The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Active Read Current - Max | Clock Frequency-Max (fCLK) | Data Retention | Factory Pack Quantity | Ihs Manufacturer | Interface Type | Maximum Clock Frequency | Maximum Operating Temperature | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Packaging | JESD-609 Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Mode | Supply Current-Max | Access Time | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No THGAFBG9T23BAB8 | KIOXIA | Datasheet | - | - | Min: 1 Mult: 1 | KIOXIA HOLDINGS CORP | PACKAGE | Active | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY27C256-200JI | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 200 ns | CYPRESS SEMICONDUCTOR CORP | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | 5 V | EAR99 | 8542.32.00.71 | QUAD | J BEND | 1 | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 32KX8 | 3-STATE | 8 | 262144 bit | PARALLEL | OTP ROM | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S25FL032P0XMFA001 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | 104 MHz | CYPRESS SEMICONDUCTOR CORP | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP-16 | RECTANGULAR | SMALL OUTLINE | Transferred | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G16 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 4MX8 | 3-STATE | 2.65 mm | 8 | 33554432 bit | AEC-Q100 | SERIAL | FLASH | 3 V | 10.3 mm | 7.5 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX25UM51345GXDI00/TRAY | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M90TFIR1 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | ADVANCED MICRO DEVICES INC | Obsolete | EAR99 | 8542.32.00.51 | unknown | FLASH | 3 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M90TFIR1 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | YES | 18.4 mm | 14 mm | |||||||||||||||||||||||||||
| Mfr Part No S29GL064M90TFIR1 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 90 ns | INFINEON TECHNOLOGIES AG | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | 3.3 V | e3 | NOR TYPE | MATTE TIN | IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | BOTTOM/TOP | YES | 18.4 mm | 14 mm | ||||||||||||||||||||||||||||
| Mfr Part No TH58BVG3S0HBAI6 | KIOXIA | Datasheet | - | - | Min: 1 Mult: 1 | YES | 67 | 25 ns | KIOXIA HOLDINGS CORP | 1073741824 words | 1000000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | BGA67,8X10,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Yes | 3.3 V | EAR99 | NAND TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | R-PBGA-B67 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 1GX8 | 3-STATE | 1 mm | 8 | 0.0001 A | 8589934592 bit | SERIAL | FLASH | 3.3 V | 0.000025 ms | HARDWARE | 8 mm | 6.5 mm | ||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 25CS640T-E/Q4B | Microchip Technology | Datasheet | 9 |
| Min: 1 Mult: 1 | UDFN-8 | 3 mA | 200 Year | 5000 | SPI | 20 MHz | + 125 C | - 40 C | SMD/SMT | RoHS Compliant | 5.5 V | 1.8 V | Reel | 64 kbit | 80 ns | 8 k x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MSM27C802CZ-NGS-K | OKI Electric Industry Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 80 ns | OKI ELECTRIC INDUSTRY CO LTD | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 5 V | EAR99 | 8542.32.00.71 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 1MX8 | 3.1 mm | 8 | 8388608 bit | PARALLEL | OTP ROM | 16 | 28.15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M27C4001-12N1 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 100 ns | STMICROELECTRONICS | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | 8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | Yes | 5 V | e3 | EAR99 | TIN | 8542.32.00.71 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 512KX8 | 3-STATE | 1.2 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | 18.4 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL256N10FFIV20 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 100 ns | SPANSION INC | 3 | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 11 MM, 1MM PITCH, LEAD FREE, FBGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | Yes | 3 V | e1 | EAR99 | NOR TYPE | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 40 | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 16MX16 | 3-STATE | 1.4 mm | 16 | 0.000005 A | 268435456 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 256 | 128K | 8/16 words | YES | YES | 13 mm | 11 mm | |||||||||||||||||||||||||
