Memory - Modules (5402)

-

-

Min: 1

Mult: 1

YES

56

110 ns

CYPRESS SEMICONDUCTOR CORP

3

4194304 words

4000000

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP, TSSOP56,.8,20

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Transferred

Yes

3.3 V

e3

EAR99

NOR TYPE

MATTE TIN

IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE

8542.32.00.51

DUAL

GULL WING

260

1

0.5 mm

compliant

40

R-PDSO-G56

Not Qualified

3.6 V

INDUSTRIAL

3 V

ASYNCHRONOUS

0.06 mA

4MX16

1.2 mm

16

0.000005 A

67108864 bit

PARALLEL

FLASH

3 V

8

YES

YES

YES

128

64K

4/8 words

YES

YES

18.4 mm

14 mm

-

-

Min: 1

Mult: 1

YES

8

100 MHz

INTEGRATED SILICON SOLUTION INC

262144 words

256000

105 °C

-40 °C

PLASTIC/EPOXY

TSOP

TSOP, TSOP8,.25

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

Active

EAR99

NOR TYPE

8542.32.00.51

DUAL

GULL WING

1.27 mm

compliant

R-PDSO-G8

Not Qualified

INDUSTRIAL

0.015 mA

256KX8

8

0.00001 A

2097152 bit

SERIAL

FLASH

SPI

200000 Write/Erase Cycles

20

HARDWARE/SOFTWARE

760000
In Stock

-

Min: 1

Mult: 1

YES

8

104 MHz

WINBOND ELECTRONICS CORP

65536 words

64000

85 °C

-40 °C

PLASTIC/EPOXY

VSOP

VSOP, TSOP8,.25

TSOP8,.25

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

Not Recommended

SOIC

Yes

3 V

EAR99

NOR TYPE

8542.32.00.51

DUAL

GULL WING

1

1.27 mm

compliant

8

R-PDSO-G8

Not Qualified

3.6 V

2.3 V

SYNCHRONOUS

0.012 mA

64KX8

3-STATE

0.9 mm

8

0.00005 A

524288 bit

SERIAL

FLASH

3 V

SPI

100000 Write/Erase Cycles

20

HARDWARE/SOFTWARE

4.9 mm

3.9 mm

-

-

Min: 1

Mult: 1

NO

24

95 ns

RAYTHEON SEMICONDUCTOR

8192 words

8000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

Obsolete

No

5 V

e0

TIN LEAD

POWER-SWITCHED PROM

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-CDIP-T24

Not Qualified

5.5 V

MILITARY

4.5 V

ASYNCHRONOUS

0.19 mA

8KX8

8

65536 bit

38535Q/M;38534H;883B

PARALLEL

OTP ROM

-

-

Min: 1

Mult: 1

NO

24

95 ns

TELEDYNE E2V (UK) LTD

8192 words

8000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP, DIP24,.3

DIP24,.3

RECTANGULAR

IN-LINE

Active

No

5 V

EAR99

LG-MAX

8542.32.00.71

DUAL

THROUGH-HOLE

1

2.54 mm

compliant

R-CDIP-T24

Not Qualified

5.5 V

MILITARY

4.5 V

ASYNCHRONOUS

0.19 mA

8KX8

5.08 mm

8

65536 bit

MIL-STD-883 Class B

PARALLEL

OTP ROM

32.51 mm

7.62 mm

14430
In Stock

• 1: $0.559751
• 10: $0.528067
• 100: $0.498177
• 500: $0.469978
View all price

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

YES

24

75 MHz

NUMONYX

8388608 words

8000000

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

TBGA, BGA24,5X5,40

BGA24,5X5,40

RECTANGULAR

GRID ARRAY

Transferred

BGA

Yes

3 V

EAR99

NOR TYPE

8542.32.00.51

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

unknown

NOT SPECIFIED

24

R-PBGA-B24

Not Qualified

3.6 V

INDUSTRIAL

2.7 V

SYNCHRONOUS

0.015 mA

8MX8

1.2 mm

8

0.00001 A

67108864 bit

SERIAL

FLASH

2.7 V

SPI

100000 Write/Erase Cycles

15 ms

HARDWARE/SOFTWARE

8 mm

6 mm

-

-

Min: 1

Mult: 1

YES

48

90 ns

STMICROELECTRONICS

131072 words

128000

70 °C

PLASTIC/EPOXY

TSSOP

12 X 20 MM, PLASTIC, TSOP-48

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Transferred

TSOP

Yes

5 V

e3/e6

EAR99

NOR TYPE

TIN/TIN BISMUTH

BOTTOM BOOT BLOCK

8542.32.00.51

DUAL

GULL WING

260

1

0.5 mm

unknown

NOT SPECIFIED

48

R-PDSO-G48

Not Qualified

5.5 V

COMMERCIAL

4.5 V

ASYNCHRONOUS

0.02 mA

128KX16

1.2 mm

16

0.0001 A

2097152 bit

PARALLEL

FLASH

5 V

100000 Write/Erase Cycles

8

YES

YES

YES

1,2,1,3

16K,8K,32K,64K

YES

BOTTOM

18.4 mm

12 mm

-

-

Min: 1

Mult: 1

YES

48

90 ns

NUMONYX

131072 words

128000

70 °C

PLASTIC/EPOXY

TSSOP

12 X 20 MM, PLASTIC, TSOP-48

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Obsolete

TSOP

5 V

e3/e6

EAR99

NOR TYPE

TIN/TIN BISMUTH

8542.32.00.51

DUAL

