The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
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- Memory IC Type
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- Memory Density
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No S29PL032J55BFI12 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 55 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 8.15 X 6.15 MM, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | Yes | 3 V | e1 | EAR99 | NOR TYPE | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 40 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 2MX16 | 1 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,62 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | ||||||||||||||
| Mfr Part No PM49FL004T-33VC | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | INTEGRATED SILICON SOLUTION INC | 524288 words | 512000 | 85 °C | PLASTIC/EPOXY | TSSOP | 8 X 14 MM, VSOP-32 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 3.3 V | EAR99 | NOR TYPE | TOP BOOT | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | R-PDSO-G32 | Not Qualified | 3.6 V | OTHER | 3 V | SYNCHRONOUS | 0.02 mA | 512KX8 | 1.2 mm | 8 | 0.0005 A | 4194304 bit | PARALLEL | FLASH | 3.3 V | YES | YES | YES | 128 | 4K | TOP | 12.4 mm | 8 mm | ||||||||||||||||||||||
| Mfr Part No SST39VF040-70-4C-N | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EN25F20A-104XIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | EON SILICON SOLUTION INC | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, HALOGEN FREE, ROHS AND REACH COMPLIANT, USON-8 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | 1 | 0.5 mm | unknown | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 256KX8 | 0.6 mm | 8 | 2097152 bit | SERIAL | FLASH | 2.7 V | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||
 | Mfr Part No SST39VF800A-90-4C-B3KE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TFBGA | 6 X 8 MM, LEAD FREE, 0.80 MM PITCH, MO-210AB-1, TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 512KX16 | 1.2 mm | 16 | 0.00002 A | 8388608 bit | PARALLEL | FLASH | 2.7 V | YES | YES | YES | 256 | 2K | YES | 8 mm | 6 mm | |||||||||||||||||||
 | Mfr Part No AM27C2048-150PC | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 55 ns | SPANSION INC | 131072 words | 64000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 40 | R-PDIP-T40 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.03 mA | 64KX8 | 5.715 mm | 8 | 524288 bit | PARALLEL | OTP ROM | 52.32 mm | 15.24 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No GD25Q128EWIG | GigaDevice Semiconductor (Beijing) Inc | Datasheet | 8000 | - | Min: 1 Mult: 1 | YES | 8 | 133 MHz | GIGADEVICE SEMICONDUCTOR INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | WSON-8 | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Contact Manufacturer | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | 1 | 1.27 mm | unknown | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 16MX8 | 3-STATE | 0.8 mm | 8 | 0.00005 A | 134217728 bit | SERIAL | FLASH | 3.3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 6 mm | 5 mm | |||||||||||||||||||||||||
| Mfr Part No PM25LQ016-BCE | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | INTEGRATED SILICON SOLUTION INC | 2097152 words | 2000000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | SQUARE | SMALL OUTLINE | Active | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | S-PDSO-G8 | 3.6 V | AUTOMOTIVE | 2.3 V | SYNCHRONOUS | 2MX8 | 2.16 mm | 8 | 16777216 bit | SERIAL | FLASH | 2.7 V | 5.28 mm | 5.28 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No AT49BV010-12TI | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | ATMEL CORP | 3 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 20 X 8 MM, PLASTIC, MO-142BD, TSOP-32 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.5 mm | compliant | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 1.2 mm | 8 | 0.00005 A | 1048576 bit | PARALLEL | FLASH | 2.7 V | YES | YES | YES | 1,1 | 8K,120K | BOTTOM | 18.4 mm | 8 mm | ||||||||||||||||
| Mfr Part No M29W320ET70ZS6 | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 70 ns | NUMONYX | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA64,8X8,32 | BGA64,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | No | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B64 | Not Qualified | INDUSTRIAL | 0.02 mA | 2MX16 | 16 | 0.0001 A | 33554432 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | TOP | YES | ||||||||||||||||||||||||||||
 | Mfr Part No PA28F016SC-120 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 120 ns | INTEL CORP | 2097152 words | 2000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP44,.63 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | ALSO CAN BE OPERATED IN 4.5V TO 5.5V | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.05 mA | 2MX8 | 3-STATE | 2.95 mm | 8 | 0.00001 A | 16777216 bit | PARALLEL | FLASH | 3.3 V | NO | NO | YES | 32 | 64K | YES | 28.2 mm | 13.3 mm | |||||||||||||||||
| Mfr Part No PM25LV020-100SCE | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 100 MHz | INTEGRATED SILICON SOLUTION INC | 262144 words | 256000 | 105 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1.27 mm | compliant | R-PDSO-G8 | Not Qualified | INDUSTRIAL | 0.03 mA | 256KX8 | 8 | 0.00002 A | 2097152 bit | SERIAL | FLASH | SPI | 200000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||
| Mfr Part No MX25L1675EM2I-10G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | MACRONIX INTERNATIONAL CO LTD | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.200 INCH, HALOGEN FREE AND ROHS COMPLIANT, SOP-8 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | Yes | 3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | CAN BE ORGNISED AS 16 MBIT X 1 | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 2MX8 | 3-STATE | 2.16 mm | 8 | 16777216 bit | SERIAL | FLASH | 2.7 V | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2 | 5.28 mm | 5.23 mm | ||||||||||||||||||||||
