The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact plating | Package / Case | Surface Mount | Number of pins | Material | Number of Terminals | Access Time-Max | Active Read Current - Max | Backlight voltage | Characteristics | Clamp type | Clock Frequency-Max (fCLK) | Connector | Connector pinout layout | Contacts pitch | Data Retention | Diameter after shrinkage | Diameter before shrinkage | Electrical mounting | Factory Pack Quantity | Fixation | Gross weight | Gross Weight | Ihs Manufacturer | Interface Type | Kind of connector | Maximum Clock Frequency | Maximum Operating Temperature | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting hole mm | Mounting Styles | Name | Nominal current | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Presence and type of backlight | Protection class | Purpose | RoHS | Rohs Code | Row pitch | Shrinkage ratio after shrinkage | Shrinkage temperature | Spatial orientation | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Thickness after shrinkage | Transport Package Size/Quantity | Transport packaging size/quantity | Type of connector | Operating temperature | Packaging | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Color | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Current rating | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Working voltage | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Mode | Supply Current-Max | Access Time | Organization | Output Characteristics | Seated Height-Max | Memory Width | Operating temperature range | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Shrinkage ratio | Serial Bus Type | Shrink temperature | Endurance | Data Retention Time-Min | Write Protection | Rated voltage | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Common Flash Interface | Profile | Saturation Current | Features | Length | Width | Plating thickness | Flammability rating |
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![]() | Mfr Part No 25CS640T-E/Q4B | Microchip Technology | Datasheet | 9 |
| Min: 1 Mult: 1 | UDFN-8 | 3 mA | 200 Year | 5000 | SPI | 20 MHz | + 125 C | - 40 C | SMD/SMT | RoHS Compliant | 5.5 V | 1.8 V | Reel | 64 kbit | 80 ns | 8 k x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EN25F05-75GIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 75 MHz | EON SILICON SOLUTION INC | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.02 mA | 64KX8 | 1.75 mm | 8 | 0.000005 A | 524288 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GLS85VM1032C-M-I-BZYE-ND241 | Greenliant Systems Ltd | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S25FL128POXMFI013 | Spansion | Datasheet | 249 | - | Min: 1 Mult: 1 | YES | 16 | 104 MHz | SPANSION INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | Yes | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1.27 mm | compliant | 40 | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 0.026 mA | 16MX8 | 8 | 0.00002 A | 134217728 bit | SERIAL | FLASH | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SST49LF040A-33-4C-NH | Silicon Storage Technology | Datasheet | 6 | - | Min: 1 Mult: 1 | YES | 32 | 11 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 85 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | 3.3 V | EAR99 | 120 NANO SECOND ACCESS TIME IN PARALLEL PROGRAMMING MODE | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | OTHER | 3 V | SYNCHRONOUS | 512KX8 | 3.55 mm | 8 | 4194304 bit | PARALLEL | FLASH | 3 V | 13.97 mm | 11.43 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CY7C225-40LMB | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 30 ns | CYPRESS SEMICONDUCTOR CORP | 512 words | 512 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, LCC28,.45SQ | LCC28,.45SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | No | 5 V | e0 | No | EAR99 | TIN LEAD | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS | 8542.32.00.71 | QUAD | NO LEAD | 1 | 1.27 mm | not_compliant | 28 | S-CQCC-N28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | 0.12 mA | 512X8 | 3-STATE | 8 | 0.12 A | 4096 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | OTP