GULL WING

260

1

0.5 mm

unknown

NOT SPECIFIED

48

R-PDSO-G48

Not Qualified

5.5 V

COMMERCIAL

4.5 V

ASYNCHRONOUS

128KX16

1.2 mm

16

2097152 bit

PARALLEL

FLASH

5 V

8

BOTTOM

18.4 mm

12 mm

-

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

YES

48

90 ns

ATMEL CORP

3

524288 words

512000

70 °C

PLASTIC/EPOXY

TSOP1

TSOP1, TSSOP48,.8,20

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

Obsolete

TSOP1

No

5 V

e0

EAR99

NOR TYPE

TIN LEAD

8542.32.00.51

DUAL

GULL WING

1

0.5 mm

compliant

48

R-PDSO-G48

Not Qualified

5.5 V

COMMERCIAL

4.5 V

ASYNCHRONOUS

0.09 mA

512KX16

1.2 mm

16

0.0003 A

8388608 bit

PARALLEL

FLASH

5 V

YES

YES

YES

3,1

8K,488K

TOP

18.4 mm

12 mm

-

-

Min: 1

Mult: 1

YES

48

90 ns

CYPRESS SEMICONDUCTOR CORP

3

262144 words

256000

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

FBGA-48

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Obsolete

No

3 V

e0

EAR99

NOR TYPE

TIN LEAD

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

8542.32.00.51

BOTTOM

BALL

260

1

0.8 mm

compliant

R-PBGA-B48

3.6 V

INDUSTRIAL

2.7 V

ASYNCHRONOUS

256KX16

1 mm

16

4194304 bit

PARALLEL

FLASH

3 V

8

BOTTOM

8.15 mm

6.15 mm

-

-

Min: 1

Mult: 1

YES

48

90 ns

ADVANCED MICRO DEVICES INC

262144 words

256000

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

FBGA, BGA48,6X8,32

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

Transferred

No

e0

EAR99

NOR TYPE

Tin/Lead (Sn/Pb)

8542.32.00.51

BOTTOM

BALL

0.8 mm

unknown

R-PBGA-B48

Not Qualified

INDUSTRIAL

0.035 mA

256KX16

16

0.000005 A

4194304 bit

PARALLEL

FLASH

1000000 Write/Erase Cycles

8

YES

YES

YES

1,2,1,7

16K,8K,32K,64K

YES

BOTTOM

4800
In Stock

-

Min: 1

Mult: 1

NO

32

90 ns

SILICON STORAGE TECHNOLOGY INC

262144 words

256000

70 °C

PLASTIC/EPOXY

DIP

PLASTIC, MO-015AP, DIP-32

DIP32,.6

RECTANGULAR

IN-LINE

Obsolete

DIP

No

3 V

e0

EAR99

NOR TYPE

Tin/Lead (Sn/Pb)

8542.32.00.51

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

32

R-PDIP-T32

Not Qualified

3.6 V

COMMERCIAL

2.7 V

ASYNCHRONOUS

0.02 mA

256KX8

5.08 mm

8

0.000015 A

2097152 bit

PARALLEL

FLASH

2.7 V

NO

NO

NO

41.91 mm

15.24 mm

-

-

Min: 1

Mult: 1

NO

16

50 ns

ADVANCED MICRO DEVICES INC

32 words

32

125 °C

-55 °C

CERAMIC

DIP

DIP, DIP16,.3

DIP16,.3

RECTANGULAR

IN-LINE

Obsolete

No

5 V

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.71

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T16

Not Qualified

MILITARY

0.115 mA

32X8

8

MIL-STD-883 Class C

MEMORY CIRCUIT

-

-

Min: 1

Mult: 1

NO

24

55 ns

NATIONAL SEMICONDUCTOR CORP

1024 words

1000

70 °C

PLASTIC/EPOXY

DIP

DIP, DIP24,.6

DIP24,.6

RECTANGULAR

IN-LINE

Obsolete

No

5 V

e0

EAR99

TIN LEAD

8542.32.00.71

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-PDIP-T24

Not Qualified

5.25 V

COMMERCIAL

4.75 V

ASYNCHRONOUS

0.17 mA

1KX8

3-STATE

5.334 mm

8

8192 bit

PARALLEL

OTP ROM

31.915 mm

15.24 mm

1606
In Stock

-

Min: 1

Mult: 1

NO

20

65 ns

TEXAS INSTRUMENTS INC

512 words

2000

70 °C

PLASTIC/EPOXY

DIP

DIP, DIP20,.3

DIP20,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

No

5 V

EAR99

8542.32.00.71

DUAL

THROUGH-HOLE

NOT SPECIFIED

1

2.54 mm

not_compliant

NOT SPECIFIED

20

R-PDIP-T20

Not Qualified

COMMERCIAL

ASYNCHRONOUS

0.1 mA

2KX8

5.08 mm

8

16384 bit

PARALLEL

OTP ROM

24.325 mm

7.62 mm

-

-

Min: 1

Mult: 1

-

-

Min: 1

Mult: 1

YES

64

115 ns

ROCHESTER ELECTRONICS LLC

3

4194304 words

4000000

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

LEAD FREE, BGA-64

RECTANGULAR

GRID ARRAY, THIN PROFILE

Active

BGA

3 V

e1

No

TIN SILVER COPPER

BOTTOM

BALL

260

1

1 mm

unknown

15

64

R-PBGA-B64

COMMERCIAL

3.6 V

INDUSTRIAL

2.7 V

ASYNCHRONOUS

4MX16

1.2 mm

16

67108864 bit

PARALLEL

FLASH

2.7 V

8

13 mm

10 mm