The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Reverse Pinout | Length | Width |
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 | Mfr Part No XC17256L-SO8I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 170 ns | 10 MHz | XILINX INC | 3 | 262144 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | GULL WING | 225 | 1 | 1.27 mm | not_compliant | 30 | R-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.01 mA | 32KX8 | 3-STATE | 8 | 0.00005 A | 262144 bit | PARALLEL | COMMON | OTP ROM | ||||||||||||||||||||||||||||
 | Mfr Part No X76F102M8 | IC Microsystems Sdn Bhd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 1 MHz | IC MICROSYSTEMS SDN BHD | 128 words | 128 | 70 °C | PLASTIC/EPOXY | TSSOP | MSOP-8 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Contact Manufacturer | MSOP | No | 5 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.65 mm | unknown | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | SYNCHRONOUS | 128X8 | 1.1 mm | 8 | 1024 bit | SERIAL | FLASH | 5 V | 10 ms | 3 mm | 3 mm | ||||||||||||||||||||||||||||
| Mfr Part No X76F102M8 | Xicor Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 1 MHz | XICOR INC | 128 words | 128 | 70 °C | PLASTIC/EPOXY | TSSOP | MSOP-8 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 5 V | e0 | NOR TYPE | TIN LEAD | DATA RETENTION = 100 YEARS | DUAL | GULL WING | 1 | 0.65 mm | unknown | S-PDSO-G8 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | SYNCHRONOUS | 0.003 mA | 128X8 | 1.1 mm | 8 | 0.000001 A | 1024 bit | SERIAL | FLASH | 5 V | 100000 Write/Erase Cycles | 10 ms | 100 | SOFTWARE | 3 mm | 3 mm | ||||||||||||||||||||||||||
 | Mfr Part No CY7C245-45LMB | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 70 ns | CYPRESS SEMICONDUCTOR CORP | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | CERAMIC, LCC-28 | LCC28,.45SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | NO LEAD | 1 | 1.27 mm | not_compliant | 28 | S-CQCC-N28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | 0.12 mA | 2KX8 | 3-STATE | 8 | 0.12 A | 16384 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | OTP ROM | 13.5 V | ||||||||||||||||||||||||||
| Mfr Part No MX30UF4GE8AB-XKI | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | MACRONIX INTERNATIONAL CO LTD | 536870912 words | 512000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | Yes | 1.8 V | EAR99 | SLC NAND TYPE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | R-PBGA-B63 | 1.95 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 512MX8 | 1 mm | 8 | 4294967296 bit | PARALLEL | FLASH | 1.8 V | 11 mm | 9 mm | |||||||||||||||||||||||||||||||||
 | Mfr Part No P28F010-200 | Intel Corporation | Datasheet | 334 | - | Min: 1 Mult: 1 | NO | 32 | 200 ns | INTEL CORP | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 32 | R-PDIP-T32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 128KX8 | 3-STATE | 4.83 mm | 8 | 0.0001 A | 1048576 bit | PARALLEL | FLASH | 12 V | 10000 Write/Erase Cycles | NO | NO | YES | 41.91 mm | 15.24 mm | |||||||||||||||||||||
 | Mfr Part No K9F1G16Q0M-YCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 1.8 V | e0 | No | EAR99 | SLC NAND TYPE | TIN LEAD | CONTAINS ADDITIONAL 32M BIT NAND FLASH | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | 1.95 V | COMMERCIAL | 1.65 V | ASYNCHRONOUS | 0.015 mA | 64MX16 | 1.2 mm | 16 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | 1.8 V | NO | NO | YES | 1K | 64K | 1K words | YES | 18.4 mm | 12 mm | ||||||||||||||||||
| Mfr Part No TBP38S030-25N | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 25 ns | TEXAS INSTRUMENTS INC | 32 words | 32 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 2.54 mm | not_compliant | NOT SPECIFIED | R-PDIP-T16 | Not Qualified | COMMERCIAL | 0.125 mA | 32X8 | 8 | OTP ROM | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No PA28F008S3-150 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 150 ns | INTEL CORP | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | 13.30 X 28.20 MM, PLASTIC, SOP-44 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | USER-SELECTABLE 3.3V OR 12V VPP | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.04 mA | 1MX8 | 2.95 mm | 8 | 0.00001 A | 8388608 bit | PARALLEL | FLASH | 2.7 V | NO | NO | YES | 16 | 64K | YES | 28.2 mm | 13.3 mm | ||||||||||||||||||||
| Mfr Part No S29GL128M10TFIR10 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142EC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | Yes | 3.3 V | e3 | Yes | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 40 | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 8MX16 | 1.2 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 256 | 64K | 4/8 words | YES | YES | 18.4 mm | 14 mm | |||||||||||||
| Mfr Part No S29GL128M10TFIR10 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 8MX16 | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 256 | 64K | 4/8 words | YES | YES | |||||||||||||||||||||||||||||||
 | Mfr Part No AT27LV512R-25RC | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 250 ns | ATMEL CORP | 2 | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.5 | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | GULL WING | 225 | 1 | 1.27 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | 5.5 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.02 mA | 64KX8 | 3-STATE | 2.79 mm | 8 | 0.00002 A | 524288 bit | PARALLEL | COMMON | OTP ROM | 18.25 mm | 8.74 mm | ||||||||||||||||||||||||
| Mfr Part No W25P16VSSI | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 25 MHz | WINBOND ELECTRONICS CORP | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.3 | SOP8,.3 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | not_compliant | 8 | S-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.032 mA | 2MX8 | 3-STATE | 2.16 mm | 8 | 0.000005 A | 16777216 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 5.27 mm | 5.27 mm | |||||||||||||||||||||
