The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
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- Memory IC Type
- Memory Width
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- Memory Density
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No TE28F200B5B80 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 80 ns | INTEL CORP | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | CONFG AS 128K X 16; USER SELECTABLE AS 5V OR 12V VPP; BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.07 mA | 256KX8 | 1.2 mm | 8 | 0.000008 A | 2097152 bit | PARALLEL | FLASH | 5 V | 8 | NO | NO | YES | 1,2,1,1 | 16K,8K,96K,128K | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||
| Mfr Part No CY7C225-25DC | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 20 ns | CYPRESS SEMICONDUCTOR CORP | 512 words | 512 | 70 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 24 | R-GDIP-T24 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | SYNCHRONOUS | 0.09 mA | 512X8 | 3-STATE | 8 | 0.09 A | 4096 bit | PARALLEL | COMMON | OTP ROM | 13.5 V | |||||||||||||||||||||||
 | Mfr Part No DM74S573AJ | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | 45 ns | NATIONAL SEMICONDUCTOR CORP | 1024 words | 1000 | 70 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-GDIP-T18 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.14 mA | 1KX4 | 3-STATE | 5.08 mm | 4 | 4096 bit | PARALLEL | OTP ROM | 7.62 mm | ||||||||||||||||||||||||||
 | Mfr Part No SST36VF1601C-70-4I-B3K | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | SILICON STORAGE TECHNOLOGY INC | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | 6 X 8 MM, MO-210AB-1, TFBGA-48 | BGA48,6X8,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 240 | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.04 mA | 1MX16 | 1.2 mm | 16 | 0.00002 A | 16777216 bit | PARALLEL | FLASH | 2.7 V | 8 | YES | YES | 4,1,31 | 4K,48K,64K | YES | BOTTOM | YES | 8 mm | 6 mm | |||||||||||||||
| Mfr Part No MX25LM51245GMI00/TUBE | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No AM29LV001BB-90JI | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 90 ns | SPANSION INC | 3 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, MO-052AAE, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 3 V | e0 | No | EAR99 | NOR TYPE | TIN LEAD | BOTTOM BOOT BLOCK | 8542.32.00.51 | QUAD | J BEND | 260 | 1 | 1.27 mm | not_compliant | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 128KX8 | 3.556 mm | 8 | 0.000005 A | 1048576 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 1,2,7 | 8K,4K,16K | BOTTOM | 13.97 mm | 11.43 mm | ||||||||||||
| Mfr Part No AM29LV001BB-90JI | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 90 ns | ADVANCED MICRO DEVICES INC | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC32,.5X.6 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Transferred | LCC | No | 3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 128KX8 | 3.556 mm | 8 | 0.000005 A | 1048576 bit | PARALLEL | FLASH | 3 V | 20 | YES | YES | YES | 1,2,7 | 8K,4K,16K | BOTTOM | 13.97 mm | 11.43 mm | ||||||||||||||
| Mfr Part No R29791DM/883B | QP Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R29791DM/883B | Raytheon Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 95 ns | RAYTHEON SEMICONDUCTOR | 8192 words | 8000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-CDIP-T24 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.19 mA | 8KX8 | 8 | 65536 bit | 38535Q/M;38534H;883B | PARALLEL | OTP ROM | ||||||||||||||||||||||||||||||||
| Mfr Part No PM39LV020-70VC | Programmable Microelectronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | PROGRAMMABLE MICROELECTRONICS CORP | 262144 words | 256000 | 85 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP32,.56,20 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | No | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G32 | Not Qualified | OTHER | 0.02 mA | 256KX8 | 8 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | YES | YES | YES | 64 | 4K | |||||||||||||||||||||||||||||
| Mfr Part No PM39LV020-70VC | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | INTEGRATED SILICON SOLUTION INC | 262144 words | 256000 | 85 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP32,.56,20 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | No | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | compliant | R-PDSO-G32 | Not Qualified | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 0.02 mA | 256KX8 | 1.2 mm | 8 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 64 | 4K | 12.4 mm | 8 mm | ||||||||||||||||||||||
 | Mfr Part No PH28F640W18BE60 | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 60 ns | MICRON TECHNOLOGY INC | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | Yes | EAR99 | NOR TYPE | TIN SILVER COPPER | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.75 mm | compliant | 56 | R-PBGA-B56 | Not Qualified | 1.95 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 4MX16 | 1 mm | 16 | 67108864 bit | PARALLEL | FLASH | 1.8 V | BOTTOM | 9 mm | 7.7 mm | ||||||||||||||||||||||
