The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
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- Memory IC Type
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- Memory Density
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Reverse Pinout | Length | Width |
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 | Mfr Part No S29AL004D90BAI020 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SPANSION INC | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 8.15 X 6.15 MM, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | not_compliant | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 256KX16 | 1 mm | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 3 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | 8.15 mm | 6.15 mm | ||||||||||||
 | Mfr Part No SDSDQ-1024 | Western Digital Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 50 MHz | WESTERN DIGITAL CORP | 1073741824 words | 1000000000 | 85 °C | -25 °C | UNSPECIFIED | DIE | CARD-8 | RECTANGULAR | UNCASED CHIP | Active | EAR99 | NAND TYPE | 8542.32.00.51 | UPPER | NO LEAD | 1 | 1.1 mm | unknown | R-XUUC-N8 | 3.6 V | OTHER | 2.7 V | SYNCHRONOUS | 1GX8 | 0.95 mm | 8 | 8589934592 bit | SERIAL | FLASH CARD | 2.7 V | SOFTWARE | NO | YES | NO | NO | 15 mm | 11 mm | ||||||||||||||||||||||||||||||
| Mfr Part No MX25U6473FMBI-10G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | MACRONIX INTERNATIONAL CO LTD | , | Obsolete | EAR99 | 8542.32.00.51 | unknown | FLASH | 1.8 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX25L802MC-50 | Macronix International Co Ltd | Datasheet | 97 | - | Min: 1 Mult: 1 | YES | 28 | 20 MHz | MACRONIX INTERNATIONAL CO LTD | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.45 | SOP28,.45 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 28 | R-PDSO-G28 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | SYNCHRONOUS | 0.03 mA | 1MX8 | 2.84 mm | 8 | 0.00006 A | 8388608 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 15 ms | 18.11 mm | 8.4 mm | |||||||||||||||||||||||
 | Mfr Part No DM87S181N | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 55 ns | NATIONAL SEMICONDUCTOR CORP | 1024 words | 1000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 24 | R-PDIP-T24 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.17 mA | 1KX8 | 3-STATE | 5.334 mm | 8 | 8192 bit | PARALLEL | OTP ROM | 31.915 mm | 15.24 mm | |||||||||||||||||||||||||||
| Mfr Part No HM1-7611-2 | Harris Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 75 ns | HARRIS SEMICONDUCTOR | 256 words | 256 | 125 °C | -55 °C | CERAMIC | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T16 | Not Qualified | MILITARY | 0.13 mA | 256X4 | 4 | 1024 bit | OTP ROM | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No HM1-7611-2 | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 85 ns | INTERSIL CORP | 256 words | 4000 | 125 °C | -55 °C | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | R-XDIP-T16 | Not Qualified | MILITARY | ASYNCHRONOUS | 0.13 mA | 4KX8 | 8 | 32768 bit | PARALLEL | OTP ROM | ||||||||||||||||||||||||||||||||||||
| Mfr Part No EN25S20A-104XIP | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | USON-8 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Contact Manufacturer | Yes | 1.8 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | R-PDSO-N8 | 1.95 V | INDUSTRIAL | 1.65 V | SYNCHRONOUS | 256KX8 | 0.6 mm | 8 | 2097152 bit | SERIAL | FLASH | 1.8 V | 3 mm | 2 mm | |||||||||||||||||||||||||||||||
| Mfr Part No EN25S20A-104XIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | EON SILICON SOLUTION INC | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, HALOGEN FREE, ROHS AND REACH COMPLIANT, USON-8 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | 1.8 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | 1 | 0.5 mm | unknown | R-PDSO-N8 | 1.95 V | INDUSTRIAL | 1.65 V | SYNCHRONOUS | 256KX8 | 0.6 mm | 8 | 2097152 bit | SERIAL | FLASH | 1.8 V | 3 mm | 2 mm | ||||||||||||||||||||||||||||||||||
 | Mfr Part No PC28F640J3C115 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 115 ns | INTEL CORP | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | LEAD FREE, BGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | Yes | 3 V | e1 | NOR TYPE | TIN SILVER COPPER | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 15 | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.08 mA | 4MX16 | 1.2 mm | 0.00012 A | 67108864 bit | PARALLEL | FLASH | 2.7 V | 8 | NO | NO | YES | 64 | 128K | 4/8 words | YES | YES | 13 mm | 10 mm | |||||||||||||||
| Mfr Part No FN-TRAN-QSFP28-LR-C | ATGBICS | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX29GA257EHXCI-90Q | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | MACRONIX INTERNATIONAL CO LTD | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | 13 X 10 MM, 1.20 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, MO-216, FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Active | BGA | Yes | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | unknown | NOT SPECIFIED | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.1 mA | 16MX16 | 1.2 mm | 16 | 0.0001 A | 268435456 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 256 | 128K | 8/16 words | YES | YES | 13 mm | 10 mm | ||||||||||||||||