| Mfr Part No MBM29F800TA-90PFTR | FUJITSU Limited | Datasheet | 2592 | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | FUJITSU LTD | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1-R | PLASTIC, REVERSE, TSOP1-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP1 | No | 5 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | MINIMUM 100K WRITE/ERASE CYCLES | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 512KX16 | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | YES | 18.4 mm | 12 mm | |||||||||||||||
| Mfr Part No EN25Q40A-104XIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | EON SILICON SOLUTION INC | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, HALOGEN FREE, ROHS AND REACH COMPLIANT, USON-8 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | 1 | 0.5 mm | unknown | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 512KX8 | 0.6 mm | 8 | 4194304 bit | SERIAL | FLASH | 2.7 V | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No EN25Q40A-104XIP | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | USON-8 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Contact Manufacturer | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | 1 | 0.5 mm | unknown | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 512KX8 | 0.6 mm | 8 | 4194304 bit | SERIAL | FLASH | 2.7 V | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No AM29F400BT-45SC | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 45 ns | ADVANCED MICRO DEVICES INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP44,.63 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | No | 5 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | MINIMUM 1000K PROGRAM/ERASE CYCLE ;20 YEAR DATA RETENTION | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.06 mA | 256KX16 | 2.8 mm | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | 20 | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | TOP | 28.2 mm | 13.3 mm | ||||||||||||||||
| Mfr Part No AM29F400BT-45SC | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 45 ns | SPANSION INC | 3 | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | SOP | MO-180AA, SOP-44 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.06 mA | 256KX16 | 2.8 mm | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | TOP | 28.2 mm | 13.3 mm | ||||||||||||||
 | Mfr Part No SST36VF1602C-70-4I-B3K | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 6 X 8 MM, MO-210AB-1, TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 240 | 1 | 0.8 mm | unknown | 10 | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.04 mA | 1MX16 | 1.2 mm | 16 | 0.00002 A | 16777216 bit | PARALLEL | FLASH | 2.7 V | 8 | YES | YES | 4,1,31 | 4K,48K,64K | YES | TOP | YES | 8 mm | 6 mm | ||||||||||||||||||
| Mfr Part No TS8GCF100I | Transcend Information Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 50 | 300 ns | TRANSCEND INFORMATION INC | 536870912 words | 512000000 | 85 °C | -40 °C | UNSPECIFIED | ROHS COMPLIANT, PC CARD-50 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | DMA | Yes | 3.3 V | Yes | EAR99 | NOR TYPE | ALSO OPERATES AT TYP 5 V | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | unknown | NOT SPECIFIED | 50 | R-XDMA-N50 | 3.465 V | INDUSTRIAL | 3.135 V | SYNCHRONOUS | 512MX16 | 4.1 mm | 16 | 8589934592 bit | PARALLEL | FLASH CARD | 3.3 V | 42.8 mm | 36.4 mm |
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XC17256L-SO8I
AMD Xilinx
Package:Memory - Modules
Price: please inquire
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X76F102M8
IC Microsystems Sdn Bhd
Package:Memory - Modules
Price: please inquire
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X76F102M8
Xicor Inc
Package:Memory - Modules
Price: please inquire
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CY7C245-45LMB
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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MX30UF4GE8AB-XKI
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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P28F010-200
Intel Corporation
Package:Memory - Modules
Price: please inquire
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K9F1G16Q0M-YCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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TBP38S030-25N
Texas Instruments
Package:Memory - Modules
Price: please inquire
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PA28F008S3-150
Intel Corporation
Package:Memory - Modules
Price: please inquire
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S29GL128M10TFIR10
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL128M10TFIR10
AMD
Package:Memory - Modules
Price: please inquire
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AT27LV512R-25RC
Atmel Corporation
Package:Memory - Modules
Price: please inquire
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W25P16VSSI
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
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MBM29F800TA-90PFTR
FUJITSU Limited
Package:Memory - Modules
Price: please inquire
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EN25Q40A-104XIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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EN25Q40A-104XIP
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
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AM29F400BT-45SC
AMD
Package:Memory - Modules
Price: please inquire
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AM29F400BT-45SC
Spansion
Package:Memory - Modules
Price: please inquire
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SST36VF1602C-70-4I-B3K
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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TS8GCF100I
Transcend Information Inc
Package:Memory - Modules
Price: please inquire