The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
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- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No TN87C64 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 250 ns | INTEL CORP | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | R-PQCC-J32 | Not Qualified | INDUSTRIAL | ASYNCHRONOUS | 0.02 mA | 8KX8 | 3-STATE | 8 | 65536 bit | PARALLEL | COMMON | OTP ROM | |||||||||||||||||||||||||||||||
| Mfr Part No 82S185A/BVA | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | 55 ns | PHILIPS SEMICONDUCTORS | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Transferred | No | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T18 | Not Qualified | MILITARY | 0.16 mA | 2KX4 | 4 | 8192 bit | 38535Q/M;38534H;883B | OTP ROM | ||||||||||||||||||||||||||||||||||||
| Mfr Part No 82S185A/BVA | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | TELEDYNE E2V (UK) LTD | , | Obsolete | EAR99 | 8542.32.00.71 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TMM2464AF | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 200 ns | TOSHIBA CORP | 8192 words | 8000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.5 | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | Active | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G28 | Not Qualified | COMMERCIAL | 8KX8 | 3-STATE | 8 | 65536 bit | COMMON | 12.5 V | ||||||||||||||||||||||||||||||||||||
| Mfr Part No NX25P40VNI | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX25L4005ZMC-15G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 70 MHz | MACRONIX INTERNATIONAL CO LTD | 3 | 524288 words | 512000 | 70 °C | UNSPECIFIED | HVSON | HVSON, SOLCC8,.25 | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | NO LEAD | 1 | 1.27 mm | unknown | 8 | R-XDSO-N8 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | SYNCHRONOUS | 0.015 mA | 512KX8 | 3-STATE | 1 mm | 8 | 0.00001 A | 4194304 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 6 mm | 5 mm | |||||||||||||||||||
| Mfr Part No N25Q064A13EF640 | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 108 MHz | MICRON TECHNOLOGY INC | 8388608 words | 8000000 | PLASTIC/EPOXY | SON | VFDFPN-8 | RECTANGULAR | SMALL OUTLINE | Obsolete | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | 1 | unknown | R-PDSO-N8 | 3.6 V | 2.7 V | SYNCHRONOUS | 8MX8 | 3-STATE | 8 | 67108864 bit | SERIAL | FLASH | 2.7 V | QSPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||
| Mfr Part No R29683ADC | Raytheon Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 120 ns | RAYTHEON SEMICONDUCTOR | 2048 words | 64000 | 70 °C | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-XDIP-T24 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.155 mA | 64KX8 | 8 | 524288 bit | PARALLEL | OTP ROM | |||||||||||||||||||||||||||||||||
| Mfr Part No S29GL512N11TAI020 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 110 ns | SPANSION INC | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142EC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3 V | e0 | No | 3A991.B.1.A | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 32MX16 | 1.2 mm | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | 18.4 mm | 14 mm | |||||||||||
| Mfr Part No S29GL512N11TAI020 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 110 ns | ADVANCED MICRO DEVICES INC | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.09 mA | 32MX16 | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | ||||||||||||||||||||||||||
| Mfr Part No MR27V401DTA | OKI Electric Industry Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 80 ns | OKI ELECTRIC INDUSTRY CO LTD | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP1 | 3 V | EAR99 | 8542.32.00.71 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 512KX8 | 1.2 mm | 8 | 4194304 bit | PARALLEL | OTP ROM | 12.4 mm | 8 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No TC58FVM6B2AFT65 | Toshiba America Electronic Components | Datasheet | 7680 | - | Min: 1 Mult: 1 | YES | 48 | 75 ns | TOSHIBA CORP | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.3 V | ASYNCHRONOUS | 0.07 mA | 4MX16 | 1.2 mm | 16 | 0.00001 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,127 | 8K,64K | 8/16 words | YES | BOTTOM | YES | 18.4 mm | 12 mm | |||||||||||||
| Mfr Part No TC58FVT321FT-70 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | TOSHIBA CORP | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3 V | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 12 mm | ||||||||||||||||||||||||||||||
| Mfr Part No MX25V80066ZNI02-TR | Macronix International Co Ltd | Datasheet | 3535 |
| Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC1764-CD8M | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 2.5 MHz | XILINX INC | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T8 | Not Qualified | MILITARY | 0.01 mA | 64KX1 | 3-STATE | 1 | 0.0005 A | 65536 bit | COMMON | CONFIGURATION MEMORY | |||||||||||||||||||||||||||||||||||
 | Mfr Part No AT27HC642R-45PC | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 45 ns | ATMEL CORP | 8192 words | 8000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 24 | R-PDIP-T24 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.045 mA | 8KX8 | 3-STATE | 5.08 mm | 8 | 0.025 A | 65536 bit | PARALLEL | COMMON | OTP ROM | 32 mm | 7.62 mm | |||||||||||||||||||||||
| Mfr Part No SST39VF020-70-4C-W | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No RC28F640C3TC80 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 80 ns | INTEL CORP | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | USER-SELECTABLE 3V OR 12V VPP; TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.055 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | NO | NO | YES | 8,127 | 4K,32K | TOP | YES | 13 mm | 10 mm | |||||||||||||||
| Mfr Part No AM29LV320ML101REI | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142EC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.08 mA | 2MX16 | 1.2 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 64 | 64K | 4/8 words | YES | BOTTOM/TOP | YES | 18.4 mm | 14 mm | |||||||||||
| Mfr Part No AM29LV320ML101REI | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | MO-142EC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.08 mA | 2MX16 | 1.2 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 64 | 64K | 4/8 words | YES | BOTTOM/TOP | YES | 18.4 mm | 14 mm |
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TN87C64
Intel Corporation
Package:Memory - Modules
Price: please inquire
-
82S185A/BVA
Philips Semiconductors
Package:Memory - Modules
Price: please inquire
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82S185A/BVA
Teledyne e2v
Package:Memory - Modules
Price: please inquire
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TMM2464AF
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
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NX25P40VNI
Conexant Systems Inc
Package:Memory - Modules
Price: please inquire
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MX25L4005ZMC-15G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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N25Q064A13EF640
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
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R29683ADC
Raytheon Semiconductor
Package:Memory - Modules
Price: please inquire
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S29GL512N11TAI020
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL512N11TAI020
AMD
Package:Memory - Modules
Price: please inquire
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MR27V401DTA
OKI Electric Industry Co Ltd
Package:Memory - Modules
Price: please inquire
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TC58FVM6B2AFT65
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
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TC58FVT321FT-70
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
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MX25V80066ZNI02-TR
Macronix International Co Ltd
Package:Memory - Modules
0.476197
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XC1764-CD8M
AMD Xilinx
Package:Memory - Modules
Price: please inquire
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AT27HC642R-45PC
Atmel Corporation
Package:Memory - Modules
Price: please inquire
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SST39VF020-70-4C-W
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
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RC28F640C3TC80
Intel Corporation
Package:Memory - Modules
Price: please inquire
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AM29LV320ML101REI
Spansion
Package:Memory - Modules
Price: please inquire
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AM29LV320ML101REI
AMD
Package:Memory - Modules
Price: please inquire