 | Mfr Part No NAND02GW3B2DZA6F | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 25000 ns | NUMONYX | 268435456 words | 256000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA63,10X12,32 | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3 V | EAR99 | SLC NAND TYPE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.8 mm | unknown | NOT SPECIFIED | 63 | R-PBGA-B63 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 256MX8 | 1.05 mm | 8 | 0.00005 A | 2147483648 bit | PARALLEL | FLASH | 3 V | NO | NO | YES | 2K | 128K | 2K words | YES | 12 mm | 9.5 mm | |||||||||||||||||
| Mfr Part No K9F6408U0C-FCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 35 ns | SAMSUNG SEMICONDUCTOR INC | 3 | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.71,20 | TSSOP48,.71,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Contact Manufacturer | Yes | 3.3 V | Yes | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | compliant | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.02 mA | 8MX8 | 8 | 0.00005 A | 67108864 bit | PARALLEL | FLASH | NO | NO | YES | 1K | 8K | 512 words | YES | |||||||||||||||||||||||||||||
| Mfr Part No MX27L2000QC-70R | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | MACRONIX INTERNATIONAL CO LTD | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 3.3 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.02 mA | 256KX8 | 3-STATE | 3.55 mm | 8 | 0.00002 A | 2097152 bit | PARALLEL | COMMON | OTP ROM | 14.05 mm | 11.43 mm | |||||||||||||||||||||||||
| Mfr Part No PC28F640P33BF60 | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 60 ns | MICRON TECHNOLOGY INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA-64 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | unknown | R-PBGA-B64 | 3.6 V | INDUSTRIAL | 2.3 V | SYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | BOTTOM | 10 mm | 8 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No AM27S191ALC | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 250 ns | ADVANCED MICRO DEVICES INC | 2048 words | 2000000 | 75 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, LCC32,.45X.55 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | QUAD | NO LEAD | 1 | 1.27 mm | unknown | 32 | R-CQCC-N32 | Not Qualified | 5.25 V | COMMERCIAL EXTENDED | 4.75 V | ASYNCHRONOUS | 0.185 mA | 2MX8 | 3-STATE | 2.54 mm | 8 | 16777216 bit | PARALLEL | OTP ROM CARD | 13.97 mm | 11.43 mm | |||||||||||||||||||||||||||
 | Mfr Part No X76F200P | IC Microsystems Sdn Bhd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 1 MHz | IC MICROSYSTEMS SDN BHD | 3 | 256 words | 256 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | THROUGH-HOLE | 240 | 1 | 2.54 mm | unknown | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | 4.32 mm | 8 | 0.000001 A | 2048 bit | SERIAL | FLASH | 5 V | 100000 Write/Erase Cycles | 10 ms | 100 | SOFTWARE | 10.03 mm | 7.62 mm | ||||||||||||||||||
| Mfr Part No X76F200P | Xicor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 1 MHz | XICOR INC | 256 words | 256 | 70 °C | PLASTIC/EPOXY | DIP | PLASTIC, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | NOR TYPE | TIN LEAD | 100 YEARS DATA RETENTION | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T8 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | 4.32 mm | 8 | 0.000001 A | 2048 bit | SERIAL | FLASH | 5 V | 100000 Write/Erase Cycles | 10 ms | 100 | SOFTWARE | 10.03 mm | 7.62 mm |
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S29PL032J55BFI12
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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PM49FL004T-33VC
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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SST39VF040-70-4C-N
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
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EN25F20A-104XIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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SST39VF800A-90-4C-B3KE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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AM27C2048-150PC
Spansion
Package:Memory - Modules
Price: please inquire
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GD25Q128EWIG
GigaDevice Semiconductor (Beijing) Inc
Package:Memory - Modules
Price: please inquire
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PM25LQ016-BCE
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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AT49BV010-12TI
Atmel Corporation
Package:Memory - Modules
Price: please inquire
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M29W320ET70ZS6
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
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PA28F016SC-120
Intel Corporation
Package:Memory - Modules
Price: please inquire
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PM25LV020-100SCE
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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MX25L1675EM2I-10G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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NAND02GW3B2DZA6F
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
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K9F6408U0C-FCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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MX27L2000QC-70R
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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PC28F640P33BF60
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
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AM27S191ALC
AMD
Package:Memory - Modules
Price: please inquire
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X76F200P
IC Microsystems Sdn Bhd
Package:Memory - Modules
Price: please inquire
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X76F200P
Xicor Inc
Package:Memory - Modules
Price: please inquire