The category is 'Memory - Modules'
Memory - Modules (5402)
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- Reach Compliance Code
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Dimensions | Factory Pack Quantity | Ihs Manufacturer | Interface Type | Maximum Data Rate | Maximum Operating Temperature | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Sustained Read | Sustained Write | Version | Packaging | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Applications | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Endurance | Write Cycle Time-Max (tWC) | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Product | Length | Width |
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![]() | Mfr Part No AM27LV010B-200JC | AMD | Datasheet | 736 | - | Min: 1 Mult: 1 | YES | 32 | 200 ns | ADVANCED MICRO DEVICES INC | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 3.3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.015 mA | 128KX8 | 3-STATE | 3.556 mm | 8 | 0.000025 A | 1048576 bit | PARALLEL | COMMON | OTP ROM | 13.97 mm | 11.43 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS27TH064G21-JCLA2 | ISSI | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-153 | 13 mm x 11.5 mm x 1 mm | 152 | UFS 2.1 | 1 GB/s | + 105 C | - 40 C | SMD/SMT | RoHS Compliant | 3.6 V | 2.7 V | 690 MB/s | 65 MB/s | Gen3 | Reel | Automotive | 3.3 V | 64 GB | Universal Flash Storage - UFS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS27TH128G21-JCLI | ISSI | Datasheet | 124 |
| Min: 1 Mult: 1 | FBGA-153 | 13 mm x 11.5 mm x 1 mm | 152 | UFS 2.1 | 1 GB/s | + 85 C | - 40 C | SMD/SMT | RoHS Compliant | 3.6 V | 2.7 V | 1020 MB/s | 130 MB/s | Gen3 | Industrial | 3.3 V | 128 GB | Universal Flash Storage - UFS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29AL016D90DGI027 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 45 | 90 ns | SPANSION INC | 1048576 words | 1000000 | 85 °C | -40 °C | UNSPECIFIED | DIE | DIE-45 | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | Obsolete | DIE | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | UPPER | NO LEAD | 1 | unknown | 45 | R-XUUC-N45 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 1MX16 | 16 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29NS016J0LBFW003 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 70 ns | SPANSION INC | 3 | 1048576 words | 1000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | 7.70 X 6.20 MM, LEAD FREE, FBGA-44 | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 44 | R-PBGA-B44 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 0.06 mA | 1MX16 | 1 mm | 16 | 0.00004 A | 16777216 bit | PARALLEL | FLASH | 1.8 V | 80 ms | YES | YES | YES | 4,31 | 8K,32K | YES | TOP | YES | 7.7 mm | 6.2 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No AM29F400BB-45ED | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 45 ns | ADVANCED MICRO DEVICES INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 5 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.06 mA | 256KX16 | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No FM27C040VE150 | Fairchild Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 150 ns | FAIRCHILD SEMICONDUCTOR CORP | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 512KX8 | 3-STATE | 3.56 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | 13.995 mm | 11.455 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SST37VF040-70-3C-WH | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | 8 X 14 MM, MO-142BA, TSOP1-32 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 512KX8 | 1.2 mm | 8 | 0.000015 A | 4194304 bit | PARALLEL | FLASH | 2.7 V | NO | NO | NO | 12.4 mm | 8 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No UPB429C | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 70 ns | RENESAS ELECTRONICS CORP | 2048 words | 2000 | 70 °C | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | 2KX8 | 8 | 16384 bit | OTP ROM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K9F1216Q0A-DCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 1.8 V | EAR99 | CONTAINS ADDITIONAL 16M BIT NAND FLASH | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 63 | R-PBGA-B63 | Not Qualified | 1.95 V | COMMERCIAL | 1.65 V | ASYNCHRONOUS | 32MX16 | 1 mm | 16 | 536870912 bit | PARALLEL | FLASH | 1.8 V | 11 mm | 9 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SST39VF400A | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT49LV2048-12TC | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 120 ns | ATMEL CORP | 3 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSOP1 | PLASTIC, MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | HARDWARE DATA PROTECTION; 10000 WRITE CYCLES | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.05 mA | 128KX16 | 1.2 mm | 16 | 0.00005 A | 2097152 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 3,1 | 8K,104K | BOTTOM | 18.4 mm | 12 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC1765L-DD8M | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 2.5 MHz | XILINX INC | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | Transferred | No | 3.3 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T8 | Not Qualified | MILITARY | 0.005 mA | 64KX1 | 3-STATE | 1 | 0.0015 A | 65536 bit | COMMON | CONFIGURATION MEMORY | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC1765L-DD8M | AMD | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 200 ns | 2.5 MHz | ADVANCED MICRO DEVICES INC | 65536 words | 256000 | 125 °C | -55 °C | CERAMIC | DIP | DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Active | No | 5 V | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | R-XDIP-T8 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.01 mA | 256KX16 | 3-STATE | 16 | 0.0015 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No F59L2G81A-25BG | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | 268435456 words | 256000000 | 70 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | 3.3 V | EAR99 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | R-PBGA-B63 | 3.6 V | COMMERCIAL | 2.7 V | SYNCHRONOUS | 256MX8 | 1 mm | 8 | 2147483648 bit | PARALLEL | FLASH | 3.3 V | 11 mm | 9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EN25B80-75QCP | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | , | Obsolete | EAR99 | 8542.32.00.51 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S99-50182 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CY7C292-35DC | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 35 ns | CYPRESS SEMICONDUCTOR CORP | 2048 words | 2000 | 70 °C | CERAMIC, GLASS-SEALED | DIP | 0.300 INCH, SLIM, CERDIP-24 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 24 | R-GDIP-T24 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.09 mA | 2KX8 | 3-STATE | 8 | 0.09 A | 16384 bit | PARALLEL | COMMON | OTP ROM | 13.5 V | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT29BV040A-20TC | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 200 ns | ATMEL CORP | 3 | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSSOP | 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.5 mm | compliant | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.015 mA | 512KX8 | 1.2 mm | 8 | 0.00004 A | 4194304 bit | PARALLEL | FLASH | 2.7 V | 10000 Write/Erase Cycles | 20 ms | YES | YES | NO | 2K | 256 | 256 words | BOTTOM/TOP | 18.4 mm | 8 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No MX25L3233FM1I-08Q/TRAY | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 |
AM27LV010B-200JC
AMD
Package:Memory - Modules
Price: please inquire
IS27TH064G21-JCLA2
ISSI
Package:Memory - Modules
Price: please inquire
IS27TH128G21-JCLI
ISSI
Package:Memory - Modules
64.004835
S29AL016D90DGI027
Spansion
Package:Memory - Modules
Price: please inquire
S29NS016J0LBFW003
Spansion
Package:Memory - Modules
Price: please inquire
AM29F400BB-45ED
AMD
Package:Memory - Modules
Price: please inquire
FM27C040VE150
Fairchild Semiconductor Corporation
Package:Memory - Modules
Price: please inquire
SST37VF040-70-3C-WH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
UPB429C
Renesas Electronics Corporation
Package:Memory - Modules
Price: please inquire
K9F1216Q0A-DCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
SST39VF400A
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
AT49LV2048-12TC
Atmel Corporation
Package:Memory - Modules
Price: please inquire
XC1765L-DD8M
AMD Xilinx
Package:Memory - Modules
Price: please inquire
XC1765L-DD8M
AMD
Package:Memory - Modules
Price: please inquire
F59L2G81A-25BG
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
EN25B80-75QCP
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
S99-50182
Spansion
Package:Memory - Modules
Price: please inquire
CY7C292-35DC
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
AT29BV040A-20TC
Atmel Corporation
Package:Memory - Modules
Price: please inquire
MX25L3233FM1I-08Q/TRAY
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