| Mfr Part No IS29GL128-70FLEH | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 70 ns | INTEGRATED SILICON SOLUTION INC | 134217728 words | 128000000 | 105 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | Yes | 3 V | e3 | EAR99 | TIN | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B64 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 128MX1 | 1.4 mm | 1 | 134217728 bit | PARALLEL | FLASH | 3 V | 13 mm | 11 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No ES29LV800DT-70TC | Excel (Suzhou) Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | EXCEL SEMICONDUCTOR INC | 3 | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 240 | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.03 mA | 512KX16 | 16 | 0.00001 A | 8388608 bit | PARALLEL | FLASH | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | ||||||||||||||||||||||||||
| Mfr Part No 82S185A/BVA | YAGEO Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | 55 ns | PHILIPS COMPONENTS | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | , | RECTANGULAR | IN-LINE | Obsolete | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | R-CDIP-T18 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 2KX4 | 3-STATE | 4 | 8192 bit | PARALLEL | OTP ROM | |||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 82S185A/BVA | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | 55 ns | NXP SEMICONDUCTORS | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-GDIP-T18 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 2KX4 | 3-STATE | 5.08 mm | 4 | 8192 bit | PARALLEL | OTP ROM | 7.62 mm | |||||||||||||||||||||||||||||||||
 | Mfr Part No MX27L256QC-20 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 200 ns | MACRONIX INTERNATIONAL CO LTD | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 3 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.01 mA | 32KX8 | 3-STATE | 3.55 mm | 8 | 0.00001 A | 262144 bit | PARALLEL | COMMON | OTP ROM | 12.75 V | 14.05 mm | 11.43 mm | |||||||||||||||||||||||||
| Mfr Part No MZ-V9P2T0GW | Samsung Electronics Co. Ltd | Datasheet | 2292 |
| Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX29LA641DLXCI-90G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | MACRONIX INTERNATIONAL CO LTD | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA64,8X8,40 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | unknown | NOT SPECIFIED | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 4MX16 | 1.2 mm | 16 | 0.000015 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 64K | YES | YES | 13 mm | 10 mm | |||||||||||||||||
 | Mfr Part No AM29LV002B-150EC | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 150 ns | SPANSION INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP-40 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | 3 V | EAR99 | NOR TYPE | BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 40 | R-PDSO-G40 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 256KX8 | 1.2 mm | 8 | 2097152 bit | PARALLEL | FLASH | 3 V | BOTTOM | 18.4 mm | 10 mm |
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S29AL004D90BAI020
Spansion
Package:Memory - Modules
Price: please inquire
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SDSDQ-1024
Western Digital Corp
Package:Memory - Modules
Price: please inquire
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MX25U6473FMBI-10G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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MX25L802MC-50
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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DM87S181N
Texas Instruments
Package:Memory - Modules
Price: please inquire
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HM1-7611-2
Harris Semiconductor
Package:Memory - Modules
Price: please inquire
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HM1-7611-2
Intersil Corporation
Package:Memory - Modules
Price: please inquire
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EN25S20A-104XIP
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
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EN25S20A-104XIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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PC28F640J3C115
Intel Corporation
Package:Memory - Modules
Price: please inquire
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FN-TRAN-QSFP28-LR-C
ATGBICS
Package:Memory - Modules
Price: please inquire
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MX29GA257EHXCI-90Q
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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IS29GL128-70FLEH
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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ES29LV800DT-70TC
Excel (Suzhou) Semiconductor Co Ltd
Package:Memory - Modules
Price: please inquire
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82S185A/BVA
YAGEO Corporation
Package:Memory - Modules
Price: please inquire
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82S185A/BVA
NXP Semiconductors
Package:Memory - Modules
Price: please inquire
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MX27L256QC-20
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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MZ-V9P2T0GW
Samsung Electronics Co. Ltd
Package:Memory - Modules
307.327556
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MX29LA641DLXCI-90G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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AM29LV002B-150EC
Spansion
Package:Memory - Modules
Price: please inquire