| Mfr Part No S29GL256N10FFIV20 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 100 ns | ADVANCED MICRO DEVICES INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | GRID ARRAY | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | unknown | S-PBGA-B64 | Not Qualified | INDUSTRIAL | ASYNCHRONOUS | 0.07 mA | 16MX16 | 3-STATE | 16 | 0.000005 A | 268435456 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 256 | 128K | 8/16 words | YES | YES | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TN87C64 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 250 ns | INTEL CORP | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | R-PQCC-J32 | Not Qualified | INDUSTRIAL | ASYNCHRONOUS | 0.02 mA | 8KX8 | 3-STATE | 8 | 65536 bit | PARALLEL | COMMON | OTP ROM | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 82S185A/BVA | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | 55 ns | PHILIPS SEMICONDUCTORS | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Transferred | No | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T18 | Not Qualified | MILITARY | 0.16 mA | 2KX4 | 4 | 8192 bit | 38535Q/M;38534H;883B | OTP ROM | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 82S185A/BVA | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | TELEDYNE E2V (UK) LTD | , | Obsolete | EAR99 | 8542.32.00.71 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TMM2464AF | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 200 ns | TOSHIBA CORP | 8192 words | 8000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.5 | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | Active | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G28 | Not Qualified | COMMERCIAL | 8KX8 | 3-STATE | 8 | 65536 bit | COMMON | 12.5 V | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NX25P40VNI | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX25L4005ZMC-15G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 70 MHz | MACRONIX INTERNATIONAL CO LTD | 3 | 524288 words | 512000 | 70 °C | UNSPECIFIED | HVSON | HVSON, SOLCC8,.25 | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | NO LEAD | 1 | 1.27 mm | unknown | 8 | R-XDSO-N8 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | SYNCHRONOUS | 0.015 mA | 512KX8 | 3-STATE | 1 mm | 8 | 0.00001 A | 4194304 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 6 mm | 5 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No N25Q064A13EF640 | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 108 MHz | MICRON TECHNOLOGY INC | 8388608 words | 8000000 | PLASTIC/EPOXY | SON | VFDFPN-8 | RECTANGULAR | SMALL OUTLINE | Obsolete | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | NO LEAD | 1 | unknown | R-PDSO-N8 | 3.6 V | 2.7 V | SYNCHRONOUS | 8MX8 | 3-STATE | 8 | 67108864 bit | SERIAL | FLASH | 2.7 V | QSPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE |
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THGAFBG9T23BAB8
KIOXIA
Package:Memory - Modules
Price: please inquire
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CY27C256-200JI
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S25FL032P0XMFA001
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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MX25UM51345GXDI00/TRAY
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL064M90TFIR1
AMD
Package:Memory - Modules
Price: please inquire
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S29GL064M90TFIR1
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S29GL064M90TFIR1
Infineon Technologies AG
Package:Memory - Modules
Price: please inquire
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TH58BVG3S0HBAI6
KIOXIA
Package:Memory - Modules
Price: please inquire
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25CS640T-E/Q4B
Microchip Technology
Package:Memory - Modules
1.140059
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MSM27C802CZ-NGS-K
OKI Electric Industry Co Ltd
Package:Memory - Modules
Price: please inquire
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M27C4001-12N1
STMicroelectronics
Package:Memory - Modules
Price: please inquire
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S29GL256N10FFIV20
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL256N10FFIV20
AMD
Package:Memory - Modules
Price: please inquire
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TN87C64
Intel Corporation
Package:Memory - Modules
Price: please inquire
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82S185A/BVA
Philips Semiconductors
Package:Memory - Modules
Price: please inquire
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82S185A/BVA
Teledyne e2v
Package:Memory - Modules
Price: please inquire
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TMM2464AF
Toshiba America Electronic Components
Package:Memory - Modules
Price: please inquire
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NX25P40VNI
Conexant Systems Inc
Package:Memory - Modules
Price: please inquire
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MX25L4005ZMC-15G
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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N25Q064A13EF640
Micron Technology Inc
Package:Memory - Modules
Price: please inquire