The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Active Read Current - Max | Clock Frequency-Max (fCLK) | Data Retention | Factory Pack Quantity | Ihs Manufacturer | Interface Type | Maximum Clock Frequency | Maximum Operating Temperature | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Packaging | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Mode | Supply Current-Max | Access Time | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No XC1764-CD8M | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 2.5 MHz | XILINX INC | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T8 | Not Qualified | MILITARY | 0.01 mA | 64KX1 | 3-STATE | 1 | 0.0005 A | 65536 bit | COMMON | CONFIGURATION MEMORY | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AT27HC642R-45PC | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 45 ns | ATMEL CORP | 8192 words | 8000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 24 | R-PDIP-T24 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.045 mA | 8KX8 | 3-STATE | 5.08 mm | 8 | 0.025 A | 65536 bit | PARALLEL | COMMON | OTP ROM | 32 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SST39VF020-70-4C-W | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No RC28F640C3TC80 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 80 ns | INTEL CORP | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA-64 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | USER-SELECTABLE 3V OR 12V VPP; TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.055 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | NO | NO | YES | 8,127 | 4K,32K | TOP | YES | 13 mm | 10 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No S29AL016J70BFA020 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | CYPRESS SEMICONDUCTOR CORP | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.8 mm | compliant | NOT SPECIFIED | R-PBGA-B48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 1MX16 | 1 mm | 16 | 16777216 bit | AEC-Q100 | PARALLEL | FLASH | 3 V | 8 | BOTTOM | 8.15 mm | 6.15 mm | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M28F512-15C6 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 15 ns | STMICROELECTRONICS | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 10K ERASE/PROGRAM CYCLES | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | not_compliant | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 64KX8 | 3-STATE | 3.56 mm | 8 | 0.0001 A | 524288 bit | PARALLEL | FLASH | 12 V | 10000 Write/Erase Cycles | NO | NO | YES | 13.995 mm | 11.455 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No MX25V1606FZNI03/TRAY | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SDINBDA2-16G | Western Digital Corp | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No MX27C1000TC-12 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | MACRONIX INTERNATIONAL CO LTD | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP32,.8,20 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 128KX8 | 3-STATE | 1.2 mm | 8 | 0.0001 A | 1048576 bit | PARALLEL | COMMON | OTP ROM | 18.4 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M10TAIR1 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 0.5 mm | not_compliant | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | YES | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M10TAIR1 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | YES | 18.4 mm | 14 mm | ||||||||||||||||||||||||||||||
 | Mfr Part No 25CS640T-H/ST | Microchip Technology | Datasheet | 2211 |
| Min: 1 Mult: 1 | TSSOP-8 | 5 mA | 200 Year | 2500 | SPI | 20 MHz | + 150 C | - 40 C | SMD/SMT | 5.5 V | 2.5 V | Reel | 2.5 V to 5.5 V | 64 kbit | 8 k x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 25CS640T-I/Q4B | Microchip Technology | Datasheet | 4424 |
| Min: 1 Mult: 1 | UDFN-8 | 3 mA | 200 Year | 5000 | SPI | 20 MHz | + 85 C | - 40 C | SMD/SMT | RoHS Compliant | 5.5 V | 1.7 V | Reel | 64 kbit | 80 ns | 8 k x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S25FL128POXMFI013 | Spansion | Datasheet | 249 | - | Min: 1 Mult: 1 | YES | 16 | 104 MHz | SPANSION INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | Yes | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 260 | 1.27 mm | compliant | 40 | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 0.026 mA | 16MX8 | 8 | 0.00002 A | 134217728 bit | SERIAL | FLASH | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SST49LF040A-33-4C-NH | Silicon Storage Technology | Datasheet | 6 | - | Min: 1 Mult: 1 | YES | 32 | 11 ns | SILICON STORAGE TECHNOLOGY INC | 524288 words | 512000 | 85 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | 3.3 V | EAR99 | 120 NANO SECOND ACCESS TIME IN PARALLEL PROGRAMMING MODE | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | OTHER | 3 V | SYNCHRONOUS | 512KX8 | 3.55 mm | 8 | 4194304 bit | PARALLEL | FLASH | 3 V | 13.97 mm | 11.43 mm | |||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No CY7C225-40LMB | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 30 ns | CYPRESS SEMICONDUCTOR CORP | 512 words | 512 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, LCC28,.45SQ | LCC28,.45SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | No | 5 V | e0 | No | EAR99 | TIN LEAD | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS | 8542.32.00.71 | QUAD | NO LEAD | 1 | 1.27 mm | not_compliant | 28 | S-CQCC-N28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | SYNCHRONOUS | 0.12 mA | 512X8 | 3-STATE | 8 | 0.12 A | 4096 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | OTP ROM | 13.5 V | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No EN25P20-50GIP | Eon Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | EON SILICON SOLUTION INC | Obsolete | EAR99 | 8542.32.00.51 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC1765ELPC2OC | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | 2.5 MHz | XILINX INC | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC20,.4SQ | SQUARE | CHIP CARRIER | Transferred | No | 3.3 V | EAR99 | 8542.32.00.71 | QUAD | J BEND | 1.27 mm | not_compliant | S-PQCC-J20 | Not Qualified | COMMERCIAL | 0.005 mA | 64KX1 | 3-STATE | 1 | 0.00005 A | 65536 bit | COMMON | CONFIGURATION MEMORY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PM25LD010C-DCER | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 100 MHz | INTEGRATED SILICON SOLUTION INC | 131072 words | 128000 | 105 °C | -40 °C | PLASTIC/EPOXY | TSSOP | , | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | compliant | R-PDSO-G8 | 3.6 V | 2.7 V | SYNCHRONOUS | 0.015 mA | 128KX8 | 3-STATE | 8 | 0.003 A | 1048576 bit | SERIAL | FLASH | SPI | 200000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M58LW032D90ZA1Q | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | STMICROELECTRONICS | 2097152 words | 2000000 | 70 °C | PLASTIC/EPOXY | TBGA | 10 X 13 MM, 1 MM PITCH, TBGA-64 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | unknown | 64 | R-PBGA-B64 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | 13 mm | 10 mm |
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XC1764-CD8M
AMD Xilinx
Package:Memory - Modules
Price: please inquire
-
AT27HC642R-45PC
Atmel Corporation
Package:Memory - Modules
Price: please inquire
-
SST39VF020-70-4C-W
Microchip Technology Inc
Package:Memory - Modules
Price: please inquire
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RC28F640C3TC80
Intel Corporation
Package:Memory - Modules
Price: please inquire
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S29AL016J70BFA020
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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M28F512-15C6
STMicroelectronics
Package:Memory - Modules
Price: please inquire
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MX25V1606FZNI03/TRAY
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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SDINBDA2-16G
Western Digital Corp
Package:Memory - Modules
Price: please inquire
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MX27C1000TC-12
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL064M10TAIR1
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL064M10TAIR1
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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25CS640T-H/ST
Microchip Technology
Package:Memory - Modules
0.704724
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25CS640T-I/Q4B
Microchip Technology
Package:Memory - Modules
0.512737
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S25FL128POXMFI013
Spansion
Package:Memory - Modules
Price: please inquire
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SST49LF040A-33-4C-NH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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CY7C225-40LMB
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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EN25P20-50GIP
Eon Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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XC1765ELPC2OC
AMD Xilinx
Package:Memory - Modules
Price: please inquire
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PM25LD010C-DCER
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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M58LW032D90ZA1Q
STMicroelectronics
Package:Memory - Modules
Price: please inquire