ROM | 13.5 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EN25P20-50GIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | EON SILICON SOLUTION INC | Obsolete | EAR99 | 8542.32.00.51 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC1765ELPC2OC | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | 2.5 MHz | XILINX INC | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Transferred | No | 3.3 V | EAR99 | 8542.32.00.71 | QUAD | J BEND | 1.27 mm | not_compliant | S-PQCC-J20 | Not Qualified | COMMERCIAL | 0.005 mA | 64KX1 | 3-STATE | 1 | 0.00005 A | 65536 bit | COMMON | CONFIGURATION MEMORY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M29F040B70N6 | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | NUMONYX | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 8 X 20 MM, PLASTIC, TSOP-32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 512KX8 | 1.2 mm | 8 | 4194304 bit | PARALLEL | FLASH | 5 V | 18.4 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CAT28F020NA-12 | Catalyst Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | CATALYST SEMICONDUCTOR INC | 3 | 262144 words | 256000 | 105 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Transferred | QFJ | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 3.55 mm | 8 | 0.00001 A | 2097152 bit | PARALLEL | FLASH | 12 V | 100000 Write/Erase Cycles | NO | NO | YES | 13.97 mm | 11.43 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NAND512W3A2CN6F | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 12000 ns | NUMONYX | 67108864 words | 64000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | Yes | 3 V | EAR99 | SLC NAND TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.015 mA | 64MX8 | 1.2 mm | 8 | 0.00005 A | 536870912 bit | PARALLEL | FLASH | 3 V | NO | NO | YES | 4K | 16K | 512 words | YES | 18.4 mm | 12 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT25SF161B-MHB-T | Dialog Semiconductor GmbH | Datasheet | 7620 |
| Min: 1 Mult: 1 | YES | 8 | 108 MHz | 11.90 | DIALOG SEMICONDUCTOR GMBH | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | UDFN-8 | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | Yes | 3 V | 42*28*18.5/500 | NOR TYPE | DUAL | NO LEAD | 1 | 1.27 mm | unknown | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.02 mA | 2MX8 | 3-STATE | 0.6 mm | 8 | 0.00003 A | 16777216 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 6 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GD25Q40BSIG | ELM Technology Corp | Datasheet | - | - | Min: 1 Mult: 1 | Stainless steel | 12 V | none | 35.00 | ELM TECHNOLOGY CORP | 22 | 1 A | , | Contact Manufacturer | ring, green | IP68 | 42*28*27/20 | EAR99 | 8542.32.00.51 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29GL128N10FFI010 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | Polyolefin | 64 | 100 ns | 1225.00 | ADVANCED MICRO DEVICES INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | GRID ARRAY | Transferred | Yes | 1.0 mm | +80...+120 °C | 0.35 mm | 45*45*47/10 | EAR99 | Non-flame-retardant heat-shrinkable tube | White | 8542.32.00.51 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B64 | Not Qualified | 600 V | INDUSTRIAL | 0.09 mA | 8MX16 | 16 | -55...+125 °C | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 2 : 1 | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | YES | 400 m | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT45DB321E-MHF-Y | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | Polyolefin | 8 | 70 MHz | 1.75 mm | 3.5 mm | 4.70 | MICROCHIP TECHNOLOGY INC | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | 5 X 6 MM, 0.60 MM HEIGHT, GREEN, PLASTIC, MO-229, UDFN-8 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | Yes | 3 V | 0.42 mm | 105*20*16/1000 | e4 | EAR99 | NOR TYPE | NICKEL PALLADIUM GOLD | red | 8542.32.00.51 | DUAL | NO LEAD | 1 | 1.27 mm | compliant | R-PDSO-N8 | 600 V | 3.6 V | INDUSTRIAL | 2.3 V | SYNCHRONOUS | 32MX1 | 0.6 mm | 1 | -55...+125 °C | 33554432 bit | SERIAL | FLASH | 2.7 V | 2 : 1 | +80...