The category is 'Memory - Modules'
Memory - Modules (5402)
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- Reach Compliance Code
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency (fc) | Clock Frequency-Max (fCLK) | Date Of Intro | Dimensions | I/O | Ihs Manufacturer | Interface Type | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Operating Temperature | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Voltage | Memory Size | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Temperature | Length | Width |
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![]() | Mfr Part No SST27SF512-70-3C-WH | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | TSOP1 | 8 X 14 MM, MO-142BA, TSOP1-32 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 64KX8 | 1.2 mm | 8 | 0.0001 A | 524288 bit | PARALLEL | FLASH | 12 V | NO | NO | NO | 12.4 mm | 8 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29GL064A90FFIR40 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | ADVANCED MICRO DEVICES INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA64,8X8,40 | BGA64,8X8,40 | SQUARE | GRID ARRAY | Transferred | Yes | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B64 | Not Qualified | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | BOTTOM | YES | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No S29GL064A90FFIR40 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, LEAD FREE, FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | Yes | 3.3 V | e1 | Yes | 3A991.B.1.A | NOR TYPE | TIN SILVER COPPER | ALSO CONFIGURABLE 8M X 8 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | unknown | 40 | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.4 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | BOTTOM | YES | 13 mm | 11 mm | |||||||||||||||||||||||
![]() | Mfr Part No AM29F080-85EC | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 85 ns | SPANSION INC | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | TSOP | 5 V | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 1 | unknown | 40 | R-PDSO-G40 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 1MX8 | 8 | 8388608 bit | PARALLEL | FLASH | 5 V | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM29F080-85EC | AMD | Datasheet | 305 | - | Min: 1 Mult: 1 | YES | 40 | 85 ns | ADVANCED MICRO DEVICES INC | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP40,.8,20 | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 100K WRITE/ERASE CYCLES MIN | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 40 | R-PDSO-G40 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.04 mA | 1MX8 | 3-STATE | 1.2 mm | 8 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 5 V | YES | YES | YES | 16 | 64K | YES | 18.4 mm | 10 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No MX29GL512FHMI-10Q | Macronix International Co Ltd | Datasheet | 140 | - | Min: 1 Mult: 1 | YES | 70 | 100 ns | MACRONIX INTERNATIONAL CO LTD | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSOP, | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | Yes | 3 V | e3 | EAR99 | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.8 mm | unknown | R-PDSO-G70 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 32MX16 | 3.05 mm | 16 | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | 28.5 mm | 12.6 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MX27L4000PC-20 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 200 ns | MACRONIX INTERNATIONAL CO LTD | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 3 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 32 | R-PDIP-T32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 512KX8 | 3-STATE | 4.9 mm | 8 | 0.00005 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | 41.91 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SST29VF040-55-4I-NHE | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | MICROCHIP TECHNOLOGY INC | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, MS-016AE, LCC-32 | RECTANGULAR | CHIP CARRIER | Active | QFJ | Yes | 3 V | e3 | Yes | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | compliant | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 512KX8 | 3.55 mm | 8 | 4194304 bit | PARALLEL | FLASH | 2.7 V | 13.97 mm | 11.43 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W25Q16JWSSJQ | Winbond Electronics Corp | Datasheet | 4000 | - | Min: 1 Mult: 1 | YES | 8 | 133 MHz | 2019-12-13 | WINBOND ELECTRONICS CORP | 2097152 words | 2000000 | 105 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | SMALL OUTLINE | Active | Yes | 1.8 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | NOT SPECIFIED | S-PDSO-G8 | 1.95 V | 1.65 V | SYNCHRONOUS | 0.018 mA | 2MX8 | 3-STATE | 2.16 mm | 8 | 0.00006 A | 16777216 bit | SERIAL | FLASH | 1.8 V | QSPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 5.23 mm | 5.23 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PM25LV010-33SCE | Programmable Microelectronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 33 MHz | PROGRAMMABLE MICROELECTRONICS CORP | 131072 words | 128000 | 85 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G8 | Not Qualified | OTHER | 0.03 mA | 128KX8 | 8 | 0.00005 A | 1048576 bit | SERIAL | FLASH | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K9F4G08U0D-SCB0T | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 25 ns | SAMSUNG SEMICONDUCTOR INC | 536870912 words | 512000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | EAR99 | SLC NAND TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | compliant | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.03 mA | 512MX8 | 8 | 0.00005 A | 4294967296 bit | PARALLEL | FLASH | NO | NO | YES | 4K | 128K | 2K words | YES | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CSNP1GCR01-BOW | Creat Storage World | Datasheet | - | - | Min: 1 Mult: 1 | 50MHz | Tray | true | -30℃~+85℃ | 2.7V~3.6V | 1Gbit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W25Q16CVTCIP | Winbond Electronics Corp | Datasheet | 3072 | - | Min: 1 Mult: 1 | YES | 24 | 80 MHz | WINBOND ELECTRONICS CORP | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | 8 X 6 MM, GREEN, TFBGA-24 | BGA24,4X6,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | unknown | 24 | R-PBGA-B24 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 2MX8 | 3-STATE | 1.2 mm | 8 | 0.000005 A | 16777216 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 8 mm | 6 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GLS85LS1002A-M-I-FZJE | Greenliant Systems Ltd | Datasheet | - | - | Min: 1 Mult: 1 | GREENLIANT SYSTEMS LTD | , | Contact Manufacturer | EAR99 | MLC NAND TYPE | 8542.32.00.51 | compliant | FLASH | 3.3 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS25WP064A-QBLA3 | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 133 MHz | INTEGRATED SILICON SOLUTION INC | 8388608 words | 8000000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | SQUARE | SMALL OUTLINE | Active | 1.8 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 250 | 1 | 1.27 mm | unknown | 30 | S-PDSO-G8 | 1.95 V | AUTOMOTIVE | 1.65 V | SYNCHRONOUS | 8MX8 | 3-STATE | 2.16 mm | 8 | 67108864 bit | AEC-Q100 | SERIAL | FLASH | 1.8 V | QSPI | 20 | HARDWARE/SOFTWARE | 5.28 mm | 5.28 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EN25QH128A-104HIP | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | SQUARE | SMALL OUTLINE | Contact Manufacturer | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | S-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 16MX8 | 2.2 mm | 8 | 134217728 bit | SERIAL | FLASH | 2.7 V | 5.275 mm | 5.275 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EN25Q64-104FIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 104 MHz | EON SILICON SOLUTION INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Transferred | 3 V | EAR99 | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G16 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 8MX8 | 2.65 mm | 8 | 67108864 bit | SERIAL | FLASH | 3 V | 10.3 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No THGBMJG6C1LBAB7 | Toshiba America Electronic Components | Datasheet | 24 | - | Min: 1 Mult: 1 | YES | 153 | 52 MHz | 2019-04-18 | TOSHIBA CORP | 8589934592 words | 8000000000 | 105 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA-153 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | 3.3 V | EAR99 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.5 mm | unknown | R-PBGA-B153 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 8GX8 | 1 mm | 8 | 68719476736 bit | AEC-Q100 | PARALLEL | FLASH MODULE | 3.3 V | 13 mm | 11.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W631GU6NB11I | Winbond | Datasheet | 100 |
| Min: 1 Mult: 1 | 7.5X13mm2 | 16BIT | DDR3 SDRAM | VFBGA - 96 | 933 / 1066MHz | 1.283 ~ 1.45V | 1Gb | -40 ~ 95˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W631GU6NB12I | Winbond | Datasheet | 2400 |
| Min: 1 Mult: 1 | 7.5X13mm2 | 16BIT | DDR3 SDRAM | VFBGA - 96 | 933 / 1066MHz | 1.283 ~ 1.45V | 1Gb | -40 ~ 95˚C |
SST27SF512-70-3C-WH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
S29GL064A90FFIR40
AMD
Package:Memory - Modules
Price: please inquire
S29GL064A90FFIR40
Spansion
Package:Memory - Modules
Price: please inquire
AM29F080-85EC
Spansion
Package:Memory - Modules
Price: please inquire
AM29F080-85EC
AMD
Package:Memory - Modules
Price: please inquire
MX29GL512FHMI-10Q
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
MX27L4000PC-20
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
SST29VF040-55-4I-NHE
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
W25Q16JWSSJQ
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
PM25LV010-33SCE
Programmable Microelectronics Corp
Package:Memory - Modules
Price: please inquire
K9F4G08U0D-SCB0T
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
CSNP1GCR01-BOW
Creat Storage World
Package:Memory - Modules
Price: please inquire
W25Q16CVTCIP
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
GLS85LS1002A-M-I-FZJE
Greenliant Systems Ltd
Package:Memory - Modules
Price: please inquire
IS25WP064A-QBLA3
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
EN25QH128A-104HIP
Elite Semiconductor Memory Technology Inc
Package:Memory - Modules
Price: please inquire
EN25Q64-104FIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
THGBMJG6C1LBAB7
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
W631GU6NB11I
Winbond
Package:Memory - Modules
3.406329
W631GU6NB12I
Winbond
Package:Memory - Modules
3.626206