| Mfr Part No PH28F640W18BE60 | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 60 ns | NUMONYX | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 9 X 7.70 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-56 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | BGA | 1.8 V | EAR99 | NOR TYPE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.75 mm | unknown | NOT SPECIFIED | 56 | R-PBGA-B56 | Not Qualified | 1.95 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 4MX16 | 1 mm | 16 | 67108864 bit | PARALLEL | FLASH | 1.8 V | BOTTOM | 9 mm | 7.7 mm | ||||||||||||||||||||||||
 | Mfr Part No AM29LV065DU101REI | AMD | Datasheet | 716 | - | Min: 1 Mult: 1 | YES | 48 | 100 ns | ADVANCED MICRO DEVICES INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.03 mA | 8MX8 | 1.2 mm | 8 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 128 | 64K | YES | YES | 18.4 mm | 12 mm | |||||||||||||||
| Mfr Part No AM29LV065DU101REI | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 100 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.03 mA | 8MX8 | 1.2 mm | 8 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 128 | 64K | YES | YES | 18.4 mm | 12 mm | |||||||||||||
 | Mfr Part No S29CD016J0PQAM11 | Spansion | Datasheet | 161 | - | Min: 1 Mult: 1 | YES | 80 | 54 ns | 66 MHz | SPANSION INC | 524288 words | 512000 | 125 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP80,.7X.9,32 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Transferred | QFP | No | 2.6 V | EAR99 | NOR TYPE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | QUAD | GULL WING | 1 | 0.8 mm | unknown | 80 | R-PQFP-G80 | Not Qualified | 2.75 V | AUTOMOTIVE | 2.5 V | ASYNCHRONOUS | 0.09 mA | 512KX32 | 3.35 mm | 32 | 0.00006 A | 16777216 bit | PARALLEL | FLASH | 2.7 V | 0.000065 ms | YES | YES | YES | 16,30 | 2K,16K | YES | BOTTOM | YES | 20 mm | 14 mm | |||||||||||||
| Mfr Part No AM29F010-70EE | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | SPANSION INC | 3 | 131072 words | 128000 | 125 °C | -55 °C | PLASTIC/EPOXY | TSOP1 | TSOP-32 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | No | 5 V | e0 | 3A001.A.2.C | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 1.2 mm | 8 | 0.0001 A | 1048576 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | YES | YES | YES | 8 | 16K | 18.4 mm | 8 mm | ||||||||||||||
| Mfr Part No S29AL032D90TFI043 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142DD, TSOP-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | 3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||||||||||
| Mfr Part No S29AL032D90TFI043 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | ADVANCED MICRO DEVICES INC | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | INDUSTRIAL | 0.035 mA | 2MX16 | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | BOTTOM | YES | ||||||||||||||||||||||||||
| Mfr Part No KLM8G1GEUF-B04QT59 | Samsung Electronics Co. Ltd | Datasheet | - | - | Min: 1 Mult: 1 |
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TE28F200B5B80
Intel Corporation
Package:Memory - Modules
Price: please inquire
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CY7C225-25DC
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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DM74S573AJ
Texas Instruments
Package:Memory - Modules
Price: please inquire
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SST36VF1601C-70-4I-B3K
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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MX25LM51245GMI00/TUBE
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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AM29LV001BB-90JI
Spansion
Package:Memory - Modules
Price: please inquire
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AM29LV001BB-90JI
AMD
Package:Memory - Modules
Price: please inquire
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R29791DM/883B
QP Semiconductor
Package:Memory - Modules
Price: please inquire
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R29791DM/883B
Raytheon Semiconductor
Package:Memory - Modules
Price: please inquire
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PM39LV020-70VC
Programmable Microelectronics Corp
Package:Memory - Modules
Price: please inquire
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PM39LV020-70VC
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
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PH28F640W18BE60
Micron Technology Inc
Package:Memory - Modules
Price: please inquire
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PH28F640W18BE60
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
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AM29LV065DU101REI
AMD
Package:Memory - Modules
Price: please inquire
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AM29LV065DU101REI
Spansion
Package:Memory - Modules
Price: please inquire
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S29CD016J0PQAM11
Spansion
Package:Memory - Modules
Price: please inquire
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AM29F010-70EE
Spansion
Package:Memory - Modules
Price: please inquire
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S29AL032D90TFI043
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S29AL032D90TFI043
AMD
Package:Memory - Modules
Price: please inquire
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KLM8G1GEUF-B04QT59
Samsung Electronics Co. Ltd
Package:Memory - Modules
Price: please inquire