+120 °C | 1 | 6 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT45DB321E-MHF-Y | Atmel Corporation | Datasheet | 8000 | - | Min: 1 Mult: 1 | YES | steel | 8 | clamp width H - 270 mm; clamp depth B - 100 mm | screw clamp | 70 MHz | 2485.00 | ATMEL CORP | G-shaped clamp 270 mm | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | 5 X 6 MM, 0.60 MM HEIGHT, GREEN, PLASTIC, MO-229, UDFN-8 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | SON | for wood and metal | Yes | 3 V | 42*28*18.5/10 | e4 | EAR99 | NOR TYPE | NICKEL PALLADIUM GOLD | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.3 V | SYNCHRONOUS | 32MX1 | 0.6 mm | 1 | 33554432 bit | SERIAL | FLASH | 2.7 V | 1 | body with stiffening ribs | 6 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NAND01GW3B2CZA6 | STMicroelectronics | Datasheet | 16000 | - | Min: 1 Mult: 1 | YES | 63 | 35 ns | STMICROELECTRONICS | 134217728 words | 128000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | No | 3 V | e0 | EAR99 | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 63 | R-PBGA-B63 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 128MX8 | 1.05 mm | 8 | 1073741824 bit | PARALLEL | FLASH | 3 V | 12 mm | 9.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W25Q256JVEIN | Winbond Electronics Corp | Datasheet | 16000 |
| Min: 1 Mult: 1 | gold-plated | 20 | socket | 1x20 | 2.54mm | SMT | 1.2 g | WINBOND ELECTRONICS CORP | female | Active | Yes | straight | pin strips | -40...163°C | compliant | 1.5A | FLASH | 60V | beryllium copper | 0.254µm | UL94V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No THGBMJG7C2LBAB8 | KIOXIA | Datasheet | 521 | - | Min: 1 Mult: 1 | gold-plated | YES | 48 | socket | 2x24 | 2.54mm | THT | 3.96 g | KIOXIA HOLDINGS CORP | female | 17179869184 words | 16000000000 | 105 °C | -40 °C | TFBGA-153 | RECTANGULAR | Active | 2.54mm | straight | pin strips | -40...163°C | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | unknown | 1.5A | R-PBGA-B | 3.6 V | INDUSTRIAL | 2.7 V | 16GX8 | 1.2 mm | 8 | 137438953472 bit | AEC-Q100 | FLASH CARD | 60V | beryllium copper | 13 mm | 11.5 mm | 0.75µm | UL94V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W25X40CVUXBG | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | YES | 56 | 8 | 80 MHz | socket | 2x28 | 2.54mm | THT | 4.63 g | WINBOND ELECTRONICS CORP | female | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Yes | 2.54mm | straight | 3 V | pin strips | -40...163°C | EAR99 | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | 1.5A | NOT SPECIFIED | R-PDSO-N8 | 3.6 V | INDUSTRIAL | 2.6 V | SYNCHRONOUS | 512KX8 | 3-STATE | 0.6 mm | 8 | 4194304 bit | AEC-Q100 | SERIAL | FLASH | 3 V | 60V | beryllium copper | 3 mm | 2 mm | 0.75µm | UL94V-0 |
25CS640T-E/Q4B
Microchip Technology
Package:Memory - Modules
1.140059
EN25F05-75GIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
GLS85VM1032C-M-I-BZYE-ND241
Greenliant Systems Ltd
Package:Memory - Modules
Price: please inquire
S25FL128POXMFI013
Spansion
Package:Memory - Modules
Price: please inquire
SST49LF040A-33-4C-NH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
CY7C225-40LMB
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
EN25P20-50GIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
XC1765ELPC2OC
AMD Xilinx
Package:Memory - Modules
Price: please inquire
M29F040B70N6
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
CAT28F020NA-12
Catalyst Semiconductor
Package:Memory - Modules
Price: please inquire
NAND512W3A2CN6F
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
AT25SF161B-MHB-T
Dialog Semiconductor GmbH
Package:Memory - Modules
0.714485
GD25Q40BSIG
ELM Technology Corp
Package:Memory - Modules
Price: please inquire
S29GL128N10FFI010
AMD
Package:Memory - Modules
Price: please inquire
AT45DB321E-MHF-Y
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
AT45DB321E-MHF-Y
Atmel Corporation
Package:Memory - Modules
Price: please inquire
NAND01GW3B2CZA6
STMicroelectronics
Package:Memory - Modules
Price: please inquire
W25Q256JVEIN
Winbond Electronics Corp
Package:Memory - Modules
4.245364
THGBMJG7C2LBAB8
KIOXIA
Package:Memory - Modules
Price: please inquire
W25X40CVUXBG
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
