The category is 'Memory - Modules'
Memory - Modules (5402)
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- Reach Compliance Code
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- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Dimensions | I/O | Ihs Manufacturer | Interface Type | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Endurance | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Temperature | Length | Width |
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![]() | Mfr Part No MX29LV160BMC-90 | Macronix International Co Ltd | Datasheet | 134 | - | Min: 1 Mult: 1 | YES | 44 | 90 ns | MACRONIX INTERNATIONAL CO LTD | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP44,.63 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 100000 MINIMUM ERASE/PROGRAM CYCLES | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 1MX16 | 3 mm | 16 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,31 | 16K,8K,32K,64K | BOTTOM | 28.5 mm | 12.6 mm | |||||||||||||||||||||
![]() | Mfr Part No S29JL032H70TAI220 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3 V | e0 | No | 3A991.B.1.A | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.045 mA | 2MX16 | 1.2 mm | 16 | 0.00001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | BOTTOM | YES | 18.4 mm | 12 mm | ||||||||||||||||
![]() | Mfr Part No S29JL032H70TAI220 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142DDD, TSOP-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No S29GL064M10TFIR40 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP56,.8,20 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | BOTTOM | YES | |||||||||||||||||||||||||||||||
![]() | Mfr Part No MT28F800B3WG-8B | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 80 ns | MICRON TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, PLASTIC, TSOP1-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.015 mA | 512KX16 | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | NO | NO | YES | 1,2,1,7 | 16K,8K,96K,128K | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||||||||
![]() | Mfr Part No S25FL164K0XMFI013Z | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PC28F640J3C120 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29GL128N10TAI02 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 8MX16 | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | BOTTOM/TOP | YES | ||||||||||||||||||||||||||||||
![]() | Mfr Part No S29PL032J70BAI12 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 8.15 X 6.15 MM, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 2MX16 | 1 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,62 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | |||||||||||||||||||
![]() | Mfr Part No S29PL032J70BAI12 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 8.15 X 6.15 MM, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | BGA | No | 3 V | e0 | No | 3A991.B.1.A | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | not_compliant | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 2MX16 | 1 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,62 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | ||||||||||||||||
![]() | Mfr Part No MTFC4GLWDM-4M AAT | Micron Technology Inc | Datasheet | 1260 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M58BW016BB80T3F | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | 80 ns | NUMONYX | 524288 words | 512000 | 125 °C | -40 °C | PLASTIC/EPOXY | QFP | PLASTIC, QFP-80 | RECTANGULAR | FLATPACK | Obsolete | QFP | 3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn85Pb15) | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | 8542.32.00.51 | QUAD | GULL WING | 1 | 0.8 mm | unknown | 80 | R-PQFP-G80 | Not Qualified | 3.6 V | AUTOMOTIVE | 2.7 V | ASYNCHRONOUS | 512KX32 | 3.4 mm | 32 | 16777216 bit | PARALLEL | FLASH | 3 V | BOTTOM | 20 mm | 14 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No M58BW016BB80T3F | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | 80 ns | STMICROELECTRONICS | 524288 words | 512000 | 125 °C | -40 °C | PLASTIC/EPOXY | QFP | PLASTIC, QFP-80 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Transferred | QFP | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | 8542.32.00.51 | QUAD | GULL WING | 1 | 0.8 mm | not_compliant | 80 | R-PQFP-G80 | Not Qualified | 3.6 V | AUTOMOTIVE | 2.7 V | ASYNCHRONOUS | 0.03 mA | 512KX32 | 3.4 mm | 32 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 3 V | NO | NO | YES | 8,31 | 2K,16K | BOTTOM | YES | 20 mm | 14 mm | ||||||||||||||||||||
![]() | Mfr Part No CY7C291-50DMB | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 50 ns | CYPRESS SEMICONDUCTOR CORP | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | 0.300 INCH, SLIM, CERDIP-24 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 24 | R-GDIP-T24 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.12 mA | 2KX8 | 3-STATE | 8 | 0.12 A | 16384 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | OTP ROM | 13.5 V | ||||||||||||||||||||||||||||
![]() | Mfr Part No S29NS128P0PBJW000 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 80 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | 6.20 X 7.70 MM , LEAD FREE, TFBGA-64 | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | Yes | EAR99 | NOR TYPE | TIN SILVER COPPER | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 64 | R-PBGA-B64 | Not Qualified | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 0.08 mA | 8MX16 | 1 mm | 16 | 0.00007 A | 134217728 bit | PARALLEL | FLASH | 1.8 V | YES | YES | YES | 4,127 | 16K,64K | YES | TOP | YES | 7.7 mm | 6.2 mm | ||||||||||||||||
![]() | Mfr Part No W631GU6NB09I | Winbond | Datasheet | - | - | Min: 1 Mult: 1 | 7.5X13mm2 | 16BIT | DDR3 SDRAM | VFBGA - 96 | 933 / 1066MHz | 1.283 ~ 1.45V | 1Gb | -40 ~ 95˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W632GU6QB11I | Winbond | Datasheet | 30 |
| Min: 1 Mult: 1 | 7.5X13mm2 | 16BIT | DDR3 SDRAM | 1866 / 2133 MbpsMHz | 1.283 ~ 1.45V | 2Gb | -40 ~ 95˚C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W632GU6QB12I | Winbond | Datasheet | 31 |
| Min: 1 Mult: 1 | 7.5X13mm2 | 16BIT | DDR3 SDRAM | 1866 / 2133 MbpsMHz | 1.283 ~ 1.45V | 2Gb | -40 ~ 95˚C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W634GU8RB09I | Winbond | Datasheet | 16 |
| Min: 1 Mult: 1 | 8X10.5mm2 | 8BIT | DDR3 SDRAM | 1866 / 2133 MbpsMHz | 1.283 ~ 1.45V | 4Gb | -40 ~ 95˚C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W634GU8RB11I | Winbond | Datasheet | 31 |
| Min: 1 Mult: 1 | 8X10.5mm2 | 8BIT | DDR3 SDRAM | 1866 / 2133 MbpsMHz | 1.283 ~ 1.45V | 4Gb | -40 ~ 95˚C |
MX29LV160BMC-90
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
S29JL032H70TAI220
Spansion
Package:Memory - Modules
Price: please inquire
S29JL032H70TAI220
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
S29GL064M10TFIR40
AMD
Package:Memory - Modules
Price: please inquire
MT28F800B3WG-8B
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
S25FL164K0XMFI013Z
Spansion
Package:Memory - Modules
Price: please inquire
PC28F640J3C120
Intel Corporation
Package:Memory - Modules
Price: please inquire
S29GL128N10TAI02
AMD
Package:Memory - Modules
Price: please inquire
S29PL032J70BAI12
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
S29PL032J70BAI12
Spansion
Package:Memory - Modules
Price: please inquire
MTFC4GLWDM-4M AAT
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
M58BW016BB80T3F
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
M58BW016BB80T3F
STMicroelectronics
Package:Memory - Modules
Price: please inquire
CY7C291-50DMB
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
S29NS128P0PBJW000
Spansion
Package:Memory - Modules
Price: please inquire
W631GU6NB09I
Winbond
Package:Memory - Modules
Price: please inquire
W632GU6QB11I
Winbond
Package:Memory - Modules
4.660862
W632GU6QB12I
Winbond
Package:Memory - Modules
4.582633
W634GU8RB09I
Winbond
Package:Memory - Modules
4.482962
W634GU8RB11I
Winbond
Package:Memory - Modules
4.964345
