The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No SEDC600M/480G | Kingston Technology Company | Datasheet | 1695 |
| Min: 1 Mult: 1 | 4 Weeks, 2 Days | NO | KINGSTON TECHNOLOGY COMPANY INC | 515396075520 words | 480000000000 | 70 °C | UNSPECIFIED | XMA | MODULE | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Active | EAR99 | TLC NAND TYPE | 8542.32.00.51 | UNSPECIFIED | NO LEAD | 1 | unknown | R-XXMA-N | ASYNCHRONOUS | 480GX8 | 8 | 4123168604160 bit | SERIAL | FLASH MODULE | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DM54S387J | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 60 ns | NATIONAL SEMICONDUCTOR CORP | 256 words | 256 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T16 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.13 mA | 256X4 | OPEN-COLLECTOR | 5.08 mm | 4 | 1024 bit | PARALLEL | OTP ROM | 19.43 mm | 7.62 mm | |||||||||||||||||||||||||||
| Mfr Part No DM54S387J | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 60 ns | ROCHESTER ELECTRONICS LLC | 256 words | 256 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | RECTANGULAR | IN-LINE | Active | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T16 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 256X4 | 5.08 mm | 4 | 1024 bit | PARALLEL | OTP ROM | 19.43 mm | 7.62 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No M29DW323DT70ZE6T | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | STMICROELECTRONICS | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | No | 3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | not_compliant | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 2MX16 | 1.2 mm | 16 | 0.0001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | TOP | YES | 8 mm | 6 mm | |||||||||||||
| Mfr Part No M29DW323DT70ZE6T | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | MICRON TECHNOLOGY INC | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | No | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 2MX16 | 1.2 mm | 16 | 0.0001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | TOP | YES | 8 mm | 6 mm | ||||||||||||||||||
| Mfr Part No N82HS321A | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 35 ns | NXP SEMICONDUCTORS | 4096 words | 4000 | PLASTIC/EPOXY | QCCN | QCCN, | UNSPECIFIED | CHIP CARRIER | Obsolete | 5 V | EAR99 | 8542.32.00.71 | QUAD | NO LEAD | 1 | unknown | X-PQCC-N28 | Not Qualified | 5.25 V | 4.75 V | ASYNCHRONOUS | 4KX8 | 8 | 32768 bit | PARALLEL | OTP ROM | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL064M10TFIR20 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | ADVANCED MICRO DEVICES INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | YES | ||||||||||||||||||||||||||||
| Mfr Part No W25Q80DVDAIG | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 104 MHz | WINBOND ELECTRONICS CORP | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Active | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | NOT SPECIFIED | R-PDIP-T8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 1MX8 | 3-STATE | 5.33 mm | 8 | 0.000005 A | 8388608 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 9.27 mm | 7.62 mm | ||||||||||||||||||||
| Mfr Part No GD25Q16BPIG | ELM Technology Corp | Datasheet | - | - | Min: 1 Mult: 1 | ELM TECHNOLOGY CORP | , | Contact Manufacturer | EAR99 | 8542.32.00.51 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MX27C4000QC-10 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 100 ns | MACRONIX INTERNATIONAL CO LTD | 524288 words | 512000 | 70 °C | -10 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 512KX8 | 3-STATE | 3.55 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | 14.05 mm | 11.43 mm | |||||||||||||||||||||||
| Mfr Part No S29GL032M10TAIR2 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | ADVANCED MICRO DEVICES INC | Obsolete | EAR99 | 8542.32.00.51 | unknown | FLASH | 3 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL032M10TAIR2 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 100 ns | SPANSION INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 0.5 mm | not_compliant | R-PDSO-G56 | Not Qualified | INDUSTRIAL | 0.06 mA | 2MX16 | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 64 | 64K | 4/8 words | YES | YES | |||||||||||||||||||||||
 | Mfr Part No MBM29LV160B-12PBT | FUJITSU Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 120 ns | FUJITSU LTD | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | PLASTIC, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | No | 3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | SECTOR ERASE; 100000 PROGRAM/ERASE CYCLES; BOTTOM BOOT; CAN BE ORGANIZED AS 1M X 16 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 1MX16 | 1.2 mm | 16 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,31 | 16K,8K,32K,64K | YES | BOTTOM | YES | 9 mm | 8 mm | |||||||||||||
| Mfr Part No AM29F200BB-55ED | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 55 ns | ADVANCED MICRO DEVICES INC | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 5 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.06 mA | 128KX16 | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | BOTTOM | ||||||||||||||||||||||||||||
 | Mfr Part No AM29F200BB-55ED | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 55 ns | SPANSION INC | 3 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | Yes | 5 V | e3 | EAR99 | NOR TYPE | MATTE TIN | BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 40 | 48 | R-PDSO-G48 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 128KX16 | 1.2 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | BOTTOM | 18.4 mm | 12 mm | |||||||||||
 | Mfr Part No SST27VF020-70-3C-WHE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | Yes | 3 V | e3 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 24 | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 256KX8 | 1.2 mm | 8 | 2097152 bit | PARALLEL | FLASH | 12 V | 12.4 mm | 8 mm | ||||||||||||||||||||||||||
| Mfr Part No S70FL256P0XBHI203 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 104 MHz | CYPRESS SEMICONDUCTOR CORP | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | 6 X 8 MM, 1 MM PITCH, LOW HALOGEN AND LEAD FREE, BGA-24 | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B24 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.044 mA | 32MX8 | 3-STATE | 1.2 mm | 8 | 0.00002 A | 268435456 bit | SERIAL | FLASH | 3 V | QSPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 8 mm | 6 mm | ||||||||||||||||||||||
 | Mfr Part No S70FL256P0XBHI203 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 104 MHz | SPANSION INC | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA24,5X5,40 | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Transferred | BGA | Yes | 3 V | 3A991.B.1.A | NOR TYPE | 8542.32.00.71 | BOTTOM | BALL | 1 | 1 mm | unknown | 24 | R-PBGA-B24 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.044 mA | 32MX8 | 3-STATE | 1.2 mm | 8 | 0.00002 A | 268435456 bit | SERIAL | FLASH | 3 V | QSPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 8 mm | 6 mm | ||||||||||||||||||||
| Mfr Part No S29GL128S90FAI020 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL128S90FAI020 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | FBGA-64 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Transferred | No | 3 V | e0 | 3A991.B.1.A | NOR TYPE | TIN LEAD | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B64 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.08 mA | 16MX8 | 1.4 mm | 8 | 134217728 bit | PARALLEL | FLASH | 3 V | 1 | BOTTOM/TOP | 13 mm | 11 mm |
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SEDC600M/480G
Kingston Technology Company
Package:Memory - Modules
201.981905
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DM54S387J
National Semiconductor Corporation
Package:Memory - Modules
Price: please inquire
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DM54S387J
Rochester Electronics LLC
Package:Memory - Modules
Price: please inquire
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M29DW323DT70ZE6T
STMicroelectronics
Package:Memory - Modules
Price: please inquire
-
M29DW323DT70ZE6T
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
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N82HS321A
NXP Semiconductors
Package:Memory - Modules
Price: please inquire
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S29GL064M10TFIR20
AMD
Package:Memory - Modules
Price: please inquire
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W25Q80DVDAIG
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
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GD25Q16BPIG
ELM Technology Corp
Package:Memory - Modules
Price: please inquire
-
MX27C4000QC-10
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL032M10TAIR2
AMD
Package:Memory - Modules
Price: please inquire
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S29GL032M10TAIR2
Spansion
Package:Memory - Modules
Price: please inquire
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MBM29LV160B-12PBT
FUJITSU Limited
Package:Memory - Modules
Price: please inquire
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AM29F200BB-55ED
AMD
Package:Memory - Modules
Price: please inquire
-
AM29F200BB-55ED
Spansion
Package:Memory - Modules
Price: please inquire
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SST27VF020-70-3C-WHE
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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S70FL256P0XBHI203
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S70FL256P0XBHI203
Spansion
Package:Memory - Modules
Price: please inquire
-
S29GL128S90FAI020
Infineon Technologies AG
Package:Memory - Modules
Price: please inquire
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S29GL128S90FAI020
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire