray | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX25L25645GMI-08G(T) | MXIC(Macronix) | Datasheet | 15 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No K9F5616Q0B-DIB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA63,10X12,32 | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 1.8 V | EAR99 | CONTAINS ADDITIONAL 512K X 16 BIT NAND FLASH | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 63 | R-PBGA-B63 | Not Qualified | 1.95 V | INDUSTRIAL | 1.65 V | ASYNCHRONOUS | 0.015 mA | 16MX16 | 1 mm | 16 | 0.00005 A | 268435456 bit | PARALLEL | FLASH | 1.8 V | NO | NO | YES | 2K | 8K | 256 words | YES | 11 mm | 9 mm | |||||||||||||||||||
 | Mfr Part No PC48F4400P0VT00 | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 88 ns | NUMONYX | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LEAD FREE, BGA-64 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | 1.8 V | EAR99 | NOR TYPE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | unknown | NOT SPECIFIED | 64 | R-PBGA-B64 | Not Qualified | 2 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 32MX16 | 1.3 mm | 16 | 536870912 bit | PARALLEL | FLASH | 1.8 V | TOP | 13 mm | 10 mm | |||||||||||||||||||||||||
 | Mfr Part No MX29F002BQC-12 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | MACRONIX INTERNATIONAL CO LTD | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 256KX8 | 3.55 mm | 8 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | BOTTOM | 14.05 mm | 11.43 mm | |||||||||||||||||
 | Mfr Part No MX27C2048QC-15 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 150 ns | MACRONIX INTERNATIONAL CO LTD | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC44,.7SQ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LPCC | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 44 | S-PQCC-J44 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX16 | 3-STATE | 4.57 mm | 16 | 0.0001 A | 2097152 bit | PARALLEL | COMMON | OTP ROM | 16.5862 mm | 16.5862 mm |
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EN25Q64-104BBIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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EN25Q64-104BBIP
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
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HY27UF081G2M-TPIB
SK Hynix Inc
Package:Memory - Modules
Price: please inquire
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N82HS641CA
YAGEO Corporation
Package:Memory - Modules
Price: please inquire
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S29AL016D70BF102
Spansion
Package:Memory - Modules
Price: please inquire
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M25P64-VMF6T
STMicroelectronics
Package:Memory - Modules
Price: please inquire
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M29DW128G60ZA6
STMicroelectronics
Package:Memory - Modules
Price: please inquire
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M29DW128G60ZA6
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
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M25P80-VMW3TG
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
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TC58NYG0S3ETAI0
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
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MX25L51245GMQ-08G
MXIC(Macronix)
Package:Memory - Modules
6.783433
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FT24C32A-ELR-T
FMD(Fremont Micro Devices)
Package:Memory - Modules
Price: please inquire
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M378A2G43AB3-CWE
Samsung
Package:Memory - Modules
5.047803
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M378A1K43DB2-CTD
Samsung
Package:Memory - Modules
8.353049
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K4ABG165WA-MCWE
Samsung
Package:Memory - Modules
26.256025
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MX25L25645GMI-08G(T)
MXIC(Macronix)
Package:Memory - Modules
6.457493
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K9F5616Q0B-DIB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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PC48F4400P0VT00
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
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MX29F002BQC-12
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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MX27C2048QC